BS EN 61249-5-1-1996 Materials for interconnection structures - Sectional specification set for conductive foils and films with and without coatings - Copper foils (for the manufac.pdf

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1、BRITISH STANDARD BS EN 61249-5-1:1996 IEC 1249-5-1: 1995 Materials for interconnection structures Part 5: Sectional specification set for conductive foils and films with and without coatings Section 1: Copper foils (for the manufacture of copper-clad base materials) The European Standard EN61249-5-1

2、:1996 has the status of a British Standard ICS 31.180BSEN61249-5-1:1996 This British Standard, having been prepared under the direction of the Electrotechnical Sector Board, was published under the authority of the Standards Board and comes into effect on 15 September 1996 BSI 11-1998 The following

3、BSI references relate to the work on this standard Committee reference EPL/52 Draft announced in BSI News Upate June 1996 ISBN 0 580 26167 0 Committees responsible for this British Standard The preparation of this British Standard was entrusted to Technical Committee EPL/52, Printed circuits, upon w

4、hich the following bodies were represented: British Telecommunications plc Electrical and Electronic Industries Association (BEAMA Ltd.) Federation of the Electronics Industries GAMBICA (BEAMA Ltd.) Institute of Metal Finishing National Supervisory Inspectorate Printed Circuit Interconnection Federa

5、tion Surface Mount and Related Technologies (SMART Group) Amendments issued since publication Amd. No. Date CommentsBS EN61249-5-1:1996 BSI 11-1998 i Contents Page Committees responsible Inside front cover National foreword ii Foreword 2 Text of EN61249-5-1 3 List of references Inside back coverBSEN

6、61249-5-1:1996 ii BSI 11-1998 National foreword This British Standard has been prepared by Technical Committee EPL/52 and is the English language version of EN61249-5-1:1996, Materials for interconnection structures Part5:Sectional specification set for conductive foils and films with and without co

7、atings. Section 1: Copper foils (for the manufacture of copper-clad base materials), published by the European Committee for Electrotechnical Standardization (CENELEC). It is identical with IEC1249-5-1:1995 published by the International Electrotechnical Commission (IEC). A British Standard does not

8、 purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Cross-reference Publication referred to Corresponding British Standa

9、rd ISO4287-1:1984 BS 6741 Glossary of surface roughness terms Part 1:1987 Surface and its parameters Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, the EN title page, pages 2 to 12, an inside back cover and a back cover. This standard has been updated

10、(see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside front cover.EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN61249-5-1 January 1996 ICS 31.180 Descriptors: Printed circuits, interconnection structures, conductive foils and

11、 films, coatings, copper-clad base materials, flexible materials English version Materials for interconnection structures Part 5: Sectional specification set for conductive foils and films with and without coatings Section 1: Copper foils (for the manufacture of copper-clad base materials) (IEC 1249

12、-5-1:1995) Matriaux pour les structures dinterconnexion Partie 5: Collection de spcifications intermdiaires pour feuilles et films conducteurs avec ou sans revtement Section 1: Feuilles de cuivre (pour la fabrication de matriaux de base plaqus cuivre) (CEI 1249-5-1:1995) Materialien fr Verbindungsst

13、rukturen Teil 5: Rahmenspezifikation fr leitfhige Folien mit und ohne Beschichtungen Hauptabschnitt 1: Kupfer-Foilen (zur Herstellung von kupferkaschierten Basismaterialien (IEC 1249-5-1:1995) This European Standard was approved by CENELEC on 1995-11-28. CENELEC members are bound to comply with the

14、CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or

15、to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the officia

16、l versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical

17、Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1996 Copyright reserved to CENELEC members Ref. No. EN61249-5-1:1996 EEN61249-5-1:1996 BSI 11-1998 2 Foreword The text of document

18、 52/544/DIS, future edition 1 of IEC 1249-5-1, prepared by IEC TC 52, Printed circuits, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN61249-5-1 on 1995-11-28. The following dates were fixed: Annexes designated “normative” are part of the body of the standard. Annexe

19、s designated “informative” are given for information only. In this standard, annex A is normative and annex B is informative. The following publication is quoted in this standard: ISO4287-1:1984 Surface roughness Terminology Part1:Surface and its parameters. Contents Page Foreword 2 1 Scope 3 2 Norm

