DLA SMD-5962-93109-1993 MICROCIRCUIT DIGITAL CMOS HIGH INTEGRATION EMBEDDED PROCESSOR MONOLITHIC SILICON《硅单片 高集成嵌入式处理器 氧化物半导体数字微型电路》.pdf

《DLA SMD-5962-93109-1993 MICROCIRCUIT DIGITAL CMOS HIGH INTEGRATION EMBEDDED PROCESSOR MONOLITHIC SILICON《硅单片 高集成嵌入式处理器 氧化物半导体数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-93109-1993 MICROCIRCUIT DIGITAL CMOS HIGH INTEGRATION EMBEDDED PROCESSOR MONOLITHIC SILICON《硅单片 高集成嵌入式处理器 氧化物半导体数字微型电路》.pdf（24页珍藏版）》请在麦多课文档分享上搜索。

1、SMD-5962-93109 m 9999976 O042085 967 m LTR DESCRIPTION DATE (YR-WO-DA) APPROVED REV I I SIZE A REV STATUS OF SHEETS CAGE CODE 5962-93109 . 67268 PMIC NIA STANDARDIZED MILITARY DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTRENTS AND AGENCIES OF THE DEPARTHENT OF DEFENSE AMSC N/A REV I I I SH

2、EET 123 PREPARED BY Thomas M. Hess CHECKED BY Thomas R. Hess APPROVED BY HoniCa L. Poelking DRAWING APPROVAL DATE 93-05-12 DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 MICROCIRCUIT, DIGITAL, CMOS, HIGH INTEGRATION EMBEDDED PROCESSOR, MONOLITHIC SILICON I I REVISION LEVEL SW-E231-93 DESC FORI

3、 193 JUL 91 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-73L09 W 9999976 0042086 8T3 = 1.1 Scopc. This drawing foras a part of a OM part - one part hr docua

4、entation systr (see 6.6 herein). Tw product assurance classes consisting of military high reliability (device classes B, Q, and NI and space aPFliCation (device classes S and VI, and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Nuibtr (PIN).

5、Device class N aicrocircuits represent non-JAN class B microcircuits in accorance with 1.2.1 of NIL-STD-883, 8Provisions for the use of NIL-STD-883 in conjunction with corpliant nan-JAN devices“. available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. UhCn 1 1.2 &.

6、 The PIN shall be as shown in the following exaqle: utline letter Descriptive desiqnator Terminals Package style I X CffiAS-P88 88 Ceraaic, pin grid array 5962 - 93109 X X I I m I I I N - I I I I I I I Lead Case Devi ce Devi ce II Federal RHA stock class designator type class outline finish designat

7、or (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) I (see 1.2.3) I Drawing nuibtr 1.2.1 RHA designator. Device classes M, B, and S RHA marked devices shall mt the NIL-N-38510 specified RHA levels and shall be narked with the appropriate RHA designator. the NIL-1-38535 specified RHA levels

8、 and shall be aarked with the appropriate RHA designator. non-RHA device. Device classes Q and V RHA marked devices shall mt A dash (-1 indicates a 1.2.2 Device typds). The device typeCs) shall identify the circuit function as follows: Devi ce type Generic nuaber Circuit function o1 o2 03 80C186EB-8

9、 80Cl86EB-13 8OCla6EB-36 High integration embedded processor High integration eibedded processor High integration ccibcdded processor 1.2.3 Device class desipnator. lhe device class designator shail be a single letter identifying the product assurance level as follows: Device class Device requiremen

10、ts documentation N Vendor self-certification to the requirements for non-JAN class B aicrocircuits in accordance with 1.2.1 of MIL-STD-883 1.2.5 Lead finish. The lead finish shall be as specified in MIL-M-38510 for classes M, 8, and S or MIL-1-38535 for classes Q and V. Finish letter “X“ shall not b

11、e marked on the microcircuit or its packaging. for use in specifications when lead finishes A, 8, and C are considered acceptable and interchangeable without preference. The “X“ designation is STANDARD1 ZED I SIZE I 5962-93109 MILITARY DRAWING A I DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444

12、 1 REVISION LEVEL 2 DESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-93I109 m 9999996 O042087 73T m STANDARD1 ZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 1.3 Absolute maximum ratinqs. I/ Sto

13、rage teaperature range . Voltage on any pin with respect to ground . Maximum pouer dissipation (P ) . Lead temperature (soldering 00 seconds) nieraal resistance, junction-to-case (eJc): Casex naxiaum junction temperature Supply voltage with respect to ground range 1.4 Recoridcd ornratiw conditions.

