DLA DSCC-VID-V62 13627-2013 MICROCIRCUIT DIGITAL-LINEAR QUAD 14-BIT 125 MSPS SERIAL LVDS 1 8 V ANALOG-TODIGITAL CONVERTER MONOLITHIC SILICON.pdf
《DLA DSCC-VID-V62 13627-2013 MICROCIRCUIT DIGITAL-LINEAR QUAD 14-BIT 125 MSPS SERIAL LVDS 1 8 V ANALOG-TODIGITAL CONVERTER MONOLITHIC SILICON.pdf》由会员分享,可在线阅读,更多相关《DLA DSCC-VID-V62 13627-2013 MICROCIRCUIT DIGITAL-LINEAR QUAD 14-BIT 125 MSPS SERIAL LVDS 1 8 V ANALOG-TODIGITAL CONVERTER MONOLITHIC SILICON.pdf(14页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE APPROVED Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV PAGE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Phu H. Nguyen DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil/ O
2、riginal date of drawing YY MM DD CHECKED BY Phu H. Nguyen TITLE MICROCIRCUIT, DIGITAL-LINEAR, QUAD, 14-BIT, 125 MSPS SERIAL LVDS 1.8 V ANALOG-TO-DIGITAL CONVERTER, MONOLITHIC SILICON 13-09-19 APPROVED BY Thomas M. Hess SIZE A CODE IDENT. NO. 16236 DWG NO. V62/13627 REV PAGE 1 OF 14 AMSC N/A 5962-V08
3、5-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/13627 REV PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance quad, 14-bit,
4、 125 MSPS serial LVDS 1.8 V analog-to-digital converter microcircuit, with an operating temperature range of -55C to +125C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number
5、 for identifying the item on the engineering documentation: V62/13627 - 01 X E Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 AD9253-EP Quad, 14-bit, 125 MSPS serial LVDS 1.8 V analog-to-digital co
6、nverter 1.2.2 Case outline(s). The case outlines are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 48 JEDEC MO-220-WKKD Lead Lead Frame Chip Scale Package 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device
7、manufacturer: Finish designator Material A Hot solder dip B Tin-lead plate C Gold plate D Palladium E Gold flash palladium Z Other Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO
8、. V62/13627 REV PAGE 3 1.3 Absolute maximum ratings. 1/ AVDD to AGND -0.3 V to +2.0 V DRVDD to AGND . -0.3 V to +2.0 V Digital outputs (D0x, D1x, DCO+, DCO-, FCO+, FCO-) to AGND -0.3 V to +2.0 V CLK+, CLK- to AGND . -0.3 V to +2.0 V VIN+x, VIN-x to AGND . -0.3 V to +2.0 V SCLK/DTP, SDIO/OLM, CSB to
9、AGND . -0.3 V to +2.0 V SYNC, PDWN to AGND . -0.3 V to +2.0 V RBIAS to AGND . -0.3 V to +2.0 V VREF, SENSE to AGND -0.3 V to +2.0 V Operating temperature range (Ambient) -55C to +125C Maximum junction temperature 150C Lead temperature (Soldering, 10 sec) 300C Storage temperature range (Ambient) -65C
10、 to 150C 1.5 Thermal characteristics. Thermal resistance Case outline Air flow velocity (m/sec) JA 2/ JTJBJCTOP JCBOTTOM Unit Case X 0.0 1.0 2.5 20.3 17.6 16.5 0.10 0.16 0.20 5.9 N/A 3/ N/A 3/ 6.1 N/A 3/ N/A 3/ 1.0 N/A 3/ N/A 3/ C/W C/W C/W 2. APPLICABLE DOCUMENTS JEDEC SOLID STATE TECHNOLOGY ASSOCI
11、ATION (JEDEC) JEP95 Registered and Standard Outlines for Semiconductor Devices (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10th Street, Suite 240S, Arlington, VA 22201-2107). 1/ Stresses above those listed under
