DLA SMD-5962-86014 REV J-2012 MICROCIRCUIT LINEAR DUAL HIGH SPEED VOLTAGE COMPARATOR MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED C Add test limits at temperature for ICC+ and ICC-. Add vendor CAGE 06665. Add case outline 2. Editorial changes throughout. 90-01-24 M. A. Frye D Changes in accordance with NOR 5962-R156-92. 92-04-03 M. A. Frye E Add case outline “X“. Changes to t
2、he thermal resistance, junction-to-ambient values. Update boilerplate. Vendor CAGE 06665 is being replaced by 24355. rrp 97-07-15 Raymond Monnin F Case outline “X“ dimensions L, R, and R1 are updated. rrp 97-12-11 Raymond Monnin G Drawing updated to reflect current requirements. - ro 02-06-27 Raymon
3、d Monnin H Correction to paragraph 3.5. Editorial changes throughout. - drw 05-05-03 Raymond Monnin J Update drawing to current requirements of MIL-PRF-38535. -rrp 12-01-10 Charles F. Saffle CURRENT CAGE CODE 67268 THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV S
4、TATUS REV J J J J J J J J OF SHEETS SHEET 1 2 3 4 5 6 7 8 PMIC N/A PREPARED BY DONALD R. OSBORNE DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFE
5、NSE CHECKED BY D. A. DiCENZO APPROVED BY N. A. HAUCK MICROCIRCUIT, LINEAR, DUAL, HIGH SPEED, VOLTAGE COMPARATOR, MONOLITHIC SILICON DRAWING APPROVAL DATE 86-02-06 AMSC N/A REVISION LEVEL J SIZE A CAGE CODE 14933 86014 SHEET 1 OF 8 DSCC FORM 2233 APR 97 5962-E092-12 Provided by IHSNot for ResaleNo re
6、production or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86014 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN
7、class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 86014 01 C A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device
8、 type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 LM119 High speed, dual, voltage comparator 02 LM119A High speed, dual, voltage comparator 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Desc
9、riptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack H GDFP1-F10 or CDFP2-F10 10 Flat pack I MACY1-X10 10 Can X GDFP1-G10 10 Flat pack with gullwing leads 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead fini
10、sh is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Total supply voltage 36 V dc Output to negative supply voltage . 36 V dc Ground to negative supply voltage . 25 V dc Ground to positive supply voltage . 18 V dc Differential input voltage 5 V dc Input voltage . 15 V dc 1/
11、 Power dissipation 500 mW Output short circuit duration 10 seconds Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds) +300C Junction temperature (TJ) +175C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA): Case C 94
12、C/W Case D 150C/W Case I 162C/W Cases H and X 215C/W Case 2 . 89C/W _ 1/ For supply voltages less than 15 V, the absolute maximum input voltage is equal to the supply voltage. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAW
13、ING SIZE A 86014 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Ambient operating temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following
14、 specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, Gene
15、ral Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit D
16、rawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and
17、 the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MI
18、L-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be p
19、rocessed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affec
20、t form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, constr
21、uction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance character
22、istics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The el
23、ectrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance
24、indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. Provided by IHSNot for ResaleNo
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