14、Case operating temperature range Supply voltage, Vcc SIZE 5962-93109 A REVISION LEVEL SHEET 1.5 Diaital logic testira for device classes Q and V. -65C to +150c -1.0 V dc to +7.0 V dc -1.0 Y dc to +7.0 V dc 0.5 u mo C Se MIL-STD-1835 150C -55OC to +12SC 4.5 V dc 5 Vcc 5.5 V dc Fault coverage aeasurmn

15、t of manufacturing . 2/ percent logic tests (MIL-STD-883, test method 5012) - I 2. APPLICABLE DCUAENTS 2.1 Government swcifications, standards, bulletin, and handbook. Unless otherwise specified, the following specifications, standards, bulletin, and handbook of the issue listed in that issue of the

16、 Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein. SPECIFICATIONS MILITARY MIL-M-38510 - Microcircuits, General Specification for. MIL-1-38535 - Integrated Circuits, Manufacturing, General Specificat

17、ion for. I STANDARDS MILITARY MIL-STD-480 - Configuration Control-Engineering Changes, Deviations and Waivers. MIL-STD-883 - Test Methods and Procedures for Microelectronics. MIL-STD-1835 - Hicrocircuit Case Outlines. I BULLETIN HILITARY MIL-FMJL-103 - List of Standardized Military Drawings (SnDs).

18、HANDBOOK MILITARY I MIL-HDBK-780 - Standardized Military Drawings. (Copies of the specifications, standards, bulletin, and handbook required by mnufacturers in connection with I specific acquisition functions should be obtained fr& the contracting activity or as directed by the contracting activity.

19、) I I/ Stresses above the absolute aaxiinum rating may cause permanent damage to the device. maximum levels may degrade performance and affect reliability. z/ Values will be added when they become available. Extended operation at the DESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo reproduction

20、 or networking permitted without license from IHS-,-,-SMD-59b2-93L09 9999996 0042088 676 2.2 Order of Drecedmce. In the event of a conflict between the text of this drawing imd the references cited herein, the text of this drawing shall take precedence. 3. REQUIREMENTS 3.1 The individual item requir

21、ements for device class M shall be in accordance with 1.2.1 of MIL-STD-883, “Provisions for the use of MIL-STD-883 in conjunction with colpliant non-JAN devices“ and as specified herein. The individual iter requirements for device classes B and S shall be in accordance with MIL-M-38510 and as specif

22、ied herein. includcd in this SMD. MIL-1-38535, the device manufacturers Qwlity Management (W) plan, and as specified herein. Ita reauirmnts. For device classes E and S, a full electrical characterization table for each device tp shall be The individual item requirements for device classes Q and V sh

23、sll be in accordance with 3.2 Desian, construction, and physical dimensions. The design, construction, and physical dimsions shall be as specified in MIL-M-38510 for device classes M, E, and S and MIL-1-38535 for device classes Q and V and herein. 3.2.1 Case outline(d. The case outline(s) shall be i

24、n accordance with 1.2.4 herein. 3.2.2 Terminal connections. 3.2.3 Block diaram. 3.3 Electrical rmrformance characteristics and postirradiation paramter limits. The terminal connections shall be as specified on figure I. The block diagraa(s) shall be as specified on figure 2. Unless otherwise specifi

25、ed herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating tccpcrature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The

26、electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. Marking for device class M shall be in accordance with MIL-STD-883 (see 3.1 herein). MIL-WL-103. Q and V shall be in accordance with MIL-1-38535. Certification/cocnplia

27、nce nark. In addition, the manufacturers PIN may also be marked as listed in Marking for device classes B and S shall be in accordance with MIL-M-38510. Marking for device classes 3.5.1 The conpliance mark for device class M shall be a “C“ as required in MIL-STD-883 (see 3.1 herein). in MIL-M-38510.

