DLA DSCC-VID-V62 04711 REV B-2011 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS 3 3-V ABT 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS MONOLITHIC SILICON.pdf
《DLA DSCC-VID-V62 04711 REV B-2011 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS 3 3-V ABT 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS MONOLITHIC SILICON.pdf》由会员分享,可在线阅读,更多相关《DLA DSCC-VID-V62 04711 REV B-2011 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS 3 3-V ABT 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS MONOLITHIC SILICON.pdf(12页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONSLTR DESCRIPTION DATE APPROVEDA Add new device case outline Y. Update boilerplate to current revision. - CFS 04-11-22 Thomas M. Hess B Update boilerplate paragraphs to current requirements. - PHN 11-06-14 David J. Corbett CURRENT DESIGN ACTIVITY CAGE CODE 16236 HAS CHANGED NAMES TO: DLA LAN
2、D AND MARITIME COLUMBUS, OHIO 43218-3990 Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV B B B B B B B B B B B B PAGE 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Charles F. Saffle DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO Original date o
3、f drawing CHECKED BY Charles F. Saffle TITLE MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 3.3-V ABT 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS, MONOLITHIC SILICON YY-MM-DD 04-04-23 APPROVED BY Thomas M. Hess SIZE A CODE IDENT. NO. 16236 DWG NO. V62/04711 REV B PAGE 1 OF 12 AMSC N/A
4、 5962-V047-11 .Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04711 REV B PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high per
5、formance 3.3-V ABT 16-bit edge-triggered D-type flip-flop with 3-state outputs microcircuit, with an operating temperature range of -40C to +85C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an adminis
6、trative control number for identifying the item on the engineering documentation: V62/04711 - 01 X E Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 SN74LVTH16374-EP 3.3-V ABT 16-bit edge-triggered
7、D-type flip-flop with 3-state outputs 1.2.2 Case outline. The case outline are as specified herein. Outline letter Number of pins JEDEC PUB 95 Package style X 48 MO-153 Plastic small-outlineY 48 MO-118 Plastic small-outline 1.2.3 Lead finishes. The lead finishes are as specified below or other lead
8、finishes as provided by the device manufacturer: Finish designator Material A Hot solder dip B Tin-lead plateC Gold plateD PalladiumE Gold flash palladium Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO
9、SIZE A CODE IDENT NO. 16236 DWG NO. V62/04711 REV B PAGE 3 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) . -0.5 V to 4.6 V Input voltage range (VI) . -0.5 V to 7 V 2/ Voltage range applied to any output in the high-impedance or power-off state (VO) . -0.5 V to 7 V 2/ Voltage range appl
10、ied to any output in the high state (VO) . -0.5 V to VCC+ 0.5 V 2/ Current into any output in the low state (IO) . 128 mA Current into any output in the high state (IO) . 64 mA 3/ Input clamp current (IIK) (VI 0) -50 mA Output clamp current (IOK) (VO 0) . -50 mA Package thermal impedance (JA) . 70C/
11、W 4/ Storage temperature range (TSTG) . -65C to 150C 1.4 Recommended operating conditions. 5/ Supply voltage range (VCC) . 2.7 V to 3.6 V Minimum high level input voltage (VIH) 2.0 V Maximum low level input voltage (VIL) . 0.8 V Maximum input voltage (VI) . 5.5 V Maximum high level output current (I
12、OH) . -32 mA Maximum low level output current (IOL) . 64 mA Maximum input transition rise or fall rate (t/v) (Outputs enabled) 10 ns/V Minimum power-up ramp rate (t/VCC) 200 s/V Operating free-air temperature range (TA) -40C to +85C 1/ Stresses beyond those listed under “absolute maximum ratings” ma
13、y cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect
14、 device reliability. 2/ The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 3/ This current flows only when the output is in the high state and VO VCC. 4/ The package thermal impedance is calculated in accordance with JESD 51-7. 5
15、/ All unused control inputs of the device must be held at VCCor GND to ensure proper device operation. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04711 REV B
16、PAGE 4 2. APPLICABLE DOCUMENTS JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JEDEC PUB 95 Registered and Standard Outlines for Semiconductor Devices JEDEC STD 51-7 High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages (Copies of these documents are available online at h
17、ttp:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10th Street, Suite 240S, Arlington, VA 22201.) 3. REQUIREMENTS 3.1 Marking. Parts shall be permanently and legibly marked with the manufacturers part number as shown in 6.3 herein and as follows: A. Manufacturers name, C
18、AGE code, or logo B. Pin 1 identifier C. ESDS identification (optional) 3.2 Unit container. The unit container shall be marked with the manufacturers part number and with items A and C (if applicable) above. 3.3 Electrical characteristics. The maximum and recommended operating conditions and electri
19、cal performance characteristics are as specified in 1.3, 1.4, and table I herein. 3.4 Design, construction, and physical dimension. The design, construction, and physical dimensions are as specified herein. 3.5 Diagrams. 3.5.1 Case outline. The case outline shall be as shown in 1.2.2 and figure 1. 3
20、.5.2 Truth table. The truth table shall be as shown in figure 2. 3.5.3 Logic diagram. The logic diagram shall be as shown in figure 3. 3.5.4 Terminal connections. The terminal connections shall be as shown in figure 4. 3.5.5 Test circuit and timing waveforms. The test circuit and timing waveforms sh
21、all be as shown in figure 5. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/04711 REV B PAGE 5 TABLE I. Electrical performance characteristics. 1/ Test Symbol Con
22、ditions VCCTemperature, TADevice type Limits Unit Min Max Input clamp voltage VIKII= -18 mA 2.7 V 25C, -40C to 85C All -1.2 V High level output voltage VOHIOH= -100 A 2.7 V to 3.6 V VCC 0.2 V IOH= -8 mA 2.7 V 2.4 IOH= -32 mA 3 V 2 Low level output voltage VOLIOL= 100 A 2.7 V 0.2 V IOL= 24 mA 0.5 IOL
23、= 16 mA 3 V 0.4 IOL= 32 mA 0.5 IOL= 64 mA 0.55 Input current IIVI= 5.5 V 0 V or 3.6 V 10 A Control inputs. VI= VCCor GND 3.6 V 1 Data inputs. VI= VCC1 Data inputs. VI= 0 V -5 Input/output power-off leakage current IoffVIor VO= 0 to 4.5 V 0 V 100 A Input current (hold) II(hold)Data inputs, VI= 0.8 V
24、3 V 75 AData inputs, VI= 2 V -75 Data inputs. VI= 0 V to 3.6 V 3.6 V 2/ 500 3-state output leakage current high IOZHVO= 3 V 3.6 V 5 A3-state output leakage current low IOZLVO= 0.5 V 3.6 V -5 A3-state output current power-up IOZPUVO= 0.5 V to 3 V OE = dont care 0 V to 1.5 V 100 A 3-state output curre
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