DLA SMD-5962-88514 REV H-2010 MICROCIRCUIT HYBRID LINEAR 12-BIT DATA ACQUISITION SYSTEM.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Pages 4, 5, and 6, table I, change VCM, CMRR, IB, IIO, VVIO, CIN, EN, BGE, BGE/t, VIH, IIH, IIL, VOH, VOL, FT, and ICC. Delete TRand PD. Page 9, figure 1, case X, change A and A1 dimensions. Page 10, figure 1 - Continued, case Y, change overall p
2、ackage height and delete the dimensions for distance between top of substrate and top of lid. Change vendor CAGE number. Editorial changes throughout. 91-01-25 Monica L. Poelking B Pages 5 and 6, table I, change BZE/t, BGE/t, and ta. Pages 12 and 13, correct terminal connections. Inactivated case Y
3、(flat package). Editorial changes throughout. 91-09-20 Monica L. Poelking C Add device types 03, 04, and CAGE number 50721. Rewrite entire document. 93-05-11 K. A. Cottongim D Changes in accordance with NOR 5962-R139-97. 96-11-25 K. A. Cottongim E Changes in table I for device types 03 and 04. 99-03
4、-04 K. A. Cottongim F Figure 1; For case outline X, corrected the dimension R. Added dimension T to case outline X to define the measurement from the edge of the package to the center of the first horizontal pin for all four corners. Figure 1 conversion table, added dimension T. -sld 00-01-05 Raymon
5、d Monnin G Update drawing. -gz 08-07-24 Robert M. Heber H Figure 1; For case outline X, corrected the dimensions A, A1, and S as follows. Dimension A should be .205 min and .235 max. Dimension A1 changed to .190 min and .230 max. Dimension S changed to .135 min and .155 max. -sld 10-03-04 Charles F.
6、 Saffle THE ORIGINAL FIRST SHEET OF THIS DOCUMENT HAS BEEN REPLACED. REV SHEET REV H H H H H H H SHEET 15 16 17 18 19 20 21 REV STATUS REV H H H H H H H H H H H G G G OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Donald R. Osborne DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICRO
7、CIRCUIT DRAWING CHECKED BY Ray Monnin COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY William K. Heckman MICROCIRCUIT, HYBRID, LINEAR, 12-BIT DATA ACQUISITION SYSTEM AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 89-0
8、7-24 AMSC N/A REVISION LEVEL H SIZE A CAGE CODE 67268 5962-88514 SHEET 1 OF 21 DSCC FORM 2233 APR 97 5962-E222-10 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88514 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS,
9、 OHIO 43218-3990 REVISION LEVEL H SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with MIL-PRF-38534 and a choice of case outlines and lead finishes are available and are reflected in the Part
10、 or Identifying Number (PIN). 1.2 PIN. The PIN shall be as shown in the following example: 5962-88514 01 X A Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic
11、number Circuit function 01 HS9403B-8 12-bit data acquisition system, 8-channel differential input 02 HS9403B-16 12-bit data acquisition system, 16-channel single-ended input 03 HDAS-8 12-bit data acquisition system, 8-channel differential input 04 HDAS-16 12-bit data acquisition system, 16-channel s
12、ingle-ended input 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 62 Quad package Y See figure 1 64 Flat package 1.2.3 Lead finish. The lead finish shall be as specified in MIL-P
13、RF-38534. 1.3 Absolute maximum ratings. 1/ Positive supply voltage range (VCC) . -0.5 V dc to +18 V dc Negative supply voltage range (VEE) +0.5 V dc to -18 V dc Logic supply voltage range (VDD) . -0.5 V dc to +7 V dc Analog input channels 35 V dc 2/ Digital inputs -0.5 V dc to +7 V dc Power dissipat
14、ion (PD) . 2 W Thermal resistance, junction-to-case (JC) . 30C/W Thermal resistance, junction-to-ambient (JA) 45C/W Lead temperature (soldering, 10 seconds) +300C Storage temperature range -65C to +150C Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Positive supply voltage ran
15、ge (VCC) . +14.5 V dc to +15.5 V dc Negative supply voltage range (VEE) -14.5 V dc to -15.5 V dc Logic supply voltage range (VDD) . +4.5 V dc to +5.5 V dc Ambient operating temperature range (TA) -55C to +125C 1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. E
16、xtended operation at the maximum levels may degrade performance and affect reliability. 2/ 20 V in power off condition.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88514 DEFENSE SUPPLY CENTER COLUMBUS COLU
17、MBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issue
18、s of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Electroni
19、c Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk,
20、 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulatio
21、ns unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device class H shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the de
22、vice manufacturers Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In add
23、ition, the modification in the QM plan shall not affect the form, fit, or function of the device for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline
24、s. The case outlines shall be in accordance with 1.2.2 herein and figure 1. 3.2.2 Functional diagrams. The functional diagrams shall be as specified on figure 2. 3.2.3 Terminal connections. The terminal connections shall be as specified on figure 3. 3.2.4 Timing diagram. The timing diagram shall be
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