DLA SMD-5962-77049 REV J-2005 MICROCIRCUIT DIGITAL-LINEAR TTL DUAL PERIPHERAL DRIVERS MONOLITHIC SILICON《硅单片TTL双重外围驱动器 线性数字微型电路》.pdf

《DLA SMD-5962-77049 REV J-2005 MICROCIRCUIT DIGITAL-LINEAR TTL DUAL PERIPHERAL DRIVERS MONOLITHIC SILICON《硅单片TTL双重外围驱动器 线性数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-77049 REV J-2005 MICROCIRCUIT DIGITAL-LINEAR TTL DUAL PERIPHERAL DRIVERS MONOLITHIC SILICON《硅单片TTL双重外围驱动器 线性数字微型电路》.pdf（9页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED F Add device type 02. Changes to absolute maximum rating and Table I. Editorial changes throughout. Delete vendor CAGE 34333. 93-02-18 M. A. FRYE G Make change to high level input current test as specified under Table I. Editorial changes throughou

2、t. ro 00-07-18 R. MONNIN H Update drawing to current requirements. -drw 03-01-15 R. MONNIN J Make correction to marking paragraph 3.5. -rrp 05-05-11 R. MONNIN THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. CURRENT CAGE CODE 67268 REV SHET REV SHET REV STATUS REV J J J J J J J J OF SHEET

3、S SHEET 1 2 3 4 5 6 7 8 PMIC N/A PREPARED BY A. J. FOLEY DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY C. R. JACKSON COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. HAUCK MICROCIRCUIT, DIGITAL-LINEAR, T

4、TL DUAL PERIPHERAL DRIVERS, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 77-10-12 AMSC N/A REVISION LEVEL J SIZE A CAGE CODE 14933 77049 SHEET 1 OF 8 DSCC FORM 2233 APR 97 5962-E332-05 Provided by IHSNot for ResaleNo reproduction or networking permitted without

5、license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77049 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in acc

6、ordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 77049 01 P X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit functio

7、n as follows: Device type Generic number Circuit function 01 55452 Dual peripheral NAND driver 02 55451 Dual peripheral AND driver 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or

8、CDIP2-T8 8 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage (VCC) +7.0 V dc Input voltage (VIN) +5.5 V dc Maximum power dissipation (PD): 1/ Case P .1050 mW Case 2 13

9、75 mW Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds): Case P .+300C Case temperature (soldering, 60 seconds): Case 2 +260C Junction temperature (TJ) +150C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA): Case P

10、 .125C/W Case 2 150C/W 1/ For case P, derate at 8.4mW/C above TA= +25C. For case 2, derate at 11.0 mW/C above TA= +25C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77049 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS

11、, OHIO 43218-3990 REVISION LEVEL J SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Supply voltage (VCC) +4.5 V dc to +5.5 V dc Maximum low level input voltage (VIL) 0.8 V dc Minimum high level input voltage (VIH) . 2.0 V dc Ambient operating temperature range (TA) . -55C to +125C

12、 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract

13、. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS

14、 MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building

15、4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption

16、 has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certif

17、ied and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented

18、in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q” or “QML” certification mark in accordance with MIL-PRF-38535 is re

19、quired to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.

20、2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth tables. The truth tables shall be as specified on figure 2. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in

21、table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or

22、 networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77049 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA +125C unless otherwise

23、 specified Group A subgroups Device type Limits Unit Min Max Input clamp voltage VICVCC= 4.5 V, IIN= -12 mA 1 All -1.5 V High level output current IOHVCC= 4.5 V, VIL= 0.8 V, VIH= 2.0 V, VOH= 30 V 1,2,3 All 300 A Low level output current IOLVCC= 4.5 V, VIH= 2 V, IOL= 100 mA 1,2,3 All 0.5 V VIL= 0.8 V

24、 IOL= 300 mA 0.8 Input current at maximum input voltage IINVCC= 5.5 V, VIN= 5.5 V 1,2,3 All 1.0 mA High level input current IIHVCC= 5.5 V, VIN= 2.4 V 1,2,3 All 60 A Low level input current IILVCC= 5.5 V, VIN= 0.4 V 1,2,3 All -1.6 mA Supply current, outputs high ICCHVCC= 5.5 V VIN= 0 V 1,2,3 01 14 mA

25、 VIN= 5 V 02 11 Supply current, outputs low ICCLVCC= 5.5 V VIN= 0 V 1,2,3 01 71 mA VIN= 5 V 02 65 Propagation delay time tPLH, VCC= 5 V, IO= 200 mA, 9 01 35 ns tPHLCL= 15 pF, RL= 50 02 25 Transition time, low-to-high level output tTLHVCC= 5 V, IO= 200 mA, CL= 15 pF, RL= 50 9 All 8 ns Transition time

26、, high-to-low level output tTHLCL= 15 pF, RL= 50 9 All 12 ns Functional tests See 4.3.1c 7 All Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77049 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISIO

27、N LEVEL J SHEET 5 DSCC FORM 2234 APR 97 Device types 01 and 02 Case outlines P 2 Terminal number Terminal symbol 1 1A NC 2 1B 1A 3 1Y NC 4 GND NC 5 2Y 1B 6 2A NC 7 2B 1Y 8 VCCNC 9 - NC 10 - GND 11 - NC 12 - 2Y 13 - NC 14 - NC 15 - 2A 16 - NC 17 - 2B 18 - NC 19 - NC 20 - VCCNC = No connection FIGURE

28、1. Terminal connections. Device type 01 Device type 02 A B Y A B Y L L H (OFF state) L L L (ON state) L H H (OFF state) L H L (On state) H L H (OFF state) H L L (ON state) H H L (ON state) H H H (OFF state) FIGURE 2. Truth tables. Provided by IHSNot for ResaleNo reproduction or networking permitted

29、without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77049 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHEET 6 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in

30、1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q” or “QML” certification

31、 mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance

32、submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A sha

33、ll be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review th

34、e manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening.

35、Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be mai

36、ntained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015

37、of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking

38、permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77049 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHEET 7 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, m

39、ethod 5005, table I) Interim electrical parameters (method 5004) - Final electrical test parameters (method 5004) 1*, 2, 3, 9 Group A test requirements (method 5005) 1, 2, 3, 7, 9 Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. 4.3 Quality conformanc

40、e inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, 8, 10, an

41、d 11 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 7 shall include verification of the truth table. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883.

42、(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as appl

43、icable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535,

44、 appendix A. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77049 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL J SHEET 8 DSCC FORM 2234 APR 97 6. NOTES 6.1 Intended use. Microcircuits c

45、onforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or

46、drawing. 6.3 Configuration control of SMDs. All proposed changes to existing SMDs will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shal

47、l inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics de

48、vices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0547 6.6 Approved sources of supply. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICRO