DLA SMD-5962-93235 REV B-2010 MICROCIRCUIT MEMORY DIGITAL CMOS 256K X 8 BIT EEPROM MONOLITHIC SILICON.pdf

《DLA SMD-5962-93235 REV B-2010 MICROCIRCUIT MEMORY DIGITAL CMOS 256K X 8 BIT EEPROM MONOLITHIC SILICON.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-93235 REV B-2010 MICROCIRCUIT MEMORY DIGITAL CMOS 256K X 8 BIT EEPROM MONOLITHIC SILICON.pdf（20页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Updated boilerplate paragraphs. Added QD certification paragraphs. ksr 05 02 28 Raymond Monnin B Updated body of drawing to reflect current requirements. - glg 101117 Charles Saffle REV SHEET REV B B B B B SHEET 15 16 17 18 19 REV STATUS REV B B

2、B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Gary L. Gross DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 STANDARD MICROCIRCUIT CHECKED BY Jeff Bowling http:/www.dscc.dla.mil DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Mi

3、chael A. Frye MICROCIRCUIT, MEMORY, DIGITAL, CMOS 256K X 8 BIT EEPROM, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 94-03-25 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-93235 SHEET 1 OF 19 DSCC FORM 2233 APR 97 5962-E039-11 Provided by IHSNot for Resal

4、eNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93235 DLA LAND AND MARITIME COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels

5、consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in

6、the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 93235 01 M X A | | | | | | | | | | | | | | | | | | Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing

7、 number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA de

8、signator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function Access time Endurance 01 28F020 (256 K x 8) CMOS EEPROM 200 ns 10000 cycles 02 28F020 (256 K x 8) CMOS EEPROM 150 ns 10000 c

9、ycles 03 28F020 (256 K x 8) CMOS EEPROM 120 ns 10000 cycles 04 28F020 (256 K x 8) CMOS EEPROM 90 ns 10000 cycles 05 28F020A (256 K x 8) CMOS EEPROM 200 ns 100,000 cycles 06 28F020A (256 K x 8) CMOS EEPROM 150 ns 100,000 cycles 07 28F020A (256 K x 8) CMOS EEPROM 120 ns 100,000 cycles 08 28F020A (256

10、K x 8) CMOS EEPROM 90 ns 100,000 cycles 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN

11、class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style U See figure 1 3

12、2 Flat pack X GDIP1-T32 or CDIP2-T32 32 Dual-in-line 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STAND

13、ARD MICROCIRCUIT DRAWING SIZE A 5962-93235 DLA LAND AND MARITIME COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) 2/ -2.0 V dc to +7.0 V dc Storage temperature range (Tstg) -65C to +150C Maximum power dissip

14、ation (PD) 1.0 W Lead temperature (soldering, 10 seconds) . +300C Junction temperature (TJ) 3/ +150C Thermal resistance, junction-to-case (JC) (case outline X) . See MIL-STD-1835 Thermal resistance, junction-to-case (JC) (case outline U) . 27C/W Voltage on any pin with respect to ground 2/ . -2.0 V

15、dc to +7.0 V dc Voltage on pin A9with respect to ground 4/ . -2.0 V dc to +13.5 V dc Vppsupply voltage with respect to ground 4/ -2.0 V dc to +14.0 V dc VCCsupply voltage with respect to ground 2/ . -2.0 V dc to +7.0 V dc Output short circuit current 5/ . 200 mA Data retention . 10 years, minimum En

16、durance (Device types 01-04) 10000 cycles/byte, minimum (Device types 05-08) . 100,000 cycles/byte, minimum 1.4 Recommended operating conditions. 6/ Supply voltage range (VCC) . +4.5 V dc to +5.5 V dc Operating temperature range (Tcase) . -55C to +125C Low level input voltage range (VIL) -0.5 V dc t

17、o +0.8 V dc High level input voltage range (VIH) +2.0 V dc to VCC+0.5 V dc High level input voltage range, CMOS (VIH) VCC-0.5 V dc to VCC+0.5 V dc Chip clear (VP) 11.4 V dc to 12.6 V dc 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, stand

