DLA DESC-DWG-84087 REV J-2008 DELAY LINES 1 TO 5 TAPS 14-PIN DIP COMPATIBLE T2L INTERFACED《延迟线 1到5个搭接处 14针DIP兼容 T2L连接》.pdf

《DLA DESC-DWG-84087 REV J-2008 DELAY LINES 1 TO 5 TAPS 14-PIN DIP COMPATIBLE T2L INTERFACED《延迟线 1到5个搭接处 14针DIP兼容 T2L连接》.pdf》由会员分享，可在线阅读，更多相关《DLA DESC-DWG-84087 REV J-2008 DELAY LINES 1 TO 5 TAPS 14-PIN DIP COMPATIBLE T2L INTERFACED《延迟线 1到5个搭接处 14针DIP兼容 T2L连接》.pdf（15页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Added a second source for dash numbers 37 through 61. 10 Apr 1985 I.R. Jones B Added dash numbers 62 through 66. 02 May 1985 I.R. Jones C Added dash numbers 67 through 77. Editorial changes. 06 Aug 1987 Randy Larson D Replaced MIL-D-23859 references with MI

2、L-PRF-83532. Changed pin length dimensions. Added note 4 to figure 1. Added three vendors. Editorial changes throughout. J.W. 07 Oct 1988 Randy Larson E Changed thermal shock requirements. Added two vendors. Editorial changes throughout. B.B. 29 Aug 1989 D.E. Morgan F Changed tolerance on .300 dimen

3、sion between lead rows (figure 1, all configurations). Added one vendor. Added “Inactive“ notice to page 1. Editorial changes throughout. J.W. 11 Sep 1990 Randy Larson G Changed paragraphs 3.6 and 3.8.1. Editorial changes throughout. J.W. 26 Aug1991 R. Gosciniak H Changes in accordance with NOR 5999

4、-R001-92 09 Sep 1992 D. Moore J Editorial changes made throughout. 18 Sep 2008 Michael A. Radecki Prepared in accordance with ASME Y14.100 Source control drawing REV J J J J J J J J J J J J J J J REV STATUS OF PAGES PAGES 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 PMIC N/A PREPARED BY Christopher A. Rauch

5、DESIGN ACTIVITY DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OH 45444-5000 CHECKED BY Randy Larson APPROVED BY Ivan R. Jones TITLE DELAY LINES, 1 TO 5 TAPS, 14-PIN DIP COMPATIBLE, T2L INTERFACED SIZE A CODE IDENT. NO. 14933 DWG NO. 84087 Original date of drawing 84-09-04 REV J PAGE 1 OF 15 AMSC N/A 599

6、9-E217INACTIVE FOR NEW DESIGN Delay lines contained herein which have qualified MIL-PRF-83532 sources are inactive for new design effective on the date of Revision F. Delay lines not covered by MIL-PRF-83532 may continue to be procured to this drawing. CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 DEFENSE

7、 LOGISTICS AGENCY DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-CODE IDENT NO. 14933 DWG NO. 84087 DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A REV J SHEET 2 1. SCOPE 1.1 Scope. This

8、 drawing describes the requirements for a family of delay lines, 1 to 5 taps, 14-pin DIP compatible. 1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown in the following example: 84087 -01 Drawing number Dash number (See table I) 2. APPLICABLE DOCUMENTS 2.1 General. The document

9、s listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list,

10、document users are cautioned that they must meet all specified requirements of documents in sections 3 and 4 of this specification, whether or not they are listed. 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a

11、part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-DTL-31000 - Technical Data Packages. MIL-DTL-19491 - Semiconductor Device, Packaging of. MIL-PRF-8

12、3532 - Delay Lines, Active, General Specification for. DEPARTMENT OF DEFENSE STANDARD MIL-STD-202 - Electronic and Electrical Component Parts. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil/ or from the Standardization Document

13、Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Non-Government publications. The following documents form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.

14、AMERICAN SOCIETY FOR TESTING AND MATERIALS INTERNATIONAL (ASTM) ASTM-B339 - Pig Tin. ASTM-B545 - Electrodeposited Coatings of Tin. (Copies of this document are available on www.astm.org or from American Society for Testing and Materials International (ASTM), 100 Barr Harbor Drive, P. O. Box C700, We

15、st Conshohocken, PA, 19428-2959.) 2.4 Order of precedence. In the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exempti

16、on has been obtained. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-CODE IDENT NO. 14933 DWG NO. 84087 DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A REV J SHEET 3 3. REQUIREMENTS 3.1 Interpretation. This drawing shall be interpreted in acco