20、ative reference 3 3 Designation 3 3.1 Types of copper foil 3 3.2 Types of surface profile 3 3.3 Bond enhancing treatment and passivation 3 3.4 Complete designation 3 4 Mass per unit area and thickness 4 5 Copper purity 4 6 Electrical properties 4 7 Tensile properties 5 8 Peel strength 5 9 Surface fi

21、nish 5 9.1 Smooth side (shiny side) 5 9.2 Rough side (treatment side) 7 10 Dimensions and tolerances 7 10.1 Copper foil supplied in rolls 7 10.2 Copper foil supplied in sheets or cut panels 7 11 Packaging and marking 7 11.1 Copper foil supplied in rolls 7 11.2 Copper foil supplied in sheets or cut p

22、anels 7 11.3 Marking of packages 8 Annex A (normative) Sampling and test methods 9 Annex B (informative) Bibliography 12 Table 1 Types and grades of copper foil 3 Table 2 Types of profile 3 Table 3 Mass per unit area and thickness 4 Table 4 Electrical conductivity and specimen resistance of type E c

23、opper foils 4 Table 5 Electrical conductivity and specimen resistance of type R copper foils 5 Table 6 Tensile strength and elongation (minimum values) 6 Table 7 Pinholes and pores in copper foils 7 Table 8 Tolerances for width of copper foil delivered in rolls 7 Table 9 Mass per unit area, allowabl

24、e mass range 9 latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 1996-09-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 1996-09-01EN61249-5-1:1996 BSI 11-1998

25、 3 1 Scope This specification gives requirements for properties of copper foil intended for use in the manufacture of copper-clad laminated sheets and of copper-clad flexible materials, used in the manufacture of printed boards. It applies to copper foil supplied in rolls, sheets or cut panels. 2 No

26、rmative reference The following normative document contains provisions which, through reference in this text, constitute provisions of this section of IEC 1249-5. At the time of publication, the edition indicated was valid. All normative documents are subject to revision, and parties to agreements b

27、ased on this section of IEC 1249-5 are encouraged to investigate the possibilities of applying the most recent edition of the normative document indicated below. Members of IEC and ISO maintain registers of currently valid international standards. ISO4287-1:1984, Surface roughness Terminology Part1:

28、Surface and its parameters. 3 Designation 3.1 Types of copper foil Copper foil for the uses considered in this specification includes the following two types: E = electrodeposited copper foil; R = rolled copper foil; with the grades given inTable 1. Table 1 Types and grades of copper foil 3.2 Types

29、of surface profile In consideration of the processes used in the manufacturing of both electrodeposited and rolled copper, three designations for rough side profile are given inTable 2. Table 2 Types of profile The ten points average height of irregularities corresponds to the term R zof ISO4287-1 a

30、nd is measured by the test method for R zdescribed in future IEC 1189-2 1) . 3.3 Bond enhancing treatment and passivation A chemical or electrochemical surface treatment shall be applied to the copper foil to increase the bonding strength to the substrate. Such treatment may be applied to one or bot

31、h sides. In case of one side treatment on electrodeposited copper foil it shall be applied to the rough side of the foil. A chemical passivation shall be applied to both sides of the foil to increase its shelf life. 3.4 Complete designation For the designation of copper foils according to this speci

32、fication the following code shall be used: If there is no risk of confusion, the designation may be abbreviated to read: CU-IEC-35-E2-S1. Type designation E1 Standard electrodeposited E2 High ductility electrodeposited E3 High temperature elongation electrodeposited R1 As rolled wrought R2 Light col

33、d rolled wrought R3 Annealed wrought Type designation Grade Ten point average maximum height of profile (R z ) m S Standard 14 a L Low profile 10 V Very low profile 5 aFor copper foil thicknesses up to 105m only. 1) At present at the stage of document 52/518/CDV (in preparation, see annex B).EN61249

34、-5-1:1996 4 BSI 11-1998 Example: 4 Mass per unit area and thickness The primary measure of quantity of copper foil shall be the mass per unit area, together with applicable tolerances. Thicknesses of copper foil corresponding to specified values of mass per unit area shall be regarded as given for i

35、nformation only. Table 3 Mass per unit area and thickness Mass per unit area shall be determined by the test method given inA.2.1. Direct thickness measurements on microsections result in incorrect values due to the irregularities caused by the treatment roughness. 5 Copper purity Copper foils witho

