DLA DSCC-DWG-03010 REV D-2013 RESISTOR FIXED FILM CHIP SURFACE MOUNTED ULTRA PRECISION STYLE 1506.pdf

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1、 REVISIONS LTR DESCRIPTION DATE APPROVED A In accordance with NOR 5905-R008-03 24 Feb 2003 Kendall A Cottongim B Part number addition. Current DoD requirements. Editorial changes throughout 09 Aug 2007 M. Radecki C Vendor recommended changes. Current DoD requirements. 06 Aug 2009 M. Radecki D Vendor

2、 address change. Add new vendor. Editorial changes throughout. 1 Mar 2013 M. Radecki Prepared in accordance with ASME Y14.100 Source Control Drawing REV STATUS OF PAGES REV D D D D D D D D PAGES 1 2 3 4 5 6 7 8 PMIC N/A Original date of drawing 13 February 2003 PREPARED BY Jesus V. Garcia III DEFENS

3、E SUPPLY CENTER, COLUMBUS COLUMBUS, OH CHECKED BY Andrew Ernst TITLE RESISTOR, FIXED, FILM, CHIP, SURFACE MOUNTED, ULTRA PRECISION, STYLE 1506 APPROVED BY Kendall A. Cottongim SIZE A CODE IDENT. NO. 037Z3 DWG NO. 03010 REV D PAGE 1 OF 8 AMSC N/A 5905-2012-E02CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 H

4、AS CHANGED NAMES TO: DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03010 REV D PAGE 2 1. SCOPE 1.1 Scope. This drawin

5、g describes the requirements for a bulk metal, ultra precision, surface mounted, fixed, film, chip resistor, style 1506. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 03010 - * * * Drawing number Resistance value (see 3.3.1) Tolerance (see 3.3.3) Power

6、rating (see 3.3.4) 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications and standards. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in th

7、e solicitation or contract (see 6.2). DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-55342 - Resistors, Fixed, Film, Chip, Nonestablished Reliability, Established Reliability, SpaceLevel, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-690 - Failure Rate Sampling Plans and Procedures

8、. MIL-STD-790 - Standard Practice for Established Reliability and High Reliability Qualified ProductsList (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specifications. (Copies of these documents are available online at https:/assist.dla.mil/quicksearch/ or from the DLA Document Ser

9、vice, Building 4D, 700 Robbins Avenue, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this document and the references cited herein (except for related specification sheets), the text of this doc

10、ument takes precedence unless otherwise noted. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be as specified herein. 3.2 Interface and physical

11、 dimensions. The interface and physical dimensions shall be as specified in MIL-PRF-55342 and herein (see figure 1). Passivation is not applicable, however, a protective coating over the element shall be provided. Provided by IHSNot for ResaleNo reproduction or networking permitted without license f

12、rom IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03010 REV D PAGE 3 L W T (max) D Inch 0.150 mm 3.81 Inch 0.062 mm 1.57 Inch 0.025 mm 0.64 Inch 0.020 mm 0.50 NOTES: 1. Dimensions are in Inches. Metric equivalents are given for general information only. 2

13、. The pictorial view of the styles above is given as representative of the envelope of the item. Slight deviations from the outline shown, which are contained within the envelope and do not alter the functional aspects of the device, are acceptable. 3. Tolerances shall be +/- 0.005 inch (+/- 0.13 mm

14、) unless otherwise specified. 4. The bottom view shown above represents the mounting side. FIGURE 1. Chip resistor. 3.3 Electrical characteristics. 3.3.1 Resistance. The nominal resistance expressed in ohms is identified by six characters, consisting of five digits and a letter. The letter is used s

15、imultaneously as a decimal point and as a multiplier. For resistance values: a. Greater than or equal to 1 ohm but less than 1,000 ohms, the letter “R“ is used to represent a decimal point. b. Greater than or equal to 1,000 ohms but less than 1 megohm, the letter “K“ is used to represent a decimal p

16、oint. All digits preceding and following the letters (R or K) of the group represent significant figures. The resistance value designations are shown in table I. Minimum and maximum resistance values shall be as specified herein. The standard values for every decade shall follow the sequence specifi

