DLA SMD-5962-88758-1991 MICROCIRCUITS DIGITAL HIGH-SPEED CMOS QUAD BILATERAL SWITCH MONOLITHIC SILICON《硅单片四双边开关高速互补型金属氧化物半导体数字微电路》.pdf
《DLA SMD-5962-88758-1991 MICROCIRCUITS DIGITAL HIGH-SPEED CMOS QUAD BILATERAL SWITCH MONOLITHIC SILICON《硅单片四双边开关高速互补型金属氧化物半导体数字微电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-88758-1991 MICROCIRCUITS DIGITAL HIGH-SPEED CMOS QUAD BILATERAL SWITCH MONOLITHIC SILICON《硅单片四双边开关高速互补型金属氧化物半导体数字微电路》.pdf(17页珍藏版)》请在麦多课文档分享上搜索。
1、- SMD-5962-88758 57 m 7777796 0003734 7 m LTR DESCRIPTION DATE (YR-MO-DA) APPROVED I AMSC NIA I I SHEET 1 OF 16 - I 6 US. GOVfRNMfNT PRINTING OIFICt: 1987 - 748.12916091 I DESC FORM 193 5962-E1228 SEP 87 DISTRIBUTION STATEMENT A. Approved lor public release; dlslrlbullon Is unliniiled. Provided by I
2、HSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-t - SMD-5962-BB75 59 9999996 0003735 9 E b 1. SCOPE 1.1 SCO e, This drawing describes device requirements for class B microcircuits in accordance with l,&f MIL-STD-883, Provisions for the use of MIL-STD-883 in conju
3、nction with compliant non-JAN devices“. 1.2 exampl e : Part or Identifying Number (PIN). The complete PIN shall be as shown in the following 5962-88758 o1 C i Drawing number I X I I I Case outline lead finish per (1.2.2) MIL-M-38510 1.2.1 Device type(s). The device type(s) shall identify the circult
4、 function as follows: Device type Generic number Circuit function o1 54HC4016 Quad bilateral switch 1.2.2 Case outline(s), The case outline(s) shall be as designated in appendix C of MIL-M-38510, and as follows: Outline letter Case outline C 0-1 (14-lead, .785“ x .310“ x .200“), dual-in-line package
5、 2 C-2 (20 teminai, .358“ x ,358“ x .loo“), square chip carrier package 1.3 Absolute maximum ratings. Supply voltage rangel/- - - - - - - - - - - - - - - - - DC input and output voltage range L/ - - - - - - - - - - DC input diode current (I K) - - - - - - - - - - - - - - DC switch diode current (!OK
6、)- - - - - - - - - - - - - - DC switch current (IO) - - - - - - - - - - - - - - - - - DC VCC or ground current (Ice) - - - - - - - - - - - - - Storage temperature range- - - - - - - - - - - - - - - - Maximum power dissipation (PD) - - - - - - - - - - - - - Lead temperature (soldering, 10 seconds) -
7、- - - - - - - Thema1 resistance, junction-to-case (jc) - - - - - - - Junction temperature (TJ)- - - - - - - - - - - - - - - - -0.5 V dc to t15.0 V dc -0.5 to VCC + 0.5 V dc *20 mA *20 mA *25 mA *50 mA -65C to +150C 1025 mW 2/ +265OC See VIL-M-38510, appendix C +175 C - l/ Unless otherwise specifigd,
8、 all voltages are referenced to ground. - 21 Derating factor = 11 mW/ C. SIZE A 5962-88758 STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER REVISION LEVEL SHEET I DAON, OHIO 45444 2 * U. S. QOVERNMBNT PRINTING QFFICS 199p-949-249 ESC FORM 193A SEP 87 Provided by IHSNot for ResaleNo re
9、production or networking permitted without license from IHS-,-,-SMD-59bZ-BB75 59 W 9999996 00037Lb O W 1.4 Recommended operating conditions. Supply voltage range (V 1 3/- - - - - - - - - - - - - Analog switch voltage range (VI/O) - - - - - - - - - - Case operating temperature range (TC)- - - - - - -
10、 - - +2.0 V dc to +12.0 V dc !5?2:0 +125C O to 1000 ns O to 500 ns O to 400 ns O to 250 ns DC input voltage range Fic= - - - - - - - - - - - - - o to vcc . vcc = 12.0 y - - - - - - - - - - - - - - - - - - - - Design information only. Switch cutoff frequency (channel loss = 3 dB) : vcc = 4.5 v, T = +
