DLA SMD-5962-86030 REV C-2005 MICROCIRCUIT DIGITAL BIPOLAR DMA ADDRESS GENERATOR MONOLITHIC SILICON《硅单块 双极直接存储器存取地址发生器数字微型电路》.pdf
《DLA SMD-5962-86030 REV C-2005 MICROCIRCUIT DIGITAL BIPOLAR DMA ADDRESS GENERATOR MONOLITHIC SILICON《硅单块 双极直接存储器存取地址发生器数字微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-86030 REV C-2005 MICROCIRCUIT DIGITAL BIPOLAR DMA ADDRESS GENERATOR MONOLITHIC SILICON《硅单块 双极直接存储器存取地址发生器数字微型电路》.pdf(15页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Convert to military drawing format and change L and L1 dimensions of case outline Y. Editorial changes throughout. 87-05-08 N. A. Hauck B Made corrections on figure 5 Instruction set. Technical update to Table I. Updated boiler plate and editoria
2、l changes throughout. - LTG 00-05-02 Monica L. Poelking C Update boilerplate to MIL-PRF-38535 requirements. - CFS 05-09-08 Thomas M. Hess THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12
3、 13 14 PMIC N/A PREPARED BY Ray Monnin DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck MICROCIRCUIT, DIGITAL, BIPOLAR DMA AND AGENCIES O
4、F THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 86-03-07 ADDRESS GENERATOR, MONOLITHIC SILICON AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 86030 SHEET 1 OF 14 DSCC FORM 2233 APR 97 5962-E404-05 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S
5、TANDARD MICROCIRCUIT DRAWING SIZE A 86030 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-3
6、8535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 86030 01 X X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device t
7、ype Generic number Circuit function 01 2940 DMA address generator 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X GDIP1-T28 or CDIP2-T28 28 Dual-in-line Y See figure 1 28 Flat pack 3 CQCC1-N2
8、8 28 Leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range. -0.5 V dc to +7.0 V dc Input voltage range -0.5 V dc to +5.5 V dc Storage temperature range . -65C to +150C Maximum power dissipation, (PD)
9、1.733 W 1/ Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC): Case X 15C/W 2/ Case Y 15C/W Case 3. 15C/W 2/ Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage (VCC) +4.5 V dc minimum to +5.5 V dc maximum Minimum high-level inpu
10、t voltage (VIH) 2.0 V dc Maximum low-level input voltage (VIL) . 0.8 V dc Case operating temperature range (TC) -55C to +125C _ 1/ Must withstand the added PDdue to short circuit test (e.g., IOS). 2/ When a thermal resistance value for this case is included in MIL-STD-1835 that value shall supersede
11、 the value indicated herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86030 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.
12、1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPE
13、CIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Sta
14、ndard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-
15、5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQU
16、IREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufactu
17、rer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (
18、QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the
19、 QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein and on figure 1. 3.2.2 Ter
20、minal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Block diagram. The block diagram shall be as specified on figure 3. 3.2.4 Test circuit and timing waveforms. The test circuit and timing waveforms shall be as specified on figure 4. 3.2.5 Instruction set. The instru
21、ction set shall be as specified on figure 5. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The ele
22、ctrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86030 DEFENSE SUPPLY CENTER
23、COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking
24、of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. Th
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