DLA SMD-5962-90512-1992 MICROCIRCUIT DIGITAL HMOS 8-BIT MICROCOMPUTER MONOLITHIC SILICON《硅单片 8位微型电子计算机 高性能金属氧化物半导体数字微型电路》.pdf

《DLA SMD-5962-90512-1992 MICROCIRCUIT DIGITAL HMOS 8-BIT MICROCOMPUTER MONOLITHIC SILICON《硅单片 8位微型电子计算机 高性能金属氧化物半导体数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-90512-1992 MICROCIRCUIT DIGITAL HMOS 8-BIT MICROCOMPUTER MONOLITHIC SILICON《硅单片 8位微型电子计算机 高性能金属氧化物半导体数字微型电路》.pdf（24页珍藏版）》请在麦多课文档分享上搜索。

1、SMD-5962-905L2 9999996 0033474 93T LTR DESCRIPTION DATE (YR-MO-DA) APPROVED -+lt SHEET SHEET 15 16 17 PMIC NIA CHECKED BY Thomas M. Hess APPROVED BY Monica L. Poelking STADARDIXED MILITARY DRAWING MICROCIRCUIT, DIGITAL, HMOS, 8-BIT MICROCOMPUTER, MONOLITHIC SILICON THIS DRAWING IS AVAILABLE FOR USE

2、BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CAGE CODE 67268 AMSC NfA 5962-90512 PREPARED BY Wanda L. Meadows DEFENSE ELECTRONICS SUPPLY CENTER I DAYTON, OHIO 45444 DRAWING APPROVAL DATE 92-12-07 I SIZE REVISIN LEVEL r SHEET 1 OF 23 )ESC FORM 193 JUL 91 DISTRIBUTION STATEMENT A. Appr

3、oved for public rcleasc; distribution is unlimited. 59624558-92 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-1. SCOPE STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER 1.1 Scope. This drawing forms a part of a one part - one part num

4、ber documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes 6, 61, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Nu

5、mber (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, “Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices“. available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

6、When 1.2 m. The PIN shall be as shown in the following example: SIZE 5962-90512 A 5962 - 90512 o1 - I l I I I I RHA Federal Devi ce M - I I Q - 1 I X I I L Lead Case L Devi ce stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (se

7、e 1.2.3) / Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. Device classes A, 6, and S RHA marked devices shall meet the Device classes Q and V RHA MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. marked devices shall meet the MIL-1-38535 s

8、pecified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device typeW. The device type(s) shall identify the circuit function as follows: Device type Generic number Circuit function o1 8748H 8-bit microcomputer 1.2.3 Device class desig

9、nator. The device class designator shall be a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 6 or S Certificatio

10、n and qualification to MIL-M-38510 Q or V Ccrti f ication and qualification to HIL-1-38535 1.2.4 Case outlineW. The case outline(s) shall be as designated in HIL-STD-1835 and as follows: Outline letter Descriptive desiqnator Terminals Package style Q GDIPl-T4 or CDIP2-140 40 Dua 1-i n- 1 i ne 1.2.5

11、Lead finish. The lead finish shall be as specified in MIL-M-38510 for classes M, 8, and S or MIL-1-38535 for classes Q and V. Finish letter “X“ shall not be marked on the microcircuit or its packaging. for use in specifications when lead finishes A, 6, and C are considered acceptable and interchange

12、able without preference. The “X“ designation is DAYTON, OHIO 45444 I REVISION LEVEL SHEET I 2 DESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-70512 m 9999996 O033476 792 STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS

13、 SUPPLY CENTER 1.3 Absolute maximum ratin. I/ Voltage range on any pin (except V 1 (with respect to ground) . -0.5 V dc to +7.0 V dc Program voltage (V 1 . +21.5 V dc maximum PP 1.0 U Maximum power diss8ation (PD) Storage temperature range . -65C to +15OoC Junction temperature (T 1 . +165C Thermal r

14、esistance (OJ$ Lead temperature (soldering, 10 seconds) . +3WC 1.4 Recommended operatinci conditions. Power supply voltage range tVcc) Program voltage range (V 1 20.5 V dc to 21.5 V dc Case operating temperatu% range (TC) 1.5 Digital lwic testing for device classes P and V. Fault coverage measuremen

15、t of manufacturing . See MIL-STD-1835 . 4.5 V dc to 5.5 V dc . -55C to +125“C logic tests (MIL-STD-883, test method 5012) . XX percent 2/ 2. APPLICABLE DOCUMENTS 2.1 Government specifications, standards, bulletin, and handbook. Unless otherwise specified, the following specifications, standards, bul

16、letin, and handbook of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein. SIZE 5962-90512 A SPECIFICATIONS MILITARY MI L-M-3851 O - Microcircuits, General Specifi

17、cation for. MIL-1-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS MILITARY MIL-STD-480 - Configuration Control-Engineering Changes, Deviations and Waivers. MIL-STD-883 - Test Methods and Procedures for Microelectronics. MIL-STD-1835 - Microcircuit Case Outlines. BULL

