DLA DSCC-DWG-88009 REV E-2007 RESISTOR CHIP FIXED FILM TANTALUM NITRIDE STYLE 1050《固定薄膜片状含氮化钽1505型电阻器》.pdf
《DLA DSCC-DWG-88009 REV E-2007 RESISTOR CHIP FIXED FILM TANTALUM NITRIDE STYLE 1050《固定薄膜片状含氮化钽1505型电阻器》.pdf》由会员分享,可在线阅读,更多相关《DLA DSCC-DWG-88009 REV E-2007 RESISTOR CHIP FIXED FILM TANTALUM NITRIDE STYLE 1050《固定薄膜片状含氮化钽1505型电阻器》.pdf(6页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Revise section 4. Editorial changes throughout. 17 Jan 92 D. MOORE B Title change. Add marking requirements for beryllium oxide construction, editorial changes throughout. 25 Oct 93 D. MOORE C Add new resistance values. Change dash number to resistance desi
2、gnation and resistance tolerance. Editorial changes throughout. 19 Sep 94 D. MOORE D Update and validation of drawing. Editorial changes throughout. 14 Jul 00 K. COTTONGIM E Add pure tin prohibition paragraph. Editorial changes throughout. 7 Mar 07 M. Radecki CURRENT DESIGN ACTIVITY CAGE CODE 037Z3
3、DEFENSE LOGISTICS AGENCY DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO 43218-3990 Prepared in accordance with ASME Y14.100 Selected item drawing REV E E E E E E REV STATUS OF PAGES PAGES 1 2 3 4 5 6 PMIC N/A PREPARED BY Allen R. Knox DESIGN ACTIVITY: DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO 45
4、444-5000 CHECKED BY David E. Moore TITLE RESISTOR, CHIP, FIXED, FILM, APPROVED BY David E. Moore TANTALUM NITRIDE, STYLE 1050 SIZE A CODE IDENT. NO. 14933 DWG NO. 88009 Original date of drawing: 27 May 1988 REV E PAGE 1 OF 6 AMSC N/A 5905-E609Provided by IHSNot for ResaleNo reproduction or networkin
5、g permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88009 REV E PAGE 2 1. SCOPE 1.1 Scope. This drawing describes the requirements for a .10 x .05 fixed, tantalum chip, resistor. 1.2 Part or Identifying Number (PIN). The complete
6、 PIN is as follows: 88009 - * * | | | | | | Drawing number Resistance (3.3.1) Tolerance (3.3.2) 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specifie
7、d herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-55342 - Resistors, Fixed, Film, Chip, Nonestablished Reliability, Established Reliability, Space Level, General Specification For. DEPARTME
8、NT OF DEFENSE STANDARD MIL-STD-790 - Standard Practice for Established Reliability and High Reliability Qualified Products List (QPL) System of Electrical, Electronic, and Fiber Optic Parts Specifications. MIL-STD-1285 - Marking of Electrical and Electronic Parts. (Copies of these documents are avai
9、lable online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this document and the references
10、 cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-55342 an
11、d as specified herein. 3.2 Interface and physical dimensions. The resistor shall meet the interface and physical dimensions as specified in MIL-PRF-55342 and herein (see figure 1). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SU
12、PPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88009 REV E PAGE 3 Inches mm .005 0.13 .010 0.25 .017 0.43 .050 1.27 .100 2.54 NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. Unless otherwise specified, tolerances are .003 (0.08 mm).
13、FIGURE 1. Leadless chip carrier. 3.3 Electrical characteristics. 3.3.1 Resistance. The nominal resistance expressed in ohms is identified by four digits; the first three digits represent significant figures and the last digit specifies the number of zeros to follow. When the value of resistance is l
14、ess than 100 ohms, or when fractional values of an ohm are required, the letter ”R” shall be substituted for one of the significant digits to represent the decimal point. 3.3.1.1 Resistance range. The resistance range shall be 4.3 ohms to 500 ohms. Note: Values of less than 10 ohms are only availabl
15、e in (K) 10 percent tolerance. 3.3.2 Resistance tolerance. Resistors are available in (F) 1 percent, (G) 2 percent, (J) 5 percent, and (K) 10 percent (see 3.3.1.1). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONIC SUPPLY CENTER DAYT
16、ON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88009 REV E PAGE 4 3.3.3 Power rating. The power rating at 25oC shall be 10 watts. Maximum film temperature is 150oC. Power ratings are based on 100oC heat sink temperature and a single edge wraparound termination to a ground plane. 3.3.4 Thermal resistan
17、ce. Thermal resistance (RO) shall be 12. RO is the thermal resistance in oC/W between film and mounting surface. 3.3.5 Resistance temperature coefficient. The resistance temperature coefficient shall be 100 ppm/oC. 3.3.6 Operating temperature. The operating temperature shall be -55oC to +125oC. 3.3.
18、7 DC resistance. When resistors are tested as specified in 4.6, the dc resistance shall be within the specified tolerance of the nominal resistance. 3.3.8 Terminations. The terminations shall be in accordance with MIL-PRF-55342 (termination B). 3.3.8.1 Pure tin. The use of pure tin, as an underplate
19、 or final finish is prohibited both internally and externally. Tin content of resistor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass (see 6.3). 3.3.9 Short time overload. When resistors are tested as specific in 4.7, the ch
20、ange in resistance shall not exceed 2 percent. 3.3.10 Life. When resistors are tested as specified in 4.8, there shall be no evidence of mechanical damage. The change in resistance shall not exceed 0.5 percent. 3.4 Marking. Marking of the individual chip resistors is not required; however, each unit
21、 package shall be in accordance with MIL-STD-1285, and include the PIN as specified in 1.2, with the manufacturers name or Commercial and Government Entity (CAGE) code, and date lot codes. 3.4.1 Package marking for Beryllium Oxide. Manufacturers which use beryllium oxide in their construction shall
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