DLA SMD-5962-78028 REV K-2011 MICROCIRCUIT LINEAR REGULATING PULSE WIDTH MODULATORS MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED E Change to military drawing format. Table I, change VCMmin to 0.3 V. Add vendors 48726, U4637, and 34333. Editorial changes throughout. 87-04-21 M. A. FRYE F Add parameters to absolute maximum ratings. Page 4, reference section: Change IOSmax limi
2、t from 100 mA to 150 mA: change ripple rejection from max of 66 dB to min of 60 dB guaranteed by correlation. Page 4, oscillator section: Change temperature stability max limit from 2 percent to 6 percent guaranteed. Page 5, output section: Add tests for rise time and fall time. Editorial changes th
3、roughout. 87-12-01 M. A. FRYE G Add vendor CAGE 18324. Change name for vendor CAGE U4637. Editorial changes throughout. Make drawing inactive for new design. 88-12-08 M. A. FRYE H Drawing updated to reflect current requirements. - ro 02-05-22 R. MONNIN J Make correction to marking paragraph 3.5. -rr
4、p 05-06-13 R. MONNIN K Update boilerplate paragraphs to current MIL-PRF-38535 requirements. - ro 11-10-24 C. SAFFLE THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. CURRENT CAGE CODE 67268 REV SHET REV SHET REV STATUS REV K K K K K K K K K K OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A P
5、REPARED BY WILLIAM E. SHOUP DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY C. R. JACKSON APPROVED BY N. A. HAUCK MICROCIRCUIT, LI
6、NEAR, REGULATING PULSE WIDTH MODULATORS, MONOLITHIC SILICON DRAWING APPROVAL DATE 79-01-19 AMSC N/A REVISION LEVEL K SIZE A CAGE CODE 14933 78028 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E018-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDAR
7、D MICROCIRCUIT DRAWING SIZE A 78028 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL K SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix
8、A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 78028 01 E A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic num
9、ber Circuit function 01 1524 Regulating pulse width modulator 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line 1.2.3 Lead finish. The lead finish is as s
10、pecified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Input voltage (VIN) 40 V dc Collector output current 100 mA dc Reference output current 50 mA dc Oscillator charging current 5 mA Power dissipation (PD) at TA= +25C 1,000 mW 1/ Power dissipation (PD) at TC= +25C 2,000 mW 2/ Junctio
11、n temperature (TJ) . +150C Storage temperature range . -65C to +150C Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA) 100C/W 1.4 Recommended operating conditions. Input voltage range . 8 V dc to
12、 40 V dc Current through CTterminal . -0.03 mA to -2 mA Timing resistor (RT) 1.8 k to 100 k Timing capacitor (CT) . 0.001 F to 0.1 F Ambient operating temperature range (TA) -55C to +125C _ 1/ Derate at 10 mW/C for TAabove +50C. 2/ Derate at 16 mW/C for TAabove +25C. Provided by IHSNot for ResaleNo
13、reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78028 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL K SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following sp
14、ecification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General
15、 Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Draw
16、ings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and th
17、e references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-P
18、RF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be proc
19、essed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect f
20、orm, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construct
21、ion, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Logic diagram. The voltage wavefo
22、rms and test circuit shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test require
23、ments. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78028 DLA LAND
24、 AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL K SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA+125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Reference section Output voltage VREF1,2,3 01 4.
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