18、ETIN MILITARY MIL-EUL-103 - List of Standardized Military Drawings (SMDs). HANDBOOK MILITARY MIL-HDBK-780 - Standardized Military Drawings. (Copies of the specifications, standards, bulletin, and handbook required by manufacturers in connection with specific acquisition functions should be obtained

19、from the contracting activity or as directed by the contracting activity.) herein, the text of this drawing shall take precedence. 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited - I/ Stresses above the absolute maximum rating may cause p

20、ermanent damage to the device. maximum levels may degrade performance and affect reliability. - 21 Values will be added when they become available. Extended operation at the DAYTON, OHIO 45444 I REVISION LEVEL SHEET I 3 DESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo reproduction or networking

21、 permitted without license from IHS-,-,-SMD-59b2-905L2 = 9999996 0033477 629 = STANDARDIZED SIZE MILITARY DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 REVISION LEVEL 3. REQUIREMENTS 3.1 The individual item requirements for device class M shall be in accordance with 1.2.1 of ?IL-STD

22、-883, “Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices“ and as specified nerein. The individual item requirements for device classes B and S shall be in accordance with MIL-M-38510 and as specified herein. included in this SMD. YIL-1-38535, the device manufacturer

23、s Quality Management (QN) plan, and as specified herein. Item requirements. For device classes B and S, a full electrical characterization table for each device type shall be The individual item requirements for device classes Q and V shall be in accordance with 3.2 Desian, construction, and physica

24、l dimensions. The design, construction, and physical dimensions shall be as specified in MIL-M-38510 for device classes M, 9, and S and MIL-1-38535 for device classes Q and V and herein. 3.2.1 Case autline(s). The case outline(s) shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections.

25、3.2.3 Block diaqram. 3.2.4 Fault coverage. The terminal connections shall be as specified on figure 1. The block diagram shall be as specified on figure 2. For classes B and S, the manufacturing level logic test vectors shall be graded for fault The coverage using a fault simulator. The resulting fa

26、ult coverage shall be available to the qualifying activity. fault coverage shall be measured and reported in accordance with MIL-STD-883, test method 5012. between methods used for fault coverage and reporting, and test method 5012 shall be noted and approved by the qualifying activity. Any differen

27、ces 3.2.5 Radiation exposure circuit. 3.3 The radiation exposure circuit shall be specified when available. Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits

28、are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Markinq. The part shall be

29、marked with the PIN listed in 1.2 herein. Marking for device class M shall be in accordance with MIL-STD-883 (see 3.1 herein). MIL-BUL-103. Q and V shall be in accordance with MIL-1-38535. Certification/conwliance mark. In addition, the manufacturers PIN my also be marked as listed in Harking for de

30、vice classes B and S shall be in accordance with MIL-M-38510. Marking for device classes 3.5.1 The compliance mark for device class M shall be a “C“ as required in MIL-STD-883 (see 3.1 herein). in MIL-M-38510. The certification mark for device classes B and S shall be a “J“ or “JAN“ as required The

31、certification mark for device classes Q and V shall be a “QML“ as required in MIL-1-38535. 3.6 Certificate of compliance. For device class il, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-BUL-103 (see 6.7.3 herein). cl

32、asses Q and V, a certificate of compliance shall be required from a QAL-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.7.2 herein). listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device class M

33、the requirements of MIL-STO-883 (see 3.1 herein), or for device classes Q and V, the requirements of MIL-1-38535 and the requirements herein. For device The certificate of compliance submitted to DESC-ECC prior to 3.7 Certificate of conformance. A certificate of conformance as required for device cl

34、ass A in MIL-STD-883 (see 3.1 herein) or device classes B and S in MIL-M-38510 or for device classes Q and V in MIL-1-38535 shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of chanqe for device class M. (see 6.2 herein) involving devices acquired to this d

35、rawing ia required for any change as defined in MIL-STD-480. For device class M, notification to DESC-ECC of change of product 3.9 Verification and review for device class M. For device class M, DESC, DESCs agent, and the acquiring activity retain the option to review the manufacturers facility and

36、applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit wow assignment for device classes H, B. and S. Device classes M, 9, and S devices covered by this drawing shall be in microcircuit group number 105 (see MIL-M-38

37、510, appendix E). 5962-90512 SHEET 4 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5762-70512 9999996 0033478 5b5 I i TABLE I. Electrical performance characteristics. I I I I I I Conditions IGroup A IDevice I Limits I Unit -55C I TC d +125“C Is

38、ubgroups I type I I 4.5 v I vcc I 5.5 v I I - 4.5 v = VDD d 5.5 v I I I I I I I I I I unless otherwise specified I/ I I I I I I I I I I Test I Min I Max I vss 7 o v I I I I l I I I I I l I I I I Input low ege I VIL I vcc = 4.5 v (except RESET, l I I XTALI, XTAL2) I I I I l I I I I i I Inp-w voltage,