28、 The certification mark for device classes E and S shall be a “J“ or “JAN“ as required The certification mark for device classes Q and V shall be a %I“ as required in MIL-1-38535. 3.6 Certificate of compliance. For device class M, a certificate of compliance shall be required from a mnufacturer in o

29、rder to be listed as an approved swrce of supply in MIL-BU-103 (see 6.7.3 herein). classes Q and V, a certificate of compliance shall be required from a WL-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.7.2 herein). The certificate of conpliance submitted to

30、DESC-EC prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product mts, for device class M, the requirements of MIL-STD-883 (see 3.1 herein), or for device classes Q and V, the requirements of MIL-1-38535 and the requirements herein. For device 3.7

31、Certificate of conformance. A Certificate of conformance as required for device class M in MIL-STO-883 (see 3.1 herein) or device classes B and S in MIL-M-38510 or for device classes Q and V in MIL-1-38535 shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification o

32、f chanqe for device class M. For device class M, notification to DESC-EC of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in MIL-STD-480. 3.9 Verification and review for device class M. For device class M, DESC, DESCs agent, and t

33、he acquiring activity Offshore documentation retain the option to review the manufacturers facility and applicable required documentation. shall be lade available onshore at the option of the reviewer. 3.10 Microcircuit group assiqnntent for device classes M, B. and S. Device classes M, 8, and S dev

34、ices covered by this drawing shall be in microcircuit group number 105 (see MIL-M-38510, appendix E). 3.11 Serialization for device class S. All device class S devices shall be serialized in accordance with MIL-M-38510. STANDARD1 ZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45

35、444 SIZE 5962-93109 A REVISION LEVEL SHEET 4 DESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-59b2-93109 9999996 0042089 502 m Test Input low voltage s/ Input high voltage Input hystcrisis on RESIN Output low voltage Output h

36、igh voltage Input leakage current Output leakage current 4/ See footnotes at end of table. TABLE I. Electrical perforaance characteristics. I Limits I Unit I I I Conditions I/ I Group A !Device I I Synbol I i -55“ s T 5 +1250c i subgroups I type I I I 4.5 v s v, 5 5.5 v I I I I I i unless otherurse

37、specified i I 1 in I Ilax I I I I I I I I I i 1,2,3 i All I -0.5 10.3 Vcc I V I I I 21 I I I 1 I I I 1 I 1 I I I I I I I I 21 I I I 1,2,3 I All 1.7 Vcc IVcc +.5 I V IH I I 1 I I I l I l I I I I l I i I I 1,2,3 I All I 0.5 1 HYS I VOL I IoL = 3.0 MA ! vcc = 4-5 voH I IN = -2.0 laA I vcc = 4.5 v I 1,2

38、,3 I All IVcc -.5 I I I I I I I IV I I ILI i o v v = vcc I v, = ST! v i 1,2,3 i All I I I I i +50 IFU I I j P = CLKIN 1 I I I I I I I I I I iv =ov 1 Pffl = ERROR All -7 - .275 I vcc = 5.5 v i i i i I J I I I I I I I VIN = C i 1,2,3 i All i .275 i 7 i* I PIN = PhEQ I I I I I 1 vcc = 5.5 v i i i i i J

39、 I I I I I I = .N i = Al&NCE I A16-A18, LOCK 1,2,3 i All i -.275 I I I I -5 i IA I I IOV5V dVC I ALL OTHH INPUS i vcc = 5.5 v I +I5 I PA I I I I l I I l l I I IL0 1 .45 v = VIN 5 vcc ! vcc 5.5 v i 1,2,3 i All i -15 i +I5 i ! ! ! ! ! 5962-93109 REVISION LEVEL STANDARDIZED MILITARY DRAWING DEFENSE ELE

40、CTRONICS SUPPLY CENTER DAYTON, OHIO 45444 DESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-93L09 9999996 0042090 224 TABLE I. Electrical mrforwce characteristics - Continued. Conditions I/ I Group A (Device 1 I -55c s TC

