BS IEC 60747-6-2016 Semiconductor devices Discrete devices Thyristors《半导体器件 分立器件 半导体闸流管》.pdf
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1、BSI Standards PublicationSemiconductor devicesPart 6: Discrete devices ThyristorsBS IEC 60747-6:2016National forewordThis British Standard is the UK implementation of IEC 60747-6:2016.It supersedes BS IEC 60747-6:2000 which is withdrawn.The UK participation in its preparation was entrusted to Techni
2、calCommittee EPL/47, Semiconductors.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions ofa contract. Users are responsible for its correct application. The British Standards Instit
3、ution 2016.Published by BSI Standards Limited 2016ISBN 978 0 580 80434 2ICS 31.080.20Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of the Standards Policy and Strategy Committee on 30 April 2016.Amendments/corr
4、igenda issued since publicationDate Text affectedBRITISH STANDARDBS IEC 60747-6:2016IEC 60747-6 Edition 3.0 2016-04 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Part 6: Discrete devices Thyristors Dispositifs semiconducteurs Partie 6: Dispositifs discrets Thyristors INTERNATIONA
5、L ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE ICS 31.080.20 ISBN 978-2-8322-3296-5 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from
6、 an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. BS IEC 60747-6:2016 2 IEC 60747-6:2016 IEC 2016 CONTENTS FOREWORD . 7 1 Scope 9 2 Normative references. 9 3 Terms and definitions 9 3.1 General . 9 3.2 Terms and definitions r
7、elated to ratings and characteristics: currents . 10 3.3 Terms and definitions related to ratings and characteristics: gate voltages and currents 11 3.4 Terms and definitions related to ratings and characteristics: power and energy dissipation . 12 3.4.1 General . 12 3.4.2 Instantaneous power during
8、 a cycle 12 3.4.3 Mean power dissipation 14 3.4.4 Energy dissipation 15 3.5 Terms and definitions related to ratings and characteristics: recovery times and other characteristics . 16 3.5.1 On-state 16 3.5.2 Recovery times 16 3.5.3 Times and rates of rise characterizing gate-controlled turn-on . 18
9、3.5.4 Times and rates of rise characterizing gate-controlled turn-off . 19 3.5.5 Recovered charges 22 3.6 Mechanical ratings 22 4 Letter symbols . 23 4.1 General . 23 4.2 Additional general subscripts . 23 4.3 List of letter symbols . 23 5 Ratings and characteristics for thyristors 26 5.1 Ratings (l
10、imiting values) 26 5.1.1 Storage temperatures (Tstg) . 26 5.1.2 Junction temperature (Tvj(min), Tvjm) . 26 5.1.3 Operating ambient or case temperature (Taor Tc) 26 5.1.4 Total power dissipation (Ptotor PC) 26 5.1.5 Gate power dissipation . 26 5.1.6 Frequency ratings 26 5.1.7 Special requirements for
11、 mounting . 26 5.1.8 Principle anode-cathode voltages . 27 5.1.9 Gate voltages 27 5.1.10 Principal anode cathode currents . 28 5.1.11 Peak forward gate current (IFGM) 35 5.2 Characteristics 35 5.2.1 General . 35 5.2.2 Reverse current (IR) 35 5.2.3 Reverse conducting voltage (VRC) (for reverse conduc
12、ting thyristors) . 35 5.2.4 Continuous (direct) off-state current (ID) 35 5.2.5 On-state voltage (VT) . 35 5.2.6 On-state characteristics (where appropriate) . 35 BS IEC 60747-6:2016IEC 60747-6:2016 IEC 2016 3 5.2.7 Peak sinusoidal on-state voltage (VTM) 36 5.2.8 Threshold voltage (VT(TO)/ VTO) 36 5
13、.2.9 On-state slope resistance (rT) 36 5.2.10 Holding current (IH) . 36 5.2.11 Latching current (IL) . 36 5.2.12 Repetitive peak off-state current (IDRM) . 36 5.2.13 Repetitive peak reverse current (IRRM) 36 5.2.14 Gate-trigger current (IGT) and gate-trigger voltage (VGT) . 37 5.2.15 Gate non-trigge
