DLA DSCC-VID-V62 12656-2013 MICROCIRCUIT LINEAR 1 2 GHz CLOCK DISTRIBUTION IC 1 6 GHz INPUTS DIVIDERS FIVE OUTPUTS MONOLITHIC SILICON.pdf
《DLA DSCC-VID-V62 12656-2013 MICROCIRCUIT LINEAR 1 2 GHz CLOCK DISTRIBUTION IC 1 6 GHz INPUTS DIVIDERS FIVE OUTPUTS MONOLITHIC SILICON.pdf》由会员分享,可在线阅读,更多相关《DLA DSCC-VID-V62 12656-2013 MICROCIRCUIT LINEAR 1 2 GHz CLOCK DISTRIBUTION IC 1 6 GHz INPUTS DIVIDERS FIVE OUTPUTS MONOLITHIC SILICON.pdf(23页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE APPROVED Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE 18 19 20 21 22 23 REV STATUS OF PAGES REV PAGE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 PMIC N/A PREPARED BY Phu H. Nguyen DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www
2、.landandmaritime.dla.mil/ Original date of drawing YY MM DD CHECKED BY Phu H. Nguyen TITLE MICROCIRCUIT, LINEAR, 1.2 GHz CLOCK DISTRIBUTION IC, 1.6 GHz INPUTS, DIVIDERS, FIVE OUTPUTS, MONOLITHIC SILICON 13-01-17 APPROVED BY Thomas M. Hess SIZE A CODE IDENT. NO. 16236 DWG NO. V62/12656 REV PAGE 1 OF
3、23 AMSC N/A 5962-V041-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/12656 REV PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high perfo
4、rmance 1.2 GHz clock distribution IC, 1.6 GHz inputs, dividers, five outputs microcircuit, with an operating temperature range of -55C to +85C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administr
5、ative control number for identifying the item on the engineering documentation: V62/12656 - 01 X E Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 AD9512-EP 1.2 GHz clock distribution IC, 1.6 GHz in
6、puts, dividers, five outputs 1.2.2 Case outline(s). The case outlines are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 48 JEDEC MO-220-VKKD-2 Lead Frame Chip Scale Package 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provi
7、ded by the device manufacturer: Finish designator Material A Hot solder dip B Tin-lead plate C Gold plate D Palladium E Gold flash palladium Z Other Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDEN
8、T NO. 16236 DWG NO. V62/12656 REV PAGE 3 1.3 Absolute maximum ratings. 1/ VS with respect to GND -0.3 V to +3.6 V DSYNC/DSYNCB with respect to GND . -0.3 V to VS+ 0.3 V RSET with respect to GND . -0.3 V to VS+ 0.3 V CLK1, CLK1B, CLK2, CLK2B with respect to GND . -0.3 V to VS+ 0.3 V CLK1 with respect
9、 to CLK1B . -1.2 V to +1.2 V CLK2 with respect to CLK2B . -1.2 V to +1.2 V SCLK, SDIO, SDO, CSB with respect to GND -0.3 V to VS+ 0.3 V OUT0, OUT1, OUT2, OUT3, OUT4 with respect to GND . -0.3 V to VS+ 0.3 V FUNCTION with respect to GND . -0.3 V to VS+ 0.3 V SYNC STATUS with respect to GND -0.3 V to
10、VS+ 0.3 V Storage temperature range . -65C to 150C Junction temperature 150C Lead temperature (10 sec) 300C 1.4 Thermal characteristics. Thermal resistance 2/ Case outline JAUnit Case X 28.5 C/W 2. APPLICABLE DOCUMENTS JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JEP95 Registered and Standard Ou
11、tlines for Semiconductor Devices JESD51-7 High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10th Street, Suite 240S, Arlington, VA 22201.