11、25“c - - - - - - - - - - - - - - Vtc = 9.0 V, TA = t25C - - - - - - - - - - - - - - Con rol feedthrough voltage to any switch, peak-to-peak: VCC = 4.5 Y, CL = 50 pF, RL = 600n (see figure 1) - Frequency at which crosstalk attenuation between any two switches equals 50 dB: Vcc = 4.5 V, CL = 50 pF, RL
12、 = 600n (see figure 2) 100 MHz typical 120 MHz typical 180 mV typical 1.0 MHz typical - 2. APPLICABLE DOCUMENTS 2.1 Government specification, standard, and bulletin. Unless otherwise specified, the following specification, standard, and bulletin of the issue listed in that issue of the Department of
13、 Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein. SPECIFICATION MILITARY MI L-M- 38510 - Microcircuits, General Specification for. STANDARD MILITARY MI L-STD-883 - Test Methods and Procedures for Microelectronics
14、. BULLETIN MILITARY 141 L-BUL-103 - Li st of Standardi zed Mi 1 i tary Drawings (SMD SI. (Copies of the specification, standard, and bulletin required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as directed by th contracting
15、activity. 1 references cited herein, the text of this drawing shall take precedence. 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the - 3/ With supply voltages at or near 2.0 Y, the analog switch-on-state resistance becomes very nonlinear. voltages. It is
16、recommended that only digital signals be transmitted at these low supply 5962-88758 SHEET REVISION LEVEL STANDARDIZED MILITARY DRAWING DEFENSE UECTROPICC SUPPLY CENTER DAYION, OHIO 45444 )ESC FORM 193A SEP 87 U. 8. QOVERNMENT PRINTING OFFICE 1990-349-249 Provided by IHSNot for ResaleNo reproduction
17、or networking permitted without license from IHS-,-,-SMD-5962-BB758 59 9999996 0003737 2 3. REQUI REMNTS 3.1 Item requirements. The individual item requirements shall be in accordance with 1.2.1 of MIL-STD-883, “Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices“ and
18、 as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-M-38510 and herein. 3.2.1 Case outline(s). The case outlines) shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal con
19、nections shall be as specified on figure 3. 3.2.3 Truth table. The truth table shall be as specified on figure 4. 3.2.4 Logic diagram, 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical perfonnance characteristics are as specified in table I and shall apply
20、 over the full case operating temperature range I The logic diagram shall be as specified on figure 5. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Markin
21、g shall be in accordance with MIL-STD-883 (see 3.1 herein). The part shall be marked with the PIN listed in 1.2 herein. as listed in MIL-BUL-103 (see 6.6 herein). 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved sou
22、rce of supply in MIL-BUL-103 (see 6.6 herein). certificate of compliance submitted to DESC-ECS prior to listing as an approved source of supply chal 1 affi rm that the manufacturer c product meets the requi rements of MIL-STD-883 ( see 3.1 herein) and the requi rements herein. 3.7 Certificate of con
23、formance. herein) shall tie provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DESC-ECS shall be required in accordance with MIL-STD-883 ( see 3.1 herei n). 3.9 Verification and review. review the manufacturers facility and applic
24、able required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. In addition, the manufacturers PIN may also be marked The A certificate of conformance as required in MIL-STD-883 (see 3.1 DESC, DESCs agent, and the acquiring activity retain the optio
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