41、 S +125“C I subgroups I type I I unless otherwise specified 1 I Vcc = 5.5 V Unit I I I I I I I I I I i Min I I I I I I I I I l 45 I I I I 103 I 190 I I I I I I I I I 1,2,3 I 01 I 102 I 103 I I I I I I I I I I I 12,3 I All I I I I I I I I I I I I See 4.4.1 I I I I I I I I I I See 4.4.1 I I I I I I I

42、I I I I I I I 103 IO 132 I I I I I I l I I I 21 I I I I I I I 9,10,11 I O1 I 62.5 I I ns I I I 02 138.34 I I I O3 I 31.25 I I I I vcc = 4.5 v I I I I I I I I I I I I I 9,10,11 I O1 I 15 I I nt l I I I 02 I 12 I I I vcc = 4.5 v I 103 110 1 I I I I I I I I I I 9,10,11 I O1 I 15 I I ns I I I vcc = 4.5

43、v I l o3 I 10 I I I I I I I I I I I 9,10,11 I All I 1 I 8 I ns I I I 1 vcc = 4.5 v I l I I I I I I I I I I 9,10,11 I All I 1 I 8 I ns I I I I See figure 3 I I I I I 1 Limits rest I Syibol I U8X I 4.5 v s vcc = 5.5 v I I I 173 I * I 1,2,3 I M I 5/ I I I 102 I Supply current cold (RESET) I ICC - I 31

44、163 1100 I w I 15 148 j * Supply current idle $1 I II, I Vcc = 5.5 V Supply current power dam I/ I pD I Vcc = 5.5 V I pF I I I Input capacitance I CIN I Frequency = 1 HHz 14 Input/output capacitance I Cg I Frquency = 1 MHz 14 I All I Functionel test I I See 4.4.lb I 7,8 I All I 1 I 15 I PF I I I I 9

45、,10,11 I O1 I O 16 I NHZ CLKIN frequency I tF I I I I I O2 I O I 26.08 I CLKIN period I tC I See figure 3 1 tCH Ij CLKIN high tim ce igure 3 CLKIN low tim t I L“+gure 3 I lm 112 I I CLKIN rise tim 2/ 1 tCR I See figure 3 CLKIN fall time 2/ I tCF I vcc = 4.5 v See footnotes at end of table. STANDARDI

46、ZED 5962-93109 MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CETER DAYTO, OHIO 45444 DESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-TABLE 1. Electrical rnrformnce characteristics - Continued. Unit I I I l I I I -55OC S TC S +12So

47、C 1 subgroups I type I I I I 4.5 v s vcc s 5.5 v I I I I I I I I I I I I I I vcc = 4.5 v I 102 IO 123 I I I I 103 IO lm I I I I I I I 9,10,11 I All I I 2*tC I ns I I CWT period It I I I I I I I I Limits Conditions I/ I Group A IDevice Test I s-1 I IlaX I I Min I I unless otherwise srncified 1 I 9,10

48、,11 I M I O I 27 I nr CLKIN to CLKWT delay I tCD I see figure 3 STANDARD1 ZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER I L J I I I I SIZE 5962-93109 A I I I I I tPH I CLKWT high time I 1 l I I tPL I I I CLKOUT lou time I I I I I tPR I CLKOUT rise time I I I tPF / I CLKOUT fall time I I ALE

49、, S2:0,DEN,DT/R,BHE, I I LOCK, A19:16 I I - 8/ I I 1 I GCSO: 7, LCS, UCS, NC9, I I RD,UR I I 9 I I l I BHE, DEN, LOCK, RESOUT, I I HLDA, TOOUT,IOUT,A19: 16 I I CLKWT high to output valid I tCWV1 I CLKOUT high to output valid I tCHOV2 I CLKWT LOU to output valid I tCLOV1 I I I RD,WR,GCS:,LCS,UCS, I I ADIS:O,NCS, INTAI :O, S2: O I I I I I RD,UR,BHE,DT/R,LOCK, I I 52 :O, A9: 16 I I 21 I I CLKWT Lou to output valid I tCLOV