12、) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, CAGE code, or logo B. Pin 1 identifier C. ESDS identification (optional) 1/ Stresses beyond those listed under “absolute maxim
13、um ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute maximum rated conditions for extended peri
14、ods may affect device reliability. 2/ Thermal impedance measurements were taken on a 4-layer board in still air, in accordance with EIA/JESD51-7. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT N
15、O. 16236 DWG NO. V62/12656 REV PAGE 4 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electrical performance characteristics ar
16、e as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1. 3.5.2 Terminal connections. The ter
17、minal connections shall be as shown in figure 2. 3.5.3 Terminal function. The terminal function shall be as shown in figure 3. 3.5.4 Functional block diagram. The functional block diagram shall be as shown in figure 4. 3.5.5 LVPECL differential output swing vs frequency. The LVPECL differential outp
18、ut swing vs frequency shall be as shown in figure 5. 3.5.6 LVDS differential output swing vs frequency. The LVDS differential output swing vs frequency shall be as shown in figure 6. 3.5.7 CMOS single ended output swing vs frequency and load. The CMOS single ended output swing vs frequency and load
19、shall be as shown in figure 7. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/12656 REV PAGE 5 TABLE I. Electrical performance characteristics. 1/ Test Symbol Test conditio
20、ns 2/ Limits Unit Min Typ Max CLOCK INPUTS Clock inputs (CLK1, CLK2) 3/ Input frequency 0 1.6 GHz Input sensitivity 4/ 150 7/ mV p-p Input level 5/ 2 8/ V p-p Input common mode voltage VCM6/ 1.45 1.6 1.7 V At -40C to +85C 1.5 1.6 1.7 V Input common mode range VCMRWith 200 mV p-p signal applied, dc-c
21、oupled 1.3 1.8 V Input sensitivity, single ended CLK2 ac-coupled; CLK2B ac bypassed to RF ground 150 mV p-p Input resistance Self-biased 4.0 4.8 5.6 k Input capacitance 2 pF CLOCK OUTPUTS LVPECL clock outputs (Termination = 50 to VS 2 V) OUT0, OUT1, OUT2; Differential Output frequency Output high vo
22、ltage Output low voltage Output differential voltage VOHVOLVODOutput level 0x3D (0x3E) (0x3F)3:2 = 10b See FIGURE 5 VS 1.22 VS 2.10 660 VS 0.98 VS 1.80 810 1200 VS 0.93 VS 1.67 965 MHz V V mV LVDS clock outputs (Termination = 100 differential; default) OUT3, OUT4; Differential Output frequency Diffe
23、rential output voltage Delta VODOutput offset voltage Delta VOSShort Circuit current VOD VOSISA, ISBOutput level 0x40 (0x41)2:1 = 01b 3.5 mA termination current See FIGURE 6 At full temperature range At -40C to +85C Output shorted to GND 250 1.05 1.125 360 1.23 1.23 14 800 450 25 1.375 1.375 25 24 M
- 1.请仔细阅读文档,确保文档完整性,对于不预览、不比对内容而直接下载带来的问题本站不予受理。
- 2.下载的文档,不会出现我们的网址水印。
- 3、该文档所得收入(下载+内容+预览)归上传者、原创作者;如果您是本文档原作者,请点此认领!既往收益都归您。
下载文档到电脑,查找使用更方便
10000 积分 0人已下载
下载 | 加入VIP,交流精品资源 |
- 配套讲稿:
如PPT文件的首页显示word图标,表示该PPT已包含配套word讲稿。双击word图标可打开word文档。
- 特殊限制:
部分文档作品中含有的国旗、国徽等图片,仅作为作品整体效果示例展示,禁止商用。设计者仅对作品中独创性部分享有著作权。
- 关 键 词:
- DLADSCCVIDV62126562013MICROCIRCUITLINEAR12GHZCLOCKDISTRIBUTIONIC16GHZINPUTSDIVIDERSFIVEOUTPUTSMONOLITHICSILICONPDF

链接地址:http://www.mydoc123.com/p-689369.html