17、rdance with MIL-DTL-31000. 3.2 Case material. Case material shall be in accordance with MIL-PRF-83532. 3.3 Dimensions and configurations. See figure 1. 3.4 Terminal material. Terminal material shall be copper, nickel, or alloy 42, tin plated in accordance with ASTM-B339 or ASTM-B545. 3.5 Temperature

18、 coefficient of delay (dash numbers -01 through -36 only). 2 ns + 500 ppm/C maximum at output. 3.6 Delay times. See table I. 3.7 Delay tolerance. 2 ns or 5 percent, whichever is greater. 3.7.1 Delay variance (dash numbers -37 through -77 only). Delay variance shall be 2 ns or 2 percent, whichever is

19、 greater, over the temperature range of -55C to +125C at 5 V dc (supply voltage) 10 percent. 3.8 Rise time. Rise time at any tap shall be 4 ns maximum. 3.9 Pulse width. Minimum operating pulse width shall be 20 percent of total delay time and maximum operating duty cycle is 50 percent. 3.10 Supply v

20、oltage (VCC). 4.5 V dc to 5.5 V dc. 3.11 Logic 1 input current. 50 A maximum. 3.12 Logic 0 input current. -2 mA maximum. 3.13 Logic 1, VOUT. 2.5 V minimum. 3.14 Logic 0, VOUT. 0.5 V maximum. 3.15 Logic 1 fan-out. 20/tap maximum (1 tap is capable of driving 20 TTL inputs). 3.16 Logic 0 fan-out. 10/ta

21、p maximum (1 tap is capable of driving 10 TTL inputs). 3.17 Power dissipation. 385 mW maximum at any tap. 3.18 Thermal shock. Method 107, MIL-STD-202, test condition B-1, 15 minutes at temperature extremes. Five minutes at +25C following each extreme condition. 3.19 Sealing. As specified in MIL-PRF-

22、83532. 3.20 Terminal strength. MIL-STD-202, method 211, test condition C and in accordance with MIL-PRF-83532. 3.21 Vibration. MIL-STD-202, method 204, test condition B and in accordance with MIL-PRF-83532. 3.22 Shock. MIL-STD-202, method 213, test condition D and in accordance with MIL-PRF-83532. 3

23、.23 Immersion. MIL-STD-202, method 104, test condition A and in accordance with MIL-PRF-83532. 3.24 Moisture resistance. As specified in MIL-PRF-83532. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-CODE IDENT NO. 14933 DWG NO. 84087 DEFENSE ELECTRO

24、NICS SUPPLY CENTER DAYTON, OHIO SIZE A REV J SHEET 4 3.25 Solderability. As specified in MIL-PRF-83532. 3.26 Resistance to solvents. As specified in MIL-PRF-83532. 3.27 Operating temperature range. -55C to +125C. 3.28 Storage temperature. -65C to +130C. 3.29 Recycled, recovered, or environmentally p

25、referable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible, provided that the material meets or exceeds the operational and maintenance requirements, and promotes economically advantageous life cycle costs. 3.30 Manufacturer eligib

26、ility. To be eligible for listing as an approved source of supply, a manufacturer shall be listed on the MIL-PRF-83532 Qualified Product List for at least one part, or perform the group A and group B inspections specified herein on a sample of parts agreed upon by the manufacturer and DSCC-VA. 3.31

27、Certificate of compliance. A certificate of compliance shall be required from manufacturers requesting to be an approved source of supply. 3.32 Pure tin. The use of pure tin, as an underplate or final finish is prohibited both internally and externally. Tin content of resistor components and solder

28、shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3 percent lead, by mass (see 6.3). 3.33 Marking. Marking shall be in accordance with MIL-PRF-83532, except the military PIN shall be as specified in 1.2 herein. 3.34 Workmanship. Parts shall be free of flash pits, voids, an

29、d excessive mold marks. Visible parting lines are acceptable. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Unless otherwise specified, sampling and inspection procedures shall be performed in accordance with Inspection of product for delivery shall consist of compliance with the grou

30、p A inspection of MIL-PRF-83532. 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in MIL-DTL-19491, the contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need to co

31、ntact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are maintained by the Inventory Control Points packaging activities within the Military Service or Defense Agency, or within the military services system commands. Packaging data retrieval is availab

32、le from the managing Military Departments or Defense Agencys automated packaging files, CD-ROM products, or by contacting the responsible packaging activity Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-CODE IDENT NO. 14933 DWG NO. 84087 DEFENSE EL

33、ECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A REV J SHEET 5 FIGURE 1. Dimensions and configurations. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-CODE IDENT NO. 14933 DWG NO. 84087 DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A REV J SHEET 6