18、ards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for

19、. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Ro

20、bbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Minimum dc voltage on input or VOpins is -0.5 V. During volta

21、ge transitions, inputs may overshoot VSSto -2.0 V for periods of up to 20 ns. Maximum dc voltage on output and VOpins is VCC+0.5 V. During voltage transitions outputs may overshoot to VCC+2.0 V for periods up to 20 ns. 3/ Maximum junction temperature shall not be exceeded except for allowable short

22、duration burn-in screening conditions in accordance with method 5004 of MIL-STD-883. 4/ Minimum dc input voltage on A9or Vppmay overshoot to +14.0 V for periods less than 20 ns. 5/ No more than one output shorted at a time. Duration of short circuit should not be greater than 1 second. 6/ All voltag

23、es are referenced to VSS(ground). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93235 DLA LAND AND MARITIME COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 DEPARTMENT OF DE

24、FENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelp

25、hia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of the documents are the issues of the documents cited in the solicitation. AMERICAN SOCIETY FOR TESTING AND MATERIALS (

26、ASTM) ASTM Standard F1192 - Standard Guide for the Measurement of Single Event Phenomena from Heavy Ion Irradiation of Semiconductor Devices. (Applications for copies of ASTM publications should be addressed to: ASTM International, PO Box C700, 100 Barr Harbor Drive, West Conshohocken, PA 19428-2959

27、; http:/www.astm.org.) ELECTRONICS INDUSTRIES ASSOCIATION (EIA) JEDEC Standard EIA/JESD78 - IC Latch-Up Test. (Applications for copies should be addressed to the Electronics Industries Association, 2500 Wilson Boulevard, Arlington, VA 22201; http:/www.jedec.org.) (Non-Government standards and other

28、publications are normally available from the organizations that prepare or distribute the documents. These documents also may be available in or through libraries or other informational services.) 2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references

29、 cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, ap

30、pendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML

31、 product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or

32、 function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. This drawing has been modified to allow the manufacturer to use the alternate die/fa

33、brication requirements of paragraph A.3.2.2 of MIL-PRF-38535 or other alternative approved by the qualifying activity. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or

34、MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Truth table(s). The truth table(s) shall be as spec

35、ified on figure 3. 3.2.3.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing shall be as specified on figure 3 herein. When required, in screening (see 4.2 herein), or quality conformance inspection groups A, B, C, or D (see 4.4 herein), t

36、he devices shall be programmed by the manufacturer prior to test in a checkerboard or similar pattern (a minimum of 50 percent of the total number of bits programmed). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE

37、 A 5962-93235 DLA LAND AND MARITIME COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 3.2.3.2 Programmed devices. The requirements for supplying programmed devices are not part of this document. 3.2.3.3 Command definitions. The command definitions table shall be as sp

38、ecified on figure 3. 3.2.4 Block diagram. The block diagram shall be as specified on figure 4. 3.2.5 Switching test circuits and waveforms. The switching test circuits and waveforms shall be as specified on figure 5. 3.3 Electrical performance characteristics and postirradiation parameter limits. Un

39、less otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups speci

40、fied in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking

41、of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. Th

42、e compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. For product built in accordance with A.3.2.2 of MIL-PRF-38535, or as modified in the manufacturers QM plan, the “QD” certification mark s

43、hall be used in place of the “Q“ or “QML“ certification mark. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a

44、 certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affir

45、m that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL

46、-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime-VA of change of product (see 6.2 herein) involving device

47、s acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable r

48、equired documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 42 (see MIL-PRF-38535, appendix A). 3.11 Processing of EEPROMs. All testing requirements and quality assurance provisions herein shall be satisfied by the manufacturer prior to delivery. 3.11.1 Conditions of the supplied devices. Devices will be supplied in an unprogrammed or clear state. No provision will be ma