12、“Absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions above those beyond indicated in the operational section of this specifications is not implied. Exposure to absolute maximum rate
13、d conditions for extended periods may affect device reliability. 2/ JAfor a 4-layer printed circuit board (PCB) with solid ground plane (simulated). Exposed pad soldered to PCB. 3/ N/A = not applicable. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,
14、-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/13627 REV PAGE 4 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 ident
15、ifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics
16、are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The t
17、erminal connections shall be as shown in figure 2. 3.5.3 Terminal function description. The Terminal function description shall be as shown in figure 3. 3.5.4 Functional block diagram. The functional block diagram shall be as shown in figure 4. Provided by IHSNot for ResaleNo reproduction or network
18、ing permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/13627 REV PAGE 5 TABLE I. Electrical performance characteristics. 1/ Test 2/ Test conditions 3/ Temp Limits Unit Min Typ Max DC SPECIFICATIONS Resolution 14 Bits Accuracy No missin
19、g codes Full Guaranteed Offset error Full -0.8 -0.3 +0.1 % FSR Offset matching Full -0.6 +0.2 +0.6 % FSR Gain error Full -12 -3 +2 % FSR Gain matching Full 1.1 1.6 % FSR Differential Nonlinearity (DNL) Full 25C -0.8 0.8 +1.9 LSB LSB Integral Nonlinearity (INL) Full 25C -4.5 2.0 +4.5 LSB LSB Temperat
20、ure drift Offset error Full 2 ppm/C Gain error Full 50 ppm/C Internal voltage reference Output voltage (1 V Mode) Full 0.98 1.0 1.02 V Load regulation at 1.0 mA (VREF= 1 V) Full 2 mV Input resistance Full 7.5 k Input referred noise VREF= 1.0 V 25C 0.94 LSB rms Analog inputs Differential input voltag
21、e (VREF= 1 V) Full 2 V p-p Common mode voltage Full 0.9 V Differential input resistance 5.2 k Differential input capacitance Full 3.5 pF Power supply AVDD Full 1.7 1.8 1.9 V DRVDD Full 1.7 1.8 1.9 V IAVDD4/ Full 183 205 mA IDRVDD(ANSI-644 mode) 4/ Full 61 63 mA IDRVDD(Reduce range mode) 4/ 25C 53 mA
22、 Total power consumption DC input Full 403 mW Sine wave input (Four channels including output drivers ANSI 644 mode) Full 440 480 mW Sine wave input (Four channels including output drivers reduced range mode) 25C 425 mW Power down mode Full 2 mW Standby mode 5/ Full 235 mW See footnote at end of tab
23、le. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/13627 REV PAGE 6 TABLE I. Electrical performance characteristics - Continued. 1/ Test 2/ Test conditions 3/ Temp Limits U
- 1.请仔细阅读文档,确保文档完整性,对于不预览、不比对内容而直接下载带来的问题本站不予受理。
- 2.下载的文档,不会出现我们的网址水印。
- 3、该文档所得收入(下载+内容+预览)归上传者、原创作者;如果您是本文档原作者,请点此认领!既往收益都归您。
下载文档到电脑,查找使用更方便
10000 积分 0人已下载
下载 | 加入VIP,交流精品资源 |
- 配套讲稿:
如PPT文件的首页显示word图标,表示该PPT已包含配套word讲稿。双击word图标可打开word文档。
- 特殊限制:
部分文档作品中含有的国旗、国徽等图片,仅作为作品整体效果示例展示,禁止商用。设计者仅对作品中独创性部分享有著作权。
- 关 键 词:
- DLADSCCVIDV62136272013MICROCIRCUITDIGITALLINEARQUAD14BIT125MSPSSERIALLVDS18VANALOGTODIGITALCONVERTERMONOLITHICSILICONPDF

链接地址:http://www.mydoc123.com/p-689386.html