DLA SMD-5962-93112-1994 MICROCIRCUIT DIGITAL CMOS PROGRAMMABLE SKEW CLOCK BUFFER MONOLITHIC SILICON《硅单片 可编程低失真时钟缓冲器 氧化物半导体数字微型电路》.pdf
《DLA SMD-5962-93112-1994 MICROCIRCUIT DIGITAL CMOS PROGRAMMABLE SKEW CLOCK BUFFER MONOLITHIC SILICON《硅单片 可编程低失真时钟缓冲器 氧化物半导体数字微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-93112-1994 MICROCIRCUIT DIGITAL CMOS PROGRAMMABLE SKEW CLOCK BUFFER MONOLITHIC SILICON《硅单片 可编程低失真时钟缓冲器 氧化物半导体数字微型电路》.pdf(20页珍藏版)》请在麦多课文档分享上搜索。
1、LTR I APPROVED DESCRIPTION DATE (YR-MO-DA) I CHECKED BY Monica L. Poelking APPROVED BY Monica L. Poelking DRAWING APPROVAL DATE 94-09-1 3 REVISION LEVEL REV I MICROCIRCUIT, DIGITAL, CMOS, PROGRAMMABLE SKEW CLOCK BUFFER, MONOLITHIC SILICON . SIZE CAGE CODE 5962-93112 A 67268 SHEET 1 OF 19 REV III SHE
2、ET REV STATUS OF SHEETS PMIC NIA STANDARD MICROCIRCUIT DRAHIMG THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A ESC FORM 193 JUL 91 5962-E270-93 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. Provided by IHSNot
3、 for ResaleNo reproduction or networking permitted without license from IHS-,-,-1. SCOPE STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 1.1 Scope. This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two Droduct assuranc
4、e classes consisting of military high reliability (device classes Q and MI and space application (device class VI, and a choice of case outlines and lead finishes are avaiiable and are reflected in the Part or Identifying Number (PIN). 1.2.1 of MIL-STD-883, “Provisions for the use of MIL-STD-883 in
5、conjunction with compliant non-JAN devices“. availabLe, a choice of Radiation Hardness Assurance (RHA) levels are re41ected in the PIN. Device class H microcircuits represent non-JAN class B microcircuits in accordance with When 1.2 PJN. The PIN shall be as shown in the following example: SIZE 5962-
6、93112 A REVISION LEVEL SHEET 5962 - 93112 o1 - I I I I I I Federal stock class designator type designator (See 1.2.1) (See 1.2.2) Devi ce RHA I / N - I I Devi ce class designator (See 1.2.3) X - i Ease outline (See 1.2.4) X - I I 1 Lead finish (see 1.2.5) Drawing number 1.2.1 RHA desianator. Device
7、class il RHA marked devices shall meet the MIL-1-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. MIL-1-38535 specified RHA levels and shall be marked with the appropriate RHA designator. non-RHA device. Device classes (I and V RHA marked devices shall m
8、eet the A dash (-1 indicates a 1.2.2 Device type(s). The device typeCs) shall identify the circuit function as follows: Skew error Device type Generic number Circuit function o1 76992 Programmable skew clock buffer 0.7 ns 1.2.3 Device class designator. The device class designator shall be a single l
9、etter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535 1.2.4 Case outline(
10、s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows: Outline letter X 1.2.5 Lead finish. The lead MIL-1-38535 for classes Q and V. designation is for use in specif without preference. Descriptive designator Termi nah Packaqe style CQCCI-N32 32 Leadless chip carrier inish sh
11、all be as specified in NIL-STD-883 (see 3.1 herein) for class M or cations when lead finishes A, 8, and C are considered acceptable and interchangeable Finish letter “X“ shall not be marked on the microcircuit or its packaging. The “X“ )ESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo reproducti
12、on or networking permitted without license from IHS-,-,-1.3 Absolute maximum ratings. I/ z/ 3/ Supply voltage range (V CN, VCCQ) - - - - - - - - - - - - - OC input voltage range FvIN) - - - - - - - - - - - - - - - Output current into outputs (low) (IoL) - - - - - - - - - - Storage temperature range
13、(TcTG) - - - - - - - - - - - - - Maximum power dissipation (Po) - - - - - - - - - - - - - - Lead temperature (soldering, IO seconds) - - - - - - - - - Thermal resistance, junction-to-case (OJc) - - - - - - - - Junction temperature (TJ) - - - - - - - - - - - - - - - - - 1.1 Recommended operating cond
14、itions. g/ ?/ Supply voltage range (Vc N, VCc$ - - - - - - - - - - - - input voltage range (VI$ - - - - - - - - - - - - - - - - - Output voltage range (V,) - - - - - - - - - - - - - - - - High level input voltage range (VI“, VI“): VI“- VI“ VIL- VILL _-_-_- Mid level input voltage range (VIMM) Low le
15、vel input voltage range (VIL, VILLI: - - - - - - - - - - - Case operating temperature (TC) - - - - - - - - - - - - - - Input rise or fall time (tr, tf): Maximum high levef output current (Io 1 - - - - - - - - - - Maximum low level output current (IoLy - - - - - - - - - - (0.2VCC.to 0.8V c: 0.8Vcc to
16、 0.2Vcc) - - - - - - - - - - 1.5 Diqital logic testing for device classes Q and V. Fault coverage measurement of manufacturing logic tests (MIL-STO-883, test method 5012) - - - - - - -0.5 V dc to +7.0 V dc -0.5 V dc to t7.0 V dC 64 mA -65C to +150“C 911 mW +26O0c See MIL-STD-1835 475C +4.5 V dc to t
17、5.5 V dc 0.0 V dc to VCCQ 0.0 V dc to VCCN Vcca - 1.35 V dc to VCC- VCCQ - 1.W V dc to VCCQ $1 ?/ $1 vCcQ/2 t5O mV dc r/ -0.0 V dc to 1.35 V dc o/ 0.0 V dc to 1.0 V dc s/ $/ -55OC to +12SoC O to 3 ns +46 mA -40 mA XX percent I/ - I/ Stresses above the absolute maximum rating may cause permanent dama
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