39、 I VIL1 (RESET, XTALI, I I XTAL2) I I (except RESET, I I XTALI , XTAL2) I I I I IH I Input high voltage, STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 I I SIZE 5962-90512 A REVISION LEVEL SHEET 5 Inpcgh voltage, i IH1 (RESET, XTALI , I 1 I I I 11 I I I I I I I I

40、I I I 21 I I I I I I I l l I I 1,2,3 I O1 I 2.0 I 5.5 I V I I I I I 1,2,3 I O1 I 3.8 I 5.5 I V I I I l I I I I I I Output low voltage i VOL2 i (PROG) I I IoL = 1.0 mA i 1,2,3 i O1 i i 0.45i V I I I I I I i I l l I l I I I I I OutMt highdtage I OH1 I (RD, WR, PSEN, ALE) I I I l Output high voltage VO

41、H2 I (all other outputs) I I IOH = -400PA i 1,2,3 i O1 i 2.4 i iv I I I I I I I I I I I IIoH = -40 PA I 1,2,3 I O1 1 2.4 I IV I I I I I I I I l I I IV lIOH = -1M3 PA I 1,2,3 I O1 I 2.4 I I I I I l I l -1 I- I i 1,2,3 I O1 I -10 I +IO I PA I input leakage current I ILI I vcc = 5.5 v, Input leakage cu

42、rrent I ILI, I Vcc = 5.5 V, (TI, INTI I vss 5 VIN 5 vcc I I I I I (P10217, P20-P27, I 1 Vss + 0.45 V 5 VIN 5 Vcc l I l I I EA, SS) I I I I I I I I I I I I I I I I 13 I 01 I I -500 I w I I Inpeakage current I IL12 I Vcc = 5.5 V, ! Vss 5 VIN 5 3.8 V ! (RESET) I l l I I I 1,2,3 I O1 I -10 I -125 I w !

43、! ! ! ! I I I I I I I Leakage current I 1,2,3 I O1 I -10 I +IO I w (DBO - DB7, TO) l I 1 I I (high-impedance I I I I I I state) I I I I I I I See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SUD-5762-70512 9999976 003147

44、9 4Tl M I I TABLE I. Electrical performance characteristics - Continued. STANDARD1 ZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 Test I Symbol I SIZE 5962-90512 A REVISION LEVEL SHEET Conditions -55C 5 TC I +12SoC 4.5 v 5 vcc = 5.5 v 4.5 v 5 VDD 5 5.5 v vss = o v unless o

45、therwise specified 11 I I Total supply current IDD+Icc ! I/ ! Vcc = 4.5 V, 5.5 V; see 4.4.ld ! Functional tests Clock period it i I/XTAL frequency - 4/ I I I I ALE pulse width 1 tLL I See figure 3 I I Address setup to ALE ! tAL 1 See figure 3 - 5/ I I Conm pulse width (PSEN) I Data setup before % i

46、tDU i I I Data hold after G I tun I - Data hold (RD, PSEN) i tDR i I I I I - I 1 I - I RD to data in I tRD1 I See figure 3 - 2/ PSEN to data in 1 tRD2 I See figure 3 I I Address setup to G tAW I See figure 3 2/ Addoss setup to data i tAD1 i (RD) I I Add= setup to data i tAD2 i (PSEN) l I I 1 I Addre

47、ss float to i tAFC2 i I I ALE-to control (E, I tLAFC1 1 See figure 3 - 5/ ALE to control (PSEN) Cogrot to ALE (E, I tCAl I See figure 3 WR) I I i tMFC. i I I UR, PROG) I 1 control to ALE (PSEN) j tCA2 i See footnotes at end of table. I I :roup A IDevice I Limits i Unit subgroups I type I I I - l I I

48、 I I I I I l I Min I Max I I I I I I I IA3 I 01 I I 140 I mA l I 7,8 I M I l l I I I 21 I I I I I 9,10,11 I O1 I 90.9 I 333.3 I ns I 1 I I I I I 9,10,11 I O1 I 150 I I ns 9,10,11 I O1 I 70 I I ns 9,10,11 I O1 I 50 I I ns 9,10,11 I O1 I 480 1 I ns 9,10,11 I M I 350 1 I ns 9,10,11 1 O1 I 390 I I “S 9,

49、10,11 I O1 I 40 I I ns I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I l l I I l I I 9,10,11 i O1 i O i 110 i ns I I I 11 I I I I I I I I I I I I l I I 9,10,11 I O1 I I 375 I ns 9,10,11 I O1 I I 240 I ns 9,10,11 I O1 I 300 1 l ns 9,10,11 I O1 I I 730 I ns 9,10,11 I O1 I I 460 I ns I l I I I I I I I I l I I I I I I l I I I I I l I 9,10,11 I O1 I I40 I l ns 9,10,11 I O1 I 10 I I ns 9,10,11 I O1 I 200 I I ns I I I I 1 I I I I I I I l I I I I I