34、FIGURE 1. Dimensions and configurations - Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-CODE IDENT NO. 14933 DWG NO. 84087 DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A REV J SHEET 7 FIGURE 1. Dimensions and configurations - Cont

35、inued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-CODE IDENT NO. 14933 DWG NO. 84087 DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A REV J SHEET 8 Inches mm Ltr Min Max Min Max A - .820 - 20.83 B - .410 - 10.41 C - .360 - 9.14 D .295 .305

36、7.49 7.75 E .015 - 0.38 - F .125 .200 3.18 5.08 G .018 .022 0.46 0.56 H .095 .105 2.41 2.67 J .010 .014 0.25 0.35 K .145 .155 3.68 3.94 L .290 .310 7.37 7.87 NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information only. 3. Black dot represents the location of pin

37、1. 4. Location and shape of standoffs are optional. Height shall be as indicated. 5. Leads shall be free of case meniscus and other foreign material and shall be solderable for a minimum of .010 inches above the seating plane of the delay line. FIGURE 1. Dimensions and configurations - Continued. Pr

38、ovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-CODE IDENT NO. 14933 DWG NO. 84087 DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A REV J SHEET 9 TABLE I. PINs and delay values. PIN 84087- Delay at pin 12 (ns) Delay at pin 4 (ns) Delay at pin 10 (

39、ns) Delay at pin 6 (ns) Delay at pin 8 (ns) Number of delays Configuration 01 02 03 04 10 20 30 40 05 06 07 08 50 60 80 100 09 10 11 12 13 N/A N/A N/A N/A 150 200 300 400 500 1 A 14 15 16 17 10 20 25 30 20 40 50 60 18 19 20 21 40 50 75 100 80 100 150 200 22 23 24 25 N/A N/A 150 200 250 65 N/A 300 40

40、0 500 110 2 B 26 27 28 29 30 5 10 15 20 25 10 20 30 40 50 15 30 45 60 75 20 40 60 80 100 25 50 75 100 125 31 32 33 34 30 40 50 60 60 80 100 120 90 120 150 180 120 160 200 240 150 200 250 300 35 36 80 100 160 200 240 300 320 400 400 500 5 C Provided by IHSNot for ResaleNo reproduction or networking p

41、ermitted without license from IHS-,-,-CODE IDENT NO. 14933 DWG NO. 84087 DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A REV J SHEET 10 TABLE I. PINs and delay values - Continued. PIN 84087- Delay at pin 12 (ns) Delay at pin 4 (ns) Delay at pin 10 (ns) Delay at pin 6 (ns) Delay at pin 8 (ns) N

42、umber of delays Configuration 37 38 39 40 10 20 30 40 41 42 43 44 50 60 80 100 45 46 47 48 49 N/A N/A N/A N/A 150 200 300 400 500 1 A 50 51 52 53 10 20 25 30 20 40 50 60 54 55 56 57 40 50 75 100 80 100 150 200 58 59 60 61 N/A N/A 150 200 250 65 N/A 300 400 500 110 2 B 62 63 64 65 66 N/A N/A N/A N/A

43、600 700 800 900 1,000 1 A 67 68 69 70 71 72 73 74 75 N/A N/A 15 30 45 60 75 90 120 150 300 20 40 60 80 100 120 160 200 400 25 50 75 100 125 150 200 250 500 3 D 76 77 N/A N/A N/A N/A 675 725 1 A Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-CODE IDE

44、NT NO. 14933 DWG NO. 84087 DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A REV J SHEET 11 6. NOTES 6.1 Intended use. Devices conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not

45、available for OEM application. 6.2 Ordering data. The contract or purchase order should specify the following: a. Complete PIN (see 1.2). b. Requirements for delivery of one copy of the conformance inspection data or certificate of compliance that parts have passed conformance inspection with each s

46、hipment of parts by the manufacturer. c. Requirements for packaging and packing. 6.3 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufactur

47、e and can develop under typical operating conditions, on products that use such materials. Conformal coatings applied over top of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass, have shown to inhibit the growth of tin whiskers. For additiona

48、l information on this matter, refer to ASTM-B545 (Standard Specification for Electrodeposited Coatings of Tin). 6.4 Users of record. Coordination of this document for future revisions is coordinated only with the approved source(s) of supply and the users of record of this document. Requests to be added as a recorded user of this drawing may be achieved online at mailto:relaydla.mil or if in writing to: Defense Supply Center, Columbus, ATTN: DSCC/VAT, Post Office Box 3990