BS EN 62047-6-2010 Semiconductor devices - Micro-electromechanical devices - Axial fatigue testing methods of thin film materials《半导体装置 微机电装置 薄膜材料的轴向疲劳试验方法》.pdf

《BS EN 62047-6-2010 Semiconductor devices - Micro-electromechanical devices - Axial fatigue testing methods of thin film materials《半导体装置 微机电装置 薄膜材料的轴向疲劳试验方法》.pdf》由会员分享，可在线阅读，更多相关《BS EN 62047-6-2010 Semiconductor devices - Micro-electromechanical devices - Axial fatigue testing methods of thin film materials《半导体装置 微机电装置 薄膜材料的轴向疲劳试验方法》.pdf（20页珍藏版）》请在麦多课文档分享上搜索。

1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationSemiconductor devices Micro-electromechanical devicesPart 6: Axial fatigue testing methods of thin film materialsBS EN 62047-6:2010National forewordThis British Standard is the U

2、K implementation of EN 62047-6:2010. It isidentical to IEC 62047-6:2009.The UK participation in its preparation was entrusted to Technical CommitteeEPL/47, Semiconductors.A list of organizations represented on this committee can be obtained onrequest to its secretary.This publication does not purpor

3、t to include all the necessary provisions of acontract. Users are responsible for its correct application. BSI 2010ISBN 978 0 580 58544 9ICS 31.080.99Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of the Standar

4、dsPolicy and Strategy Committee on 30 April 2010.Amendments issued since publicationAmd. No. Date Text affectedBRITISH STANDARDBS EN 62047-6:2010EUROPEAN STANDARD EN 62047-6 NORME EUROPENNE EUROPISCHE NORM March 2010 CENELEC European Committee for Electrotechnical Standardization Comit Europen de No

5、rmalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: Avenue Marnix 17, B - 1000 Brussels 2010 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 62047-6:2010 E ICS 31.080.99 English versi

6、on Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 62047-6:2009) Dispositifs semiconducteurs - Dispositifs microlectromcaniques - Partie 6: Mthodes dessais de fatigue axiale des matriaux en couche mince (CEI 62047-6:2009) Ha

7、lbleiterbauelemente - Bauelemente der Mikrosystemtechnik - Teil 6: Prfverfahren zur uniaxialen Dauerschwingfestigkeit von Dnnschicht-Werkstoffen (IEC 62047-6:2009) This European Standard was approved by CENELEC on 2010-03-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulati

8、ons which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This E

9、uropean Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members a

10、re the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Sl

11、ovenia, Spain, Sweden, Switzerland and the United Kingdom. BS EN 62047-6:2010EN 62047-6:2010 - 2 - Foreword The text of document 47F/15/FDIS, future edition 1 of IEC 62047-6, prepared by SC 47F, Micro-electromechanical systems, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC pa

12、rallel vote and was approved by CENELEC as EN 62047-6 on 2010-03-01. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CEN and CENELEC shall not be held responsible for identifying any or all such patent rights. The following dates

13、were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2010-12-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2013-03-01 Annex ZA has been added by CEN

14、ELEC. _ Endorsement notice The text of the International Standard IEC 62047-6:2009 was approved by CENELEC as a European Standard without any modification. _ BS EN 62047-6:2010- 3 - EN 62047-6:2010 Annex ZA (normative) Normative references to international publications with their corresponding Europ

15、ean publications The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publi

16、cation has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 62047-2 2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing methods of thin film materials EN 62047-2 2006 BS EN 62047-6:2010 2 6

17、2047-6 IEC:2009 CONTENTS 1 Scope.5 2 Normative references .5 3 Terms and definitions .5 4 Test piece 7 4.1 Design of test piece.7 4.2 Preparation of test piece .7 4.3 Test piece thickness7 4.4 Storage prior to testing7 5 Testing method and test apparatus.7 5.1 General .7 5.2 Method of gripping (moun

