BS IEC 60748-2-11-1999 Semiconductor devices - Integrated circuits - Digital integrated circuits - Blank detail specification for single supply integrated circuit electrically erase.pdf

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1、BRITISH STANDARD BS IEC 60748-2-11: 1999 Semiconductor devices Integratedcircuits Part 2-11: Digital integrated circuits Blank detail specification for single supply integrated circuit, electrically erasable, and programmable read-only memory ICS 31.200BS IEC 60748-2-11:1999 This British Standard, h

2、aving been prepared under the directionof the Electrotechnical Sector Committee, was published under the authority of the Standards Committee and comes into effect on 15 August 1999 BSI 04-2000 ISBN 0 580 32700 0 National foreword This British Standard reproduces verbatim IEC60748-2-11:1999 and impl

3、ements it as the UK national standard. The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors, which has the responsibility to: aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpre

4、tation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. A list of organizations represented on this committee can be obtained on request to its secretary. From 1 January 1997, all IEC publications hav

5、e the number 60000 added to the old number. For instance, IEC27-1 has been renumbered as IEC60027-1. For a period of time during the change over from one numbering system to the other, publications may contain identifiers from both systems. Cross-references The British Standards which implement inte

6、rnational or European publications referred to in this document may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards Electronic Catalogue. A British Standard does not purport to inc

7、lude all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, page

8、s i and ii, theIEC title page, pages ii to iv, pages 1 to 13 and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Amendments issued since publication Amd. No. Date Comm

9、entsBS IEC 60748-2-11:1999 BSI 04-2000 i Contents Page National foreword Inside front cover Foreword iii Text of IEC 60748-2-11 1ii blankBS IEC 60748-2-11:1999 ii BSI 04-2000 Contents Page Foreword iii Introduction 1 1 Marking and ordering information 3 2 Application related description 3 3 Specific

10、ation of the function 3 4 Limiting values (absolute maximum rating system) 4 5 Operating conditions (within the specified operating temperature range) 4 6 Electrical characteristics 5 7 Programming 7 8 Mechanical and environmental ratings, characteristics and data 7 9 Additional information 7 10 Scr

11、eening (if required) 8 11 Quality assessment procedures 8 12 Structural similarity procedures 8 13 Test conditions and inspection requirements 8 14 Additional measurement methods 13 Reference documents 13 Table 1 Group A: Lot-by-lot 9 Table 2 Group B: Lot-by-lot 10 Table 3 Group C: Periodic 11 Table

12、 4 Group D 12BS IEC 60748-2-11:1999 BSI 04-2000 iii Foreword 1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote international co-oper

13、ation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, the IEC publishes International Standards. Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt wi

14、th may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. The IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined

15、by agreement between the two organizations. 2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested National Committees.

16、3) The documents produced have the form of recommendations for international use and are published in the form of standards, technical reports or guides and they are accepted by the National Committees in that sense. 4) In order to promote international unification, IEC National Committees undertake

17、 to apply IEC International Standards transparently to the maximum extent possible in their national and regional standards. Any divergence between the IEC Standard and the corresponding national or regional standard shall be clearly indicated in the latter. 5) The IEC provides no marking procedure

18、to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with one of its standards. 6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject of patent rights. The IEC shall not be held respo

19、nsible for identifying any or all such patent rights. International Standard IEC 60748-2-11 has been prepared by subcommittee47A: Integrated circuits, of IEC technical committee47: Semiconductor devices. This standard is a blank detail specification for single supply integrated circuit electrically

20、erasable and programmable read-only memory. The text of this standard is based on the following documents: Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. The QC number that appears on the front cover of this publica

21、tion is the specification number in the IEC Quality Assessment System for Electronic Components (IECQ). FDIS Report on voting 47A/534/FDIS 47A/548/RVDiv blankBS IEC 60748-2-11:1999 BSI 04-2000 1 Introduction The IEC Quality Assessment System for Electronic Components is operated in accordance with t

22、he statutes of the IEC and under the authority of the IEC. The object of this system is to define quality assessment procedures in such a manner that electronic components released by one participating country as conforming with the requirements of an applicable specification are equally acceptable

23、in all other participating countries without the need for further testing. This blank detail specification is one of a series of blank detail specifications for semiconductor devices and shall be used with the following IEC publications: IEC 60747-10/QC 700000:1991, Semiconductor devices Part10: Gen

24、eric specification for discrete devices and integrated circuits. IEC 60748-11/QC 790100:1990, Semiconductor devices Integrated circuits Part11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits. Required information Numbers shown in brackets on this page corresp

25、ond to the following items of required information, which should be entered in the spaces provided on page2 of this blank detail specification. Identification of the detail specification 1 The name of the National Standards Organization under whose authority the detail specification is issued. 2 The

26、 IECQ number of the detail specification. 3 The numbers and issue numbers of the generic and sectional specifications. 4 The national number of the detail specification, date of issue and any further information, if required by the national system. Identification of the component 5 Main function and

27、 type number. 6 Information on typical construction (materials, the main technology) and the package. If applicable, variants of products shall be given here, together with the variant characteristics. The detail specification shall give a brief description, including the following: technology (N MO

28、S, etc.); structure (words x bits); the type of output circuit (for example three state); major functions. 7 Outline drawing, terminal identification, marking, and/or references to the relevant document for outlines. 8 Categories of assessed quality according to2.6 of the generic specification. 9 Re