14、r current (IGD) and gate non-trigger voltage (VGD) . 37 5.2.16 Sustaining gate current (IFGsus) for GTO only . 38 5.2.17 Peak gate turn-off current (IRGQM) for GTO only . 38 5.2.18 Peak tail current (IZM) for GTO only . 38 5.2.19 Characteristic time intervals . 39 5.2.20 Total power dissipation 41 5
15、.2.21 Turn-on energy dissipation (EON) for GTO preferably . 42 5.2.22 On-state energy dissipation (ET) for GTO preferably . 42 5.2.23 Turn-off energy dissipation (EQ) for GTO preferably . 43 5.2.24 Recovered charge (Qr) (where appropriate) 43 5.2.25 Peak reverse recovery current (Irrm)(where appropr
16、iate) 43 5.2.26 Reverse recovery time (trr) (where appropriate) 43 5.2.27 Thermal resistance junction to ambient (Rth(j-a) 43 5.2.28 Thermal resistance junction to case (Rth(j-c) . 43 5.2.29 Thermal resistance case to heat sink (Rth(c-s) . 43 5.2.30 Thermal resistance junction to heat sink (Rth(j-s)
17、 . 44 5.2.31 Transient thermal impedance junction to ambient (Zth(j-a) . 44 5.2.32 Transient thermal impedance junction to case (Zth(j-c) 44 5.2.33 Transient thermal impedance junction to heat sink (Zth(j-s) 44 6 Measuring and test methods 44 6.1 General . 44 6.2 Measuring methods for electrical cha
18、racteristics 44 6.2.1 On-state voltage (VT) . 44 6.2.2 Repetitive peak reverse current (IRRM) 47 6.2.3 Latching current (IL) . 48 6.2.4 Holding current (IH) . 50 6.2.5 Off-state current (ID) 51 6.2.6 Repetitive peak off state current (IDRM) . 52 6.2.7 Gate trigger current or voltage (IGT), (VGT) . 5
19、3 6.2.8 Gate non-trigger voltage (VGD) and gate non-trigger current (IGD) . 54 6.2.9 Gate controlled delay time (td) and turn-on time (tgt) 56 6.2.10 Circuit commutated turn-off time (tq) 58 6.2.11 Critical rate of rise of off-state voltage (dv/dt(cr) 61 6.2.12 Critical rate of rise of commutating v
20、oltage of triacs (dv/dt(com) . 63 6.2.13 Recovered charge (Qr) and reverse recovery time (trr) 69 6.2.14 Circuit commutated turn-off time (tq) of a reverse conducting thyristor . 73 6.2.15 Turn-off behaviour of turn-off thyristors (for GTO) . 75 6.2.16 Total energy dissipation during one cycle (for
21、fast switching thyristors) . 78 6.3 Verification test methods for ratings (limiting values) 79 6.3.1 Non-repetitive peak reverse voltage (VRSM) . 79 6.3.2 Non-repetitive peak off-state voltage (VDSM) 80 BS IEC 60747-6:2016 4 IEC 60747-6:2016 IEC 2016 6.3.3 Surge (non-repetitive) on-state current (IT
22、SM) 81 6.3.4 On-state current ratings of fast-switching thyristors . 83 6.3.5 Critical rate of rise of on-state current (di/dt(cr) . 94 6.3.6 Peak case non-rupture current (IRSMC) . 97 6.4 Measuring methods for thermal characteristics 98 6.4.1 General . 98 6.4.2 Measurement of the case temperature 9
23、8 6.4.3 Measuring methods for thermal resistance (Rth) and transient thermal impedance (Zth) . 99 6.4.4 Measurement method of thermal resistance and impedance (Method A) 99 6.4.5 Measurement method of thermal resistance and impedance (Method B) 102 6.4.6 Measurement method of thermal resistance and
24、impedance (Method C, for GTO thyristors only) 113 6.4.7 Measurement method of thermal resistance and impedance (Method D, for GTO thyristors only) 117 7 Requirements for type tests and routine tests, marking of thyristors and endurance tests 120 7.1 Type tests . 120 7.2 Routine tests . 120 7.3 Measu
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