18、ting of test piece).8 5.3 Static loading test8 5.4 Method of loading8 5.5 Speed of testing 8 5.6 Environment control 8 6 Endurances (test termination).9 7 Test report9 Annex A (informative) Technical background of this standard 10 Annex B (informative) Test piece .11 Annex C (informative) Displaceme

19、nt measurement 12 Annex D (informative) Testing environment13 Annex E (informative) Number of test pieces .14 Bibliography15 BS EN 62047-6:201062047-6 IEC:2009 5 SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 6: Axial fatigue testing methods of thin film materials 1 Scope This Internatio

20、nal Standard specifies the method for axial tensiletensile force fatigue testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 m and 10 m under constant force range or constant displacement range. Thin films are used as main structural materials f

21、or MEMS and micromachines. The main structural materials for MEMS, micromachines, etc., have special features, such as typical dimensions of a few microns, material fabrication by deposition, and test piece fabrication by means of non-mechanical machining, including photolithography. This Internatio

22、nal Standard specifies the axial force fatigue testing methods for micro-sized smooth specimens, which enables a guarantee of accuracy corresponding to the special features. The tests are carried out at room temperatures, in air, with loading applied to the test piece along the longitudinal axis. 2

23、Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 62047-2:2006, Semiconduc

24、tor devices Micro-electromechanical devices Part 2: Tensile testing method of thin film materials 3 Terms and definitions For the purposes of this document, the following terms and definitions apply. 3.1 maximum force Pmaxhighest algebraic value of applied force in a cycle NOTE Adapted from ASTM E 1

25、823-05a 11. 3.2 minimum force Pminlowest algebraic value of applied force in a cycle NOTE Adapted from ASTM E 1823-05a 1. 3.3 mean force Pmeanalgebraic average of the maximum and minimum forces in constant amplitude loading, or of individual cycles NOTE Adapted from ASTM E 1823-05a 1. 1The figures b

26、etween brackets refer to the Bibliography. BS EN 62047-6:2010 6 62047-6 IEC:2009 3.4 force range P algebraic difference between the maximum and minimum forces in constant amplitude loading 3.5 maximum stress maxhighest algebraic value of applied stress in a cycle 3.6 minimum stress minlowest algebra

27、ic value of applied force in a cycle 3.7 mean stress meanalgebraic average of the maximum and minimum stress in constant amplitude loading, or of individual cycles 3.8 stress range algebraic difference between the maximum and minimum stresses in constant amplitude loading 3.9 maximum displacement ma

28、xhighest algebraic value of applied displacement in a cycle 3.10 minimum displacement minlowest algebraic value of applied displacement in a cycle 3.11 mean displacement meanalgebraic average of the maximum and minimum displacement in constant amplitude loading, or of individual cycles 3.12 displace

29、ment range algebraic difference between the maximum and minimum displacements in constant amplitude loading 3.13 force ratio stress ratio R algebraic ratio of the minimum force (or the minimum stress) to the maximum force (or the maximum stress) BS EN 62047-6:201062047-6 IEC:2009 7 4 Test piece 4.1

30、Design of test piece In order to minimize the influence of size, the test piece should have dimensions of the same order as that of the objective device component. The shape and dimensions of the specimen should be based on Annex C of IEC 62047-2. The dimensions of the plane shape of the specimen sh

31、all be within an accuracy range of 1 % as specified in IEC 62047-2. The length of the parallel part of the test piece shall be more than 2,5 times the width. See C.1 in IEC 62047-2. The curved part between the gripped ends and the parallel part should have a radius of curvature sufficient to not cau

32、se a fracture at the curved part due to stress concentration. See C.2 in IEC 62047-2. The gauge marks specified in IEC 62047-2 are not necessary if the marks may concentrate stress or initiate fatigue fractures. 4.2 Preparation of test piece The test piece should be fabricated using a process as sim

33、ilar as possible to that of the device to which the thin film is to be applied. The test piece also should be fabricated following the procedures specified in IEC 62047-2. The substrate removal process should be carefully chosen to prevent damaging the test piece. See C.3 in IEC 62047-2. The number

