BS IEC 61000-4-36-2014 Electromagnetic compatibility (EMC) Testing and measurement techniques IEMI immunity test methods for equipment and systems《电磁兼容性 (EMC) 试验和测量技术 设备和系统的人为电磁干扰抗.pdf

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1、BSI Standards PublicationElectromagnetic compatibility (EMC)Part 4-36: Testing and measurement techniques IEMI immunity test methods for equipment and systemsBS IEC 61000-4-36:2014National forewordThis British Standard is the UK implementation of IEC 61000-4-36:2014.The UK participation in its prepa

2、ration was entrusted by TechnicalCommittee GEL/210, EMC - Policy committee, to Subcommittee GEL/210/12,EMC basic, generic and low frequency phenomena Standardization.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to

3、include all the necessary provisions ofa contract. Users are responsible for its correct application. The British Standards Institution 2014.Published by BSI Standards Limited 2014ISBN 978 0 580 83523 0ICS 33.100.20Compliance with a British Standard cannot confer immunity fromlegal obligations.This

4、British Standard was published under the authority of theStandards Policy and Strategy Committee on 30 November 2014.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS IEC 61000-4-36:2014IEC 61000-4-36 Edition 1.0 2014-11 INTERNATIONAL STANDARD Electromagnetic compati

5、bility (EMC) Part 4-36: Testing and measurement techniques IEMI immunity test methods for equipment and systems INTERNATIONAL ELECTROTECHNICAL COMMISSION XC ICS 33.100.20 PRICE CODE ISBN 978-2-8322-1904-1 BASIC EMC PUBLICATION Registered trademark of the International Electrotechnical Commission War

6、ning! Make sure that you obtained this publication from an authorized distributor. colourinsideBS IEC 61000-4-36:2014 2 IEC 61000-4-36:2014 IEC 2014 CONTENTS FOREWORD . 6 INTRODUCTION . 8 1 Scope 9 2 Normative references 9 3 Terms, definitions and abbreviations . 9 3.1 Terms and defintions 9 3.2 Abb

7、reviations 12 4 General . 13 5 IEMI environments and interaction . 13 5.1 General . 13 5.2 IEMI environments 14 5.2.1 Technical capability groups . 14 5.2.2 IEMI deployment scenarios 14 5.2.3 Radiated IEMI environment summary 15 5.2.4 Published conducted IEMI environments 15 5.3 Interaction with fix

8、ed installations . 16 5.3.1 General . 16 5.3.2 Protection level 17 6 Test methods . 17 6.1 Derivation of applicable test methods 17 6.2 Derivation of transfer functions . 18 6.3 Radiated tests using IEMI simulator 19 6.4 Radiated tests using a reverberation chamber 19 6.5 Complex waveform injection

9、(CWI) . 19 6.6 Damped sinusoidal injection (DSI) 19 6.7 Electrostatic discharge (ESD) . 19 6.8 Electrically fast transient (EFT) . 19 6.9 Antenna port injection . 20 7 Test parameters 20 7.1 Derivation of immunity test parameters . 20 7.2 Radiated test parameters 21 7.2.1 Generic hyperband test para

10、meters (skilled capability group) 21 7.2.2 Generic mesoband test parameters (skilled capability group). 21 7.2.3 Generic hypoband/narrowband test parameters (skilled capability group) 23 7.3 Generic conducted IEMI test parameters. 24 7.3.1 General . 24 7.3.2 Characteristics and performance of the fa

11、st damped oscillatory wave generator . 25 7.4 Tailored test level derivation . 26 7.5 Relevance of EMC immunity data . 26 8 Bibliography 27 Annex A (informative) Failure mechanisms and performance criteria . 29 A.1 General . 29 A.2 Failure mechanisms 29 A.2.1 General . 29 BS IEC 61000-4-36:2014IEC 6

12、1000-4-36:2014 IEC 2014 3 A.2.2 Noise . 30 A.2.3 Parameter offset and drifts 30 A.2.4 System upset or breakdown . 31 A.2.5 Component destruction 31 A.3 Effect of pulse width 32 A.4 Performance criteria . 32 A.5 References . 33 Annex B (informative) Developments in IEMI source environments 35 B.1 Gen