29、ference data.BS IEC 60748-2-11:1999 2 BSI 04-2000 Name (address) of responsible NAI (andpossibly of body from which the specification is available). 1 Number of IECQ detail specification, plusissue number and/or date QC790108 2 ELECTRONIC COMPONENTS OF ASSESSED QUALITY IN ACCORDANCE WITH: 3 National

30、 number of the detail specification 4 Generic specification: IEC 60747-10/QC 700000 This box need not be used if national number repeats IECQ number Sectional specification: IEC 60748-11/QC 790100 and national reference if different DETAIL SPECIFICATION FOR SINGLE SUPPLY INTEGRATED CIRCUIT(S), ELECT

31、RICALLY ERASABLE, AND PROGRAMMABLE READ-ONLY MEMORIES Type number(s) of the relevant device(s) Ordering information: see1.2 of this standard. 5 Mechanical description 7 Short description 6 Outline references: Standard package references should be given, IEC number (mandatory if available) and/or nat

32、ional number Outline drawing: May be transferred to, or given with more details in clause8 of this standard Terminal identification: Drawing showing pin assignments, including graphical symbols Application: Function: Typical construction: Si, monolithic, MOS Encapsulation: cavity or non-cavity Compa

33、rison table of characteristics of variants of the device CAUTION: Electrostatic sensitive devices. Categories of assessed quality From2.6 of the generic specification 8 Marking: Letters and figures, or colour code The detail specification shall prescribe the information to be marked on the device, i

34、f any Reference data Reference data on the most important properties to permit comparison between types 9 See2.5 of the generic specification and/or1.1 of this standard Information about manufacturers who have components qualified to this detail specification is available in the current qualified pr

35、oducts list.BS IEC 60748-2-11:1999 BSI 04-2000 3 1 Marking and ordering information 1.1 Marking See2.5 of the generic specification. 1.2 Ordering information The following minimum information is necessary to order a specific device, unless otherwise specified: precise type reference (and nominal vol

36、tage value, if required); IECQ reference of the detail specification with issue number and/or date, when relevant; categories as defined in clause9 of the sectional specification and, if required, the screening sequence as defined in clause8 of the sectional specification; packaging for delivery; an

37、y other particulars. 2 Application related description The following characteristics shall be given: nominal supply voltage; nominal current consumption; stand-by current consumption (if applicable); operating modes; electrical compatibility (if appropriate); it shall be stated whether the integrate

38、d circuit memory is electrically compatible with other particular integrated circuits or families of integrated circuits, or whether special interfaces are required; overall block diagram; summary of the programming conditions (see also clause7 of this standard). 3 Specification of the function 3.1

39、Block diagram The block diagram shall be sufficiently detailed to enable the individual functional units within the memory to be identified with their main input and output paths and the identification of their external connections (chip enable, address decode.). The graphical symbol for the functio

40、n shall be given. This may be obtained from a catalogue of standards of graphical symbols, or designed according to the rules of IEC60617-12. 3.2 Identification and function of terminals All terminals shall be identified on the block diagram (supply terminals, address, data and control terminals). T

41、he terminal functions shall be indicated in a table as follows. 3.3 Functional description The following characteristics shall be given: memory size: the total number of bits of information capable of being stored in the memory circuit; memory organization: the number of bits per word capable of bei

42、ng stored in the memory circuit; operating mode (serial or parallel); addressing mode (for example multiplexed, latched, etc.); Terminal number Terminal symbol Terminal designation Function Function of terminal Input/output identification Type of output circuitBS IEC 60748-2-11:1999 4 BSI 04-2000 ch

43、ip select 1)(if applicable); output enable 1)(if applicable); stand-by mode (if applicable); truth table (this table shall show the output states versus the different combinations of the address inputs and the select inputs); the initial logic state of the whole memory. The product is designed to be

44、 electrically programmed (see7.3). 4 Limiting values (absolute maximum rating system) See IEC 60134. These values apply over the operating temperature range, unless otherwise specified. Unless otherwise specified, limiting values shall be given as follows: any cautionary statement unique to an indiv

45、idual integrated circuit shall be included, for example the handling of MOS circuits; any interdependence of limiting values shall be specified; all conditions for which the limiting values apply shall be stated; if transient overloads are permitted, their magnitude and duration shall be specified.

46、All voltages are referenced to a designated reference terminal. 5 Operating conditions (within the specified operating temperature range) These conditions are not to be inspected but may be used for quality assessment purposes. 1) The chip select and the output enable are to be distinguished. Charac

47、teristics Symbols Min. a Max. a Unit Supply voltage V CC X X V Input voltage V I X X V Output voltage V O X X V Off-state voltage (see note) V OZ X X V Output current I O X X mA Input current I I X X mA Power dissipation P D n.a. X W Operating temperature T amb X X C Storage temperature T stg X X C

48、NOTEWhere appropriate. a Algebraic values Characteristics Symbols Min. Max. Unit Supply voltage V CC X X V Low-level input voltage V IL X X V High-level input voltage V IH X X V Operating temperature T amb X X CBS IEC 60748-2-11:1999 BSI 04-2000 5 6 Electrical characteristics The characteristics sha

49、ll apply over the full operating conditions in clause5 unless otherwise specified. Where the stated performance of the circuit varies over the operating temperature range, the values of the input and output voltages, and their associated currents shall be stated at25 C and at the extremes of the operating temperature range. Values of current and voltage shall be given for each functionally different type