DLA SMD-5962-90564 REV E-2013 MICROCIRCUIT DIGITAL CHMOS SINGLE-CHIP 8-BIT MICROCONTROLLER WITH 16K BYTES OF EPROM PROGRAM MEMORY MONOLITHIC SILICON.pdf
《DLA SMD-5962-90564 REV E-2013 MICROCIRCUIT DIGITAL CHMOS SINGLE-CHIP 8-BIT MICROCONTROLLER WITH 16K BYTES OF EPROM PROGRAM MEMORY MONOLITHIC SILICON.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-90564 REV E-2013 MICROCIRCUIT DIGITAL CHMOS SINGLE-CHIP 8-BIT MICROCONTROLLER WITH 16K BYTES OF EPROM PROGRAM MEMORY MONOLITHIC SILICON.pdf(27页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device types 03 and 04. Add case outline M. Add VIL2and VIH2to table I. Add block diagram for device types 03 and 04. Editorial changes throughout. 92-07-09 Monica L. Poelking B Add new programming configuration to figure 7. Changes to table
2、I. Editorial changes throughout. 93-04-19 Monica L. Poelking C Add device types 05 and 06. Editorial changes throughout. 94-09-14 Monica L. Poelking D Update boilerplate to MIL-PRF-38535 requirements. - CFS 06-05-17 Thomas M. Hess E Update boilerplate to current MIL-PRF-38535 requirements. - PHN 13-
3、07-17 Thomas M. Hess REV SHEET REV E E E E E E E E E E E E SHEET 15 16 17 18 19 20 21 22 23 24 25 26 REV STATUS REV E E E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Jeffery Tunstall DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmari
4、time.dla.mil STANDARD MICROCIRCUIT DRAWING CHECKED BY Thomas M. Hess THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking MICROCIRCUIT, DIGITAL, CHMOS, SINGLE-CHIP, 8-BIT MICROCONTROLLER WITH 16K BYTES OF AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE
5、91-20-11 EPROM PROGRAM MEMORY, MONOLITHIC SILICON AMSC N/A REVISION LEVEL SIZE A CAGE CODE 67268 5962-90564 E SHEET 1 OF 26 DSCC FORM 2233 APR 97 5962-E482-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-9
6、0564 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Numb
7、er (PIN). The complete PIN is as shown in the following example: 5962-90564 01 M X Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01
8、 87C51FB-12 High performance CHMOS single-chip 8-bit microcontroller 02 87C51FB-16 High performance CHMOS single-chip 8-bit microcontroller 03 87C654 High performance CHMOS single-chip 8-bit microcontroller 04 87C654-16 High performance CHMOS single-chip 8-bit microcontroller 05 87C654 High performa
9、nce CHMOS single-chip 8-bit microcontroller with 16K bytes of one time programmable EPROM memory (3.5 to 12 MHz) 06 87C654-16 High performance CHMOS single-chip 8-bit microcontroller with 16K bytes of one time programmable EPROM memory (3.5 to 16 MHz) 1.2.2 Case outline(s). The case outline(s) are a
10、s designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style M GQCC1-J44 or CQCC2-J44 44 “J” lead chip carrier 1/ T See figure 1 44 “J” lead chip carrier 1/ U CQCC1-N44 44 Square leadless chip carrier 1/ X GDIP1-T40 or CDIP2-T40 40 Dual-in-line 1/ Z See
11、figure 1 44 Gullwing lead chip carrier 1/ 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Storage temperature range . -65C to +150C Voltage on EA/VPPpin to VSSrange 0 V to +13.0 V Voltage on any other pin to VSSrange . -0.5 V to +6.5 V M
12、aximum IOLper I/O pin 15 mA Maximum power dissipation (PD) 1.5 W 2/ Lead temperature (soldering, 10 seconds) +265C Thermal resistance, junction-to-case (JC): Cases M, U, and X . See MIL-STD-1835 Cases T and Z . 14C/W Data retention 10 years _ 1/ For device types 01, 02, 03, and 04, lid shall be tran
13、sparent to permit ultraviolet light erasure. 2/ Based on package heat transfer limitations, not device power consumption. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90564 DLA LAND AND MARITIME COLUMBUS,
14、OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Supply voltage (VCC) . 4.5 V dc to 5.5 V dc Case operating temperature range (TC) -55C to +125C 3/ 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specif
15、ication, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Spe
16、cification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings
17、. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the tex
18、t of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be
19、in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to M
20、IL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifica
21、tions shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimension
22、s. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.
23、2.3 Block diagram. The functional block diagram shall be as specified on figure 3. 3.2.4 Timing waveforms and test circuit. The timing waveforms and test circuit shall be as specified on figure 4. _ 3/ Case temperatures are “instant on”. Provided by IHSNot for ResaleNo reproduction or networking per
24、mitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90564 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics
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