17、ed in the 10 to 100 decade table of MIL-PRF-55342 for resistance tolerances D and F. The resistance values for tolerances T (inactive for new design), Q, A, B, and C may be any value within the limits specified herein, but it is preferred that values be chosen from the “B“ column of the 10 to 100 de

18、cade table of MIL-PRF-55342. The resistance values for tolerance D shall follow the standard values listed under tolerance B of MIL-PRF-55342. Uncoated Ceramic Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS,

19、OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03010 REV D PAGE 4 TABLE I. Designation of resistance values. Designation Resistance ohms 10R000 to 99R999 incl. 10 to 99.999 incl. 100R00 to 999R99 incl. 100 to 999.99 incl. 1K0000 to 9K9999 incl. 1000 to 9,999.9 incl. 10K000 to 25K000 incl. 10,000 to 25,000

20、 incl. 3.3.2 Resistance range and resistance temperature characteristic. The resistance range shall be from 10 ohms to 25 kilohms. The corresponding resistance temperature characteristic is specified in table II. Table II. Resistance range and resistance temperature characteristic. Resistance range

21、Resistance Temperature Characteristic (RTC) in ppm/OC Power rating (see 3.3.4) 250 - 40K 4 BLANK 1/ 50 - 250 5 25 - 50 6 10 - 25 8 5 - 10 12 100 - 40K 2 A 1/ 50 - 100 3 10 - 50 4 250 - 25K 4 B 50 - 250 5 25 - 50 6 10 - 25 8 100 - 25K 3 C 50 - 100 4 10 - 50 5 1/ Inactive for new design with correspon

22、ding resistance range and RTC. 3.3.3 Resistance tolerance. Resistors are available in resistance tolerances as specified in table III. TABLE III. Resistance tolerance. Symbol Resistance tolerance percent Available resistance range T 1/ 0.01 250 to 40K Q 0.02 A 0.05 100 to 25K B 0.1 50 to 25K C 0.25

23、25 to 25K D 0.5 10 to 25K F 1.0 1/ Inactive for new design Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03010 REV D PAGE 5 3.3.4 Power and voltage rating. The power

24、 rating is at 70OC derated to +150OC at zero power (see figure 2) and is specified in table IV Table IV. Power and voltage rating Symbol Maximum power rating (mWatts) Voltage (in volts) (blank) 1/ 200 E=PR E = Voltage P = Power R = Resistance A 1/ 300 B 200 C 300 1/ Inactive for new design FIGURE 2.

25、 Derating curve. 3.3.5 Termination. The termination material shall be in accordance with MIL-PRF-55342, code letter B. 3.3.6 Pure tin. The use of pure tin, as an underplate or final finish, is prohibited both internally and externally. Tin content of resistor components and solder shall not exceed 9

26、7 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass (see 6.3). 3.4 Thermal shock. When resistors are tested as specified in MIL-PRF-55342 for thermal shock the change in resistance shall not exceed 0.03 percent +0.01 ohm. 3.5 Low temperature operation. When resistors a

27、re tested as specified in MIL-PRF-55342 for low temperature operation the change in resistance shall not exceed 0.03 percent +0.01 ohm. 3.6 Short time overload. When resistors are tested as specified in MIL-PRF-55342 for short time overload the change in resistance shall not exceed 0.02 percent +0.0

28、1 ohm. 3.7 High temperature exposure. When resistors are tested as specified in MIL-PRF-55342 for high temperature exposure the change in resistance shall not exceed 0.03 percent +0.01 ohm. 3.8 Resistance to soldering heat. When resistors are tested as specified in MIL-PRF-55342 for resistance to so

29、ldering heat the change in resistance shall not exceed 0.02 percent +0.01 ohm. 3.9 Moisture resistance. When resistors are tested as specified in MIL-PRF-55342 for moisture resistance the change in resistance shall not exceed 0.1 percent +0.01 ohm. -65 -50 -25 0 25 50 75 100 125 150 175 100 80 60 40

30、 20 0 Percentofrated power70OC -55OC Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 03010 REV D PAGE 6 3.10 Life. When resistors are tested as specified in MIL-PRF-55

31、342 for life the change in resistance shall not exceed 0.05 percent +0.01 ohm. 3.11 Resistance temperature characteristic. When resistors are tested as specified in MIL-PRF-55342 except the RTC shall not exceed the values specified (see 3.3.2). 3.12 Marking. Marking is not required on this resistor;

