BS EN 60749-14-2003 Semiconductor devices - Mechanical and climatic test methods - Robustness of terminations (lead integrity)《半导体器件 机械和气候试验方法 端子的耐久性》.pdf

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1、BRITISH STANDARD BS EN 60749-14:2003 Semiconductor devices Mechanical and climatic test methods Part 14: Robustness of terminations (lead integrity) The European Standard EN 60749-14:2003 has the status of a British Standard ICS 31.080.01 BS EN 60749-14:2003 This British Standard was published under

2、 the authority of the Standards Policy and Strategy Committee on 15 December 2003 BSI 15 December 2003 ISBN 0 580 43082 0 National foreword This British Standard is the official English language version of EN 60749-14:2003. It is identical with IEC 60749-14:2003. It partially supersedes BS EN 60749:

3、1999 which will be withdrawn on 2006-10-01 The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors, which has the responsibility to: A list of organizations represented on this committee can be obtained on request to its secretary. Cross-references The Bri

4、tish Standards which implement international or European publications referred to in this document may be found in the BSI Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Search” facility of the BSI Electronic Catalogue or of British Standards On

5、line. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the respons

6、ible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front cover

7、, the EN title page, pages 2 to 14, an inside back cover and a back cover. The BSI copyright notice displayed in this document indicates when the document was last issued. Amendments issued since publication Amd. No. Date CommentsEUROPEAN STANDARD EN 60749-14 NORME EUROPENNE EUROPISCHE NORM October

8、2003 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2003 CENELEC - All rights of exploitation in any form and by any means rese

9、rved worldwide for CENELEC members. Ref. No. EN 60749-14:2003 E ICS 31.080.01 English version Semiconductor devices - Mechanical and climatic test methods Part 14: Robustness of terminations (lead integrity) (IEC 60749-14:2003) Dispositifs semiconducteurs - Mthodes dessais mcaniques et climatiques P

10、artie 14: Robustesse des sorties (intgrit des connexions) (CEI 60749-14:2003) Halbleiterbauelemente - Mechanische und klimatische Prfverfahren Teil 14: Festigkeit der Bauelementeanschlsse (Unversehrtheit der Anschlsse) (IEC 60749-14:2003) This European Standard was approved by CENELEC on 2003-10-01.

11、 CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained

12、 on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central

13、Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Lithuania, Luxembourg, Malta, Netherlands, Norway, Portugal, Slovak

14、ia, Spain, Sweden, Switzerland and United Kingdom. Foreword The text of document 47/1701/FDIS, future edition 1 of IEC 60749-14, prepared by IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60749-14 on 2003-10-01. The following dates

15、were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2004-07-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2006-10-01 Annexes designated “normative“

16、 are part of the body of the standard. In this standard, annex ZA is normative. Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 60749-14:2003 was approved by CENELEC as a European Standard without any modification. _ Page2 EN6074914:2003 SEMICONDUC

17、TOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 14: Robustness of terminations (lead integrity) 1 Scope This part of IEC 60749 provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly foll

18、owed by rework of the part for re-assembly. For hermetic packages, it is recommended that this test be followed by hermeticity tests in accordance with IEC 60749-8 to determine if there are any adverse effects from the stresses applied to the seals as well as to the leads. This test, including each

19、of the test conditions, is considered destructive and is only recommended for qualification testing. This standard is applicable to all through-hole devices and surface-mount devices requiring lead forming by the user. 2 Normative references The following referenced documents are indispensable for t

20、he application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60749-8, Semiconductor devices Mechanical and climatic test methods Part 8: Sealing 3 General 3.1 Appar

21、atus The appropriate apparatus is described under each particular test condition. 3.2 General procedure applicable to all test conditions The device shall be subjected to the stress described in the specified test condition and the specified end point measurements and inspections shall be made excep

22、t for initial condition- ing unless otherwise specified. When possible, the stress shall be applied to randomly selected leads from each device. The same leads shall not be used for more than one test condition. 3.3 General summary The following details, and those required by the specific test condi

23、tion, shall be specified in the relevant specification: a) Test condition letter. b) Sample size (combinations of number of leads per device and number of devices) and quality level. Page3 EN6074914:2003 4 Test condition A Tension 4.1 Purpose This test condition provides for the application of strai

24、ght tensile loading. It is designed to check the capabilities of the device, leads, welds, and seals to withstand a straight pull. 4.2 Apparatus The tension test requires suitable clamps and fixtures for securing the device and attaching the specified weight without lead restriction. Equivalent line

25、ar pull test equipment may be used. 4.3 Procedure A tension of 2,2 N 0,1 N (220 g 10 g) shall be applied without shock to each lead to be tested in a direction parallel to the axis of the lead or terminal and the tension shall be maintained for 30 s minimum. For leads with a diameter of less than 0,

26、25 mm (or cross sectional area of less than 0,05 mm 2 ) a tension of 1 N 0,1 N (100 g 10 g) shall be applied. The tension shall be applied as close to the end of the lead as practicable. 4.3.1 Measurements Hermeticity test on hermetically sealed packages, visual examination and electrical measure- m

27、ents that consist of parametric and functional tests shall be taken, as specified in the relevant specification. 4.3.2 Failure criteria After the removal of the stress, examine the device using a magnification between 10 and 20 . Any evidence of breakage, loosening, or relative motion between the le

28、ad and the device body shall be considered a device failure. When hermeticity tests are conducted (in accordance IEC 60749-8) as a post measurement, meniscus cracks shall not be a cause for rejection of the devices which have passed the tests. Failure to meet the requirements of any specified post e

29、lectrical measurement shall be considered a cause for failure. 4.4 Summary The following details shall be specified in the relevant specification: a) Weight to be attached to lead, if other than 2,2 N 0,1 N (220 g 10 g). b) Length of time weight is to be attached, if other than 30 s. c) Failure crit

30、eria, if other than specified in 4.3.2. 5 Test condition B Bending stress 5.1 Purpose This test condition provides for the application of bending stresses to determine the integrity of leads, seals and lead plating. It is designed to check the capability of the leads, lead finish, lead welds and sea

31、ls of the devices to withstand stresses to the leads and seals which might reasonably be expected to occur from actual handling and assembly of the devices in application. Page4 EN6074914:2003 5.2 Apparatus The bending test requires attaching devices, clamps, supports or other suitable hardware, nec

32、essary to apply the bending stress through the specified bend angle. 5