DLA SMD-5962-86846 REV D-2009 MICROCIRCUIT DIGITAL CMOS 64 X 5 PARALLEL FIFO MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add the F-9 and F-10 packages to the drawing, also added vendor CAGE number 65786 to the drawing. Changes to table I, figure 1, and 6.4. Also added paragraph 4.3.3 to drawing. Editorial changes throughout. 89-01-27 D. R. Cool B Changes in accorda
2、nce with NOR 5962-235-94. 94-07-26 Michael A. Frye C Update drawing to current requirements. Editorial changes throughout. gap 01-04-03 Raymond Monnin D Update drawing to current requirements. Editorial changes throughout. tcr 09-06-15 Joseph Rodenbeck THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEE
3、N REPLACED. REV SHET REV D SHET 15 REV STATUS REV D D D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY James E. Jamison DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Ray Monnin COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THI
4、S DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY D. R. Cool MICROCIRCUIT, DIGITAL, CMOS 64 X 5 PARALLEL FIFO, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 88-04-15 AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-86846 SHEET 1 OF 15 DSCC FORM 2
5、233 APR 97 5962-E331-09 .Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86846 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This
6、drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-86846 01 V A Drawing number Device type (see 1.2.1) Cas
7、e outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function Shift in/out rate 01 72404L10 64 x 5 CMOS parallel FIFO 10 MHz 02 72404L15 64 x 5 CMOS parallel FIFO 15 MHz 03 72404L25 64 x 5 CMO
8、S parallel FIFO 25 MHz 04 72404L35 64 x 5 CMOS parallel FIFO 35 MHz 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style S GDFP-F20 or CDFP3-F20 20 Flat package V GDIP1-T18 or CDIP2-T18 18 Dual-in-l
9、ine X GDFP2-F18 18 Flat package 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Terminal voltage with respect to ground . -0.5 V dc to +7.0 V dc DC output current . 50 mA Storage temperature ra
10、nge . -65C to +150C Maximum power dissipation (PD) 1/ 1.0 W Lead temperature (soldering, 10 seconds) . +260C Thermal resistance, junction-to-case (JC): Cases S, V, X, and 2 See MIL-STD-1835 Junction temperature (TJ) . +175C 1.4 Recommended operating conditions. Supply voltage (VCC) . 4.5 V dc to 5.5
11、 V dc Supply voltage (GND) . 0 V dc Input high voltage (VIH) . 2.0 V dc minimum Input low voltage (VIL) . 0.8 V dc maximum 2/ Case operating temperature range (TC) -55C to +125C _ 1/ Must withstand the added PDdue to short circuit test; e.g., IOS. 2/ -1.5 V undershoots are allowed for 10 ns once per
12、 cycle. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86846 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government spe
13、cification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-P
14、RF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircu
15、it Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event
16、of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individua
17、l item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted tr
18、ansitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requir
19、ements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, constru
20、ction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified
21、 on figure 1. 3.2.3 Block diagrams. The block diagrams shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature ran
22、ge. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUI
23、T DRAWING SIZE A 5962-86846 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers P
24、IN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices bu
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