32、 however, each waffle pack shall be marked with the PIN assigned herein (see 1.2), the manufacturers identification code, the date code, and the lot code. At the option of the manufacturer, the resistor may be marked (i.e., laser, color dot, etc.). The marking shall remain legible after all tests. 3

33、.13 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible provided that the material meets or exceeds the operational and maintenance requirements and promotes economically advantageous

34、 life cycle costs. 3.14 Manufacturer eligibility. To be eligible for listing as an approved source of supply, a manufacturer shall be listed on the MIL-PRF-55342 Qualified Product List for at least one part, or perform the group A and group B inspections specified herein on a sample of parts agreed

35、upon by the manufacturer and DLA Land and Maritime, ATTN: VA. 3.14.1 Certificate of compliance. A certificate of compliance shall be required from manufacturers requesting to be listed as approved sources of supply. 3.15 Workmanship. Resistors shall be processed in such a manner as to be uniform in

36、quality and be free from defects that will affect life, serviceability, or appearance. 4. VERIFICATION 4.1 Product assurance program. The product assurance program specified in MIL-PRF-55342 and maintained in accordance with MIL-STD-790 is not applicable to this document. 4.2 Qualification inspectio

37、n. Qualification inspection in accordance with MIL-PRF-55342 is not applicable to this document 4.3 Product level qualification. The product level qualification specified in MIL-PRF-55342 and MIL-STD-690 is not applicable to this document. 4.4 Conformance inspection. 4.4.1 Inspection of product for

38、delivery. Inspection of product for delivery shall consist of group A inspection (ER level only. PPM reporting, subgroup 1, subgroup 3, are not applicable) and group B inspection of MIL-PRF-55342. 4.4.1.1 Certification. The procuring activity may accept a certificate of compliance in lieu of Group B

39、 inspection. 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need to contact the responsible packaging act

40、ivity to ascertain requisite packaging requirements. Packaging requirements are maintained by the Inventory Control Points packaging activity within the Military Department or Defense Agency, or within the Military Departments Services System Command. Packaging data retrieval is available from the m

41、anaging Military Departments or Defense Agencys automated packaging files, CD-ROM products, or by contacting the responsible packaging activity. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A COD

42、E IDENT NO. 037Z3 DWG NO. 03010 REV D PAGE 7 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1 Intended use. Chip resistors are intended to be used in thick or thin film circuits where microcircuity is intended, also, for u

43、se in surface mounting application. 6.2 Ordering data. The contract or purchase order should specify the following: a. Complete PIN (see 1.2). b. Requirements for delivery: One copy of the conformance inspection data or a certificate of compliance that parts have passed conformance inspection with e

44、ach shipment of parts by the manufacturer. c. Packaging requirements (see 5.1). (i.e. Electrostatic discharge sensitive packaging). d. Whether the manufacturer performs the group B tests or provides certificate of compliance with group B (see 4.4.1.1). 6.3 Tin whisker growth. The use of alloys with

45、tin content greater than 97 percent, by mass, may exhibit tin whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture and can develop under typical operating conditions, on products that use such materials. Conformal coatings applied over top o

46、f a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass, have shown to inhibit the growth of tin whiskers. For additional information on this matter, refer to ASTM-B545 (Standard Specification for Electrodeposited Coatings of Tin). 6.4 Tolerance ca

47、ution. Soldering temperature used during installation may cause resistance to shift up to 0.01 percent. 6.5 Recommended mounting. A low profile solder fillet is recommended (25 percent to 85 percent of chip “T“ dimension). IR, vapor phase, and convection reflow are recommended. The resistance elemen

48、t must be mounted in the up position to prevent failure of the part. 6.6 Electrostatic charge. Under several combinations of conditions, these resistors can be electrically damaged, by electrostatic charges, and drift from specified value. Users should consider this phenomena when ordering or shippi

49、ng resistors. Direct shipment to Government is controlled by MIL-DTL-39032 that specifies a preventative packaging procedure. 6.7 Pulse applications. Designers are CAUTIONED on using these resistors in pulse applications. Since they have not been qualified nor tested for such applications, damage and premature failure are possi