13、eral . 35 B.2 IEMI environment 36 B.3 IEMI sources . 37 B.4 Published radiated IEMI environments 41 B.4.1 IEC 61000-2-13 . 41 B.4.2 Mil-Std-464C . 41 B.4.3 The International Telecommunication Union (ITU) . 42 B.4.4 Practical determination of a tailored test level An example 42 B.5 Summary 43 B.6 Ref

14、erences . 44 Annex C (informative) Interaction with buildings . 46 C.1 Building attenuation 46 C.2 Coupling to cables 47 C.3 Low voltage cable attenuation . 48 C.4 References . 49 Annex D (informative) Relation between plane wave immunity testing and immunity testing in a reverberation chamber 51 D.

15、1 General . 51 D.2 Relation between measurements of shielding effectiveness in the two environments 52 D.3 Relation between immunity testing in the two environments 55 D.4 Additional aspects . 57 D.5 References . 57 Annex E (informative) Complex waveform injection Test method . 60 E.1 General . 60 E

16、.2 Prediction . 60 E.2.1 General . 60 E.2.2 Example 64 E.3 Construction . 66 E.4 Injection 70 E.5 Summary 72 E.6 References . 72 Annex F (informative) Significance of test methodology margins 74 F.1 General . 74 F.2 Examples 74 F.2.1 General . 74 F.2.2 Negative contributions . 75 F.2.3 Positive cont

17、ributions. 77 F.2.4 Summary . 79 F.3 References . 79 Annex G (informative) Intentional EMI The issue of jammers 80 BS IEC 61000-4-36:2014 4 IEC 61000-4-36:2014 IEC 2014 G.1 General . 80 G.2 Effects 80 G.3 Published accounts of jamming . 81 G.4 Risk assessment . 81 G.5 Mitigation 81 G.6 References .

18、82 Figure 1 Example of radiated and conducted IEMI interaction with a building 16 Figure 2 Assessment options . 18 Figure 3 Examples of ports 20 Figure 4 Typical hyperband waveform 21 Figure 5 Typical mesoband waveform 23 Figure 6 Typical hypoband/narrowband waveform 24 Figure 7 Waveform of the damp

19、ed oscillatory wave (open circuit voltage) 25 Figure A.1 IEMI induced offset of sensor output Corruption of information . 30 Figure A.2 Collision of an induced disturbance with data bits 1 31 Figure A.3 Examples of destruction on a chip 2 . 31 Figure A.4 Generic failure trend as a function of pulse

20、width 32 Figure B.1 A comparison of HPEM and IEMI spectra 6 . 35 Figure B.2 Representation of typical IEMI radiation and coupling onto systems 3 37 Figure B.3 Parameter space in power/frequency occupied by sophisticated IEMI (i.e. DEW) sources 1 38 Figure B.4 Peak power and energy from continuous an

21、d pulsed (durations shown) microwave sources, narrowband and wideband 38 Figure B.5 Peak powers of various types of pulsed HPM sources 1 39 Figure B.6 Peak vs. average power for microwave sources with duty factors indicated . 39 Figure B.7 Phase coherence leading to a compact HPM source with N2scali

22、ng of output power . 40 Figure B.8 Briefcase mesoband UWB source sold by Diehl-Rheinmetall 3 . 40 Figure B.9 A do-it-yourself electromagnetic weapon made from an oven magnetron 13 41 Figure B.10 Plot of entire narrowband system weight as a function of output microwave power for land-mobile and land-

23、transportable systems 43 Figure C.1 Typical unprotected low-rise building plane wave E-field attenuation collected from references 46 Figure C.2 Cable coupling Resonance region 48 Figure C.3 Mains cable attenuation profile . 49 Figure E.1 LLSC reference field measurement set-up 61 Figure E.2 LLSC in

24、duced current measurement set-up 62 Figure E.3 Typical LLSC magnitude-only transfer function . 62 Figure E.4 Prediction of induced current using minimum phase constraints 63 Figure E.5 IEC 61000-2-9 early-time (E1) HEMP environment . 64 Figure E.6 Overlay of transfer function and threat (frequency d