34、of test pieces should be determined adequately according to the thin films tested. See Annex E. 4.3 Test piece thickness The thickness of each test piece shall be measured, as the film thickness is not usually uniform over a wafer. The accuracy of the measurement shall be within 5 %. Each test piece

35、 should be measured directly. However, the film thickness at the step height of a window opening etched near the test piece can be used as the thickness of a specimen in order to avoid mechanical damage from the use of a stylus profiler, etc. Methods of measuring film thickness and measurement error

36、s are given in C.4 of IEC 62047-2. 4.4 Storage prior to testing In the case of thin films, the storage environment may affect the fatigue properties. If there is an interval between final preparation and testing, particular care should be taken in storing the test pieces, and the specimens should be

37、 examined by appropriate means to ensure that the surface has not deteriorated during the storage period. If any deterioration is observed that was not present after the specimens were prepared, testing shall not be performed. However, if the damage was introduced during the preparation processes, t

38、he test shall be performed. 5 Testing method and test apparatus 5.1 General The testing machine should be equipped with a gripping mechanism appropriate for the test piece, as well as with a mechanism for applying cyclic loading. The cyclic loading applied to the test piece should be basically tensi

39、le-tensile mode loading. For constant range force testing, maximum and minimum forces (or mean force and force range) shall be monitored and the testing machine should be equipped with a constant force range control system. For constant displacement range testing, the maximum and minimum BS EN 62047

40、-6:2010 8 62047-6 IEC:2009 displacements (or mean displacement and displacement range) shall be monitored and the testing machine should be equipped with a constant displacement range control system. A test-piece failure detection system should be provided and the number of loading (or displacement)

41、 cycles to failure shall be recorded. 5.2 Method of gripping (mounting of test piece) Each test piece shall be mounted so that the loading axis and test piece axis are aligned. When gripping both ends of the test piece, care shall be taken to avoid applying excess force and/or bending stress to the

42、test piece. The gripping methods indicated in Annex A of IEC 62047-2 are recommended for mounting the test pieces. In addition, the testing apparatus should be equipped with a test piece alignment mechanism to ensure that the tensile axis of the test piece is aligned with the loading direction of th

43、e test apparatus. 5.3 Static loading test Static tensile testing of the test piece is recommended before fatigue testing in order to determine the testing conditions. Static tensile testing shall be carried out according to the procedures specified in IEC 62047-2. 5.4 Method of loading If the specim

44、en was fractured during the first loading cycle, the fracture stress shall be recorded and described in the report. The maximum and minimum forces (or mean force and force range) shall be kept constant during the constant force range test. The maximum and minimum displacement (or mean displacement a

45、nd displacement range) shall be kept constant during the constant displacement range test. A load cell with a resolution adequate to guarantee 5 % accuracy of the applied force shall be used. The drift of the load cell should be less than 1 % of the full-scale force during the testing. See Annex B i

46、n IEC 62047-2 regarding the accuracy of the load cell. For constant displacement range testing, a displacement measurement system with a resolution adequate to guarantee 5 % accuracy of the applied displacement shall be used. See Annex C. 5.5 Speed of testing As the frequency of the stress cycle wil

47、l depend upon the testing environment, the type of testing machine employed, and the stiffness of the test piece, the frequency shall be that which is most suitable for the particular combination of environment, material, test piece, and testing machine. Generally, the frequency should be chosen pro

48、perly depending on the application of thin film materials. In addition, the frequency shall not heat the test piece during the application of cyclic loading due to the rapid dissipation of strain energy in the test piece. This practice does not apply to fatigue testing of viscoelastic films. 5.6 Env

49、ironment control As the environment greatly affects the fatigue properties of thin films, the testing temperature and humidity shall be monitored during testing. The testing temperature and relative humidity should be controlled to within 1 C and 5 %, respectively. See Annex E. If it is difficult to control the testing temperature and humidity, these values shall be described in the test report. BS EN 62047-6:201062047-6 IEC:2009 9 6 Endurances (test termin