DLA SMD-5962-89875 REV B-2010 MICROCIRCUIT LINEAR FOUR QUADRANT ANALOG MULTIPLIER MONOLITHIC SILICON.pdf

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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A FIGURE 2. Input and output current measurement. For both capacitors, delete “nF” and substitute “F”. FIGURE 3. Common mode input voltage and gain measurement. For both capacitors, delete “nF” and substitute “F”. Delete the capacitor value of “1.0

2、 nF” and substitute “0.1 F”. FIGURE 4. Test circuit for linearity and accuracy measurement using X Y plotter. For both capacitors, delete “nF” and substitute “F”. Changes in accordance with NOR 5962-R274-94. 94-09-22 M. A. FRYE B Update the boilerplate paragraphs to current MIL-PRF-38535 requirement

3、s. Redrawn. - ro 10-11-04 C. SAFFLE REV SHET REV SHET REV STATUS REV B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY RICK C. OFFICER DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR U

4、SE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY CHARLES E. BESORE APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, FOUR QUADRANT ANALOG MULTIPLIER, MONOLITHIC SILICON DRAWING APPROVAL DATE 93-12-01 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-89875 SHEET 1 OF 11

5、DSCC FORM 2233 APR 97 5962-E478-10 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89875 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This

6、 drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89875 01 C A Drawing number Device type (see 1.2.1) Ca

7、se outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 1595 Four quadrant analog multiplier 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follo

8、ws: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ Differential input voltage: VX(pins 9, 10, 11, and 12) ( 6 + IPIN 13RX ) V dc V

9、Y(pins 4, 5, 6, and 8) ( 6 + IPIN 13RY ) V dc Applied voltage (V): Pin 2 voltage - pin 1 voltage 30 V dc Pin 1 voltage - pin 4 voltage 30 V dc Pin 1 voltage - pin 9 voltage 30 V dc Pin 1 voltage - pin 12 voltage 30 V dc Pin 14 voltage - pin 1 voltage 30 V dc Pin 1 voltage - pin 8 voltage 30 V dc Pin

10、 12 voltage - pin 7 voltage 30 V dc Pin 9 voltage - pin 7 voltage 30 V dc Pin 8 voltage - pin 7 voltage 30 V dc Pin 4 voltage - pin 7 voltage 30 V dc Bias current: Pin 3 current 10 mA Pin 13 current 10 mA Power dissipation (PD) 750 mW 2/ Storage temperature range . -65C to +150C Lead temperature (so

11、ldering, 10 seconds) +300C Thermal resistance, junction-to-ambient (JA) +115C/W Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and

12、affect reliability. 2/ Derate at 5.0 mW/C above TA= +25C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89875 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1

13、.4 Recommended operating conditions. Ambient operating temperature range (TA) . -55C to +125C Emitter degeneration resistors ( RXand RY) . 15 k 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this dr

14、awing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-

15、883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at htt

16、ps:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes pr

17、ecedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and a

18、s specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers ap

19、proved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications sha

20、ll not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PR

21、F-38535, appendix A and herein. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical perform

22、ance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provid

23、ed by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89875 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Cond

24、itions 1/ -55C TA+125C Group A subgroupsDevice type Limits 2/ Unit unless otherwise specified Min Max Input bias current 3/ IIBX( IPIN 9+ IPIN 12) / 2 1,2 01 8.0 A IIBY( IPIN 4+ IPIN 8) / 2 8.0 Input offset current 3/ IIOX| IPIN 9- IPIN 12| 1,2 01 1.0 A 3 3.0IIOY| IPIN 4- IPIN 8| 1,2 1.0 3 3.0Output

25、 offset current 3/ IOO| IPIN 14- IPIN 2| 1,2,3 01 50 A Power supply drain -ID1,2 01 7.0 mA DC power dissipation 4/ PD1,2 01 170 mWCommon mode gain 5/ (either input) ACM4,5 01 -50 dB Input common mode 5/ voltage swing VICR4,5 01-11.5 to +11.5 VPKLinearity 6/ ERX-10 VX +10 (VY= 10 V ) 4,5 01 1.0 % 6 2

26、.0ERY-10 VX +10 (VY= 10 V ) 4,5 2.0 6 3.01/ Unless otherwise specified, +V = +32 V, -V = -15 V, IPIN 3, IPIN 13= 1.0 mA, RX, RY= 15 k, and RL= 11 k. 2/ The algebraic convention, whereby the most negative value is a minimum and the most positive is a maximum, is used in this table. Negative current s

27、hall be defined as conventional current flow out of a device terminal. 3/ See figure 2. 4/ Test guaranteed by -IDtest. 5/ See figure 3. 6/ See figure 4. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89875 D

28、LA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 Device type 01 Case outline C Terminal number Terminal symbol 1 Amplifier current balance 2 Positive output, KXY 3 Y - “K” factor adjust 4 Positive Y input 5 Positive Y input gain adjust 6 Negative Y input

29、gain adjust 7 Negative supply voltage, -V 8 Negative Y input 9 Positive X input 10 Positive X input gain adjust 11 Negative X input gain adjust 12 Negative X input 13 X - “K” factor adjust 14 Negative output, KXY FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or network

30、ing permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89875 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 FIGURE 2. Input and output current measurement. Provided by IHSNot for ResaleNo reproduction or networking permitt

31、ed without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89875 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 FIGURE 3. Common mode input voltage and gain measurement. Provided by IHSNot for ResaleNo reproduction or networking permitte

32、d without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89875 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 FIGURE 4. Test circuit for linearity and accuracy measurement using X and Y plotter. Provided by IHSNot for ResaleNo reproduct

33、ion or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89875 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked

34、 with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark.

35、A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of

36、compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply shall affirm tha

37、t the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notificat

38、ion of change. Notification of change to DLA Land and Maritime -VA shall be required for any change that affects this drawing. 3.9 Verification and review. DLA Land and Maritime, DLA Land and Maritime s agent, and the acquiring activity retain the option to review the manufacturers facility and appl

39、icable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance

40、with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition B. The test circuit shall be maintained by the manufacturer under document re

41、vision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. In

42、terim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 50

43、05 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 7, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted. Provided by IHSNot for

44、ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89875 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 10 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (

45、in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - Final electrical test parameters (method 5004) 1*,2,3,4,5,6 Group A test requirements (method 5005) 1,2,3,4,5,6 Groups C and D end-point electrical parameters (method 5005) 1,2,3 * PDA applies to subg

46、roup 1. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition B. The test circuit shall be maintained by the manufacturer under document revision level contro

47、l and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000

48、 hours, except as permitted by method 1005 of MIL-STD-883. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-pr