25、omain) . 65 Figure E.7 Predicted current 65 Figure E.8 Example of de-convolution result 67 BS IEC 61000-4-36:2014IEC 61000-4-36:2014 IEC 2014 5 Figure E.9 Damped sinusoidal waveforms Ten-component fit 67 Figure E.10 Approximated and predicted transient . 68 Figure E.11 Approximated and predicted tra

26、nsient (0 ns to 100 ns) 68 Figure E.12 Approximation and prediction transient Frequency domain comparison 69 Figure E.13 Variation in error for increasing number of damped sinusoids . 70 Figure E.14 Complex injection set-up . 71 Figure E.15 Amplifier requirements for various current levels . 71 Figu

27、re E.16 Comparison of predicted (green) and injected (red) current . 72 Figure F.1 Variation in induced currents as a result of configuration 75 Figure F.2 Comparison of HPD and VPD induced currents . 76 Figure F.3 System variability 76 Figure F.4 Comparison of single- and multi-port injection . 77

28、Figure F.5 Example transfer functions and worst-case envelope 78 Figure F.6 Comparison of individual and worst-case transfer function predictions 78 Figure F.7 Comparison between predicted and measured induced currents . 79 Table 1 Possible IEMI Deployment Scenarios 15 Table 2 Summary of radiated IE

29、MI source output (rEfar) by capability group 15 Table 3 Example protection levels 17 Table 4 Generic hyperband test parameters (skilled capability group) 21 Table 5 Generic mesoband test parameters (skilled capability group) 22 Table 6 Generic hypoband/narrowband test parameters (skilled capability

30、group) . 23 Table 7 Conducted IEMI test levels 24 Table 8 Open circuit specifications . 25 Table 9 Short Circuit Specifications . 26 Table A.1 Recommended performance criteria . 33 Table B.1 IEMI environments from IEC 61000-2-13 41 Table B.2 Hypoband/narrowband HPM environment. 42 Table B.3 Hyperban

31、d/wideband HPM environment . 42 Table C.1 Shielding effectiveness measurements for various power system buildings and rooms. 47 Table E.1 Time waveform norms 66 BS IEC 61000-4-36:2014 6 IEC 61000-4-36:2014 IEC 2014 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ ELECTROMAGNETIC COMPATIBILITY (EMC) Part

32、4-36: Testing and measurement techniques IEMI immunity test methods for equipment and systems FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of I

33、EC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS

34、) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with

35、 the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nea

36、rly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in tha

37、t sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committee

38、s undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide a

39、ny attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest e

40、dition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether

41、direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indisp

42、ensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61000-4

43、-36 has been prepared by subcommittee 77C: High-power transient phenomena, of IEC technical committee 77: Electromagnetic compatibility. It forms part 4-36 of IEC 61000. It has the status of a basic EMC publication in accordance with IEC Guide 107. The text of this standard is based on the following

44、 documents: CDV Report on voting 77C/231/CDV 77C/236/RVC Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. BS IEC 61000-4-36:2014IEC 61000-4-36:2014 IEC 2014 7 This publication has been drafted in accordance with the I

45、SO/IEC Directives, Part 2. A list of all parts in the IEC 61000 series, published under the general title Electromagnetic compatibility (EMC), can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on

46、the IEC website under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual version of this publication may be issued at a later date. IMPORTANT The colour inside l

47、ogo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. BS IEC 61000-4-36:2014 8 IEC 61000-4-36:2014 IEC 2014 INTRODUCTION IEC 6100

48、0 is published in separate parts according to the following structure: Part 1: General General considerations (introduction, fundamental principles) Definitions, terminology Part 2: Environment Description of the environment Classification of the environment Compatibility levels Part 3: Limits Emiss

49、ion limits Immunity limits (in so far as they do not fall under the responsibility of the product committees) Part 4: Testing and measurement techniques Measurement techniques Testing techniques Part 5: Installation and mitigation guidelines Installation guidelines Mitigation methods and devices Part 6: Generic standards Part 9: Miscellaneous Each part is