DLA SMD-5962-93150 REV A-1994 MICROCIRCUIT DIGITAL CMOS 96-BIT FLOATING POINT DUAL PORT PROCESSOR MONOLITHIC SILICON《硅单片 96位浮点双口处理器 氧化物半导体数字微型电路》.pdf
《DLA SMD-5962-93150 REV A-1994 MICROCIRCUIT DIGITAL CMOS 96-BIT FLOATING POINT DUAL PORT PROCESSOR MONOLITHIC SILICON《硅单片 96位浮点双口处理器 氧化物半导体数字微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-93150 REV A-1994 MICROCIRCUIT DIGITAL CMOS 96-BIT FLOATING POINT DUAL PORT PROCESSOR MONOLITHIC SILICON《硅单片 96位浮点双口处理器 氧化物半导体数字微型电路》.pdf(54页珍藏版)》请在麦多课文档分享上搜索。
1、ut=IENSE LOGISTICS AGENCY DEFENSE ELECTRONICS SUPPLY CENTER 1507 WIUIINGTON PIKE DAYTON, OH 45444- 5 7 65 IN REPLY DESC-ELDC (Mr. Hess/(AV 986) 513-296-8526/tmh) 28 JUL. 19% REFER TO SUBJECT: Notice of Revision (NOR) 5962-R216-94 for Standardized Military Drawing (SMD) 5962-93150. Military/Industry
2、Distribution The enclosed NOR is approved for use effective as of the date of the NOR. In accordance with MIL-STD-100 SMD holders should, as a minimum, handwrite those changes described in the NOR to sheet 1 of the subject SMD. After completion, the NOR should be attached to the subject SMD for futu
3、re reference. Those companies who were listed as approved sources of supply prior to this action have agreed to actions taken on devices for which they had previously provided DESC a certificate of compliance. This is evidenced by an existing active current certificate of compliance on file at DESC
4、along with a DESC record of verbal coordination. The certificate of compliance for these devices is considered concurrence with the new revision unless DESC is otherwise notified. If you have commente or questions, please contact Tom Hess at (AV)986-8526 /(513)296-8526. 1 Encl Chief, Custom Microele
5、ctronics Branch Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-I 9999996 00554LL LTL I 1. DATE BIOTICE OF REVISION (NOR) lins and inspection. For device class M, salnpling and inspection procedures shall be in accordance uith section 4 of MIL-M-3851
6、0 to the extent specified in MIL-STD-883 (see 3.1 herein). sanpiing and inspection procedures shall be in accordance with MIL-M-38510 and method 5005 of MIL-STD-883, except as modified herein. MIL-1-38535 and the device manufacturers QM plan. For device classes B and S, For device classes Q and V, s
7、anpling and inspection procedures shall be in accordance uith STANDARD1 ZED MILITARY DRAWING SIZE I IA 59 62-93 150 I DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 I 1 REVISION LEVEL SHEET I I I 5 DESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted witho
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