36、ut treatment shall have the following minimum purity (with silver content regarded as copper): Type E: 99,8 mass% copper; Type R: 99,9 mass% copper. The copper content shall be determined after removal of the surface treatment or contamination by the test method given inA.2.2. 6 Electrical propertie

37、s The minimum conductivity of copper foils is a percentage of that of the International Annealed Copper Standard (IACS) at 20 C as given in Table 4 andTable 5; 100% corresponds to0,5800 10 8 W 1m 1minimum electrical conductivity or 1,7241 10 8Wm maximum resistivity. The maximum specimen resistance o

38、f type E copper foils of different mass per unit area, when measured in accordance with the test method No. 2E12 described in future IEC 1189-2 2) , shall have the values given inTable 4. Table 4 Electrical conductivity and specimen resistance of type E copper foils Requirements For Information only

39、 Nominal mass per unit area Tolerance of nominal mass per unit area Nominal thickness g/m 2 % m 45 10 a 5 76 10 a 9 107 10 a 12 152 10 a 18 230 10 25 305 10 35 445 10 50 610 10 70 915 10 105 1220 10 140 1525 10 175 1830 10 210 aThese specification shall not be applied to type R copper foil. 2) See a

40、nnex B. Mass per unit area Minimum IACS conductivity Maximum specimen resistance g/m 2 % mW 45 88,5 25,0 76 90,5 15,0 107 92,14 10,4 152 94,12 7,1 230 95,05 4,7 305 96,60 3,5 445 96,60 2,4 610 96,60 1,7 915 96,60 1,2 1220 96,60 0,87 1525 96,60 0,70 1830 96,60 0,58EN61249-5-1:1996 BSI 11-1998 5 The m

41、aximum specimen resistance of type R copper foils of different mass per unit area, when measured in accordance with the test method No. 2E12 described in future IEC 1189-2 3) , shall have the values given inTable 5. Table 5 Electrical conductivity and specimen resistance of type R copper foils The m

42、aximum specimen resistances listed in Table 4 andTable 5 may be calculated using the following formula: where 7 Tensile properties Both in longitudinal direction (machine direction) and in transversal direction of the copper foils the tensile properties given in Table 6 shall apply. Tensile strength

43、 and elongation shall be determined by the test method given in A.2.3. 8 Peel strength The strength required to peel the copper foil from the resin of the base material shall meet the values listed in the relevant specification of IEC 249 4)or shall be as agreed upon between purchaser and supplier.

44、Peel strength shall be determined in accordance with one of the following test methods described in future IEC 1189-2 5)2M06, 2M07, 2M13, 2M14, 2M15, 2M16 and 2M17. The test specimen shall be prepared from a copper foil sample of sufficient dimensions bonded to prepregs, reinforced resin sheets or a

45、dhesive-coated dielectric films under appropriate conditions. 9 Surface finish Both sides of type E and type R copper foils shall be substantially free from resin tears, wrinkles, dirt, oil, corrosion or corrosion products, salts, grease, finger-prints or other blemishes which would adversely affect

46、 the quality of the copper-clad material to be made from the copper foil. Copper foil surfaces shall be free from regularly spaced and repeating patterns of pits and dents. There shall be no inclusions greater than 2,5 m. Frequency and size of pinholes and pores shall be as given in Table 7. The tot

47、al area of all pinholes in an area of 0,5 m 2shall not exceed 0,012mm 2 . The number of pores or pinholes shall be determined by the test method given in A.2.4. 9.1 Smooth side (shiny side) There shall be no scratches present on the smooth side of types E and R copper foils of a depth greater than 3

48、,5 m. The depth of surface roughness R zin longitudinal and transverse direction shall not exceed 3,5 m. The term R zcorresponds to the 10 point height of irregularities according to ISO4287-1 and shall be measured by the test method for R zdescribed in future IEC 1189-2. 3) See annex B. Mass per un

49、it area Minimum IACS conductivity Maximum specimen resistance g/m 2 % mW 45 100 22,5 76 100 13,4 107 100 9,6 152 100 6,7 230 100 4,5 305 100 3,4 445 100 2,3 610 100 1,7 915 100 1,1 1220 100 0,84 1525 100 0,67 1830 100 0,56 R max is the maximum specimen resistance (W); r max is the maximum resistivity (Wm); r is the density of copper = 8,93 10 6 g/m 3 ; l is the gauge length of the specimen (m); w is the width of the specimen (m); m is the mass per unit area (g/m 2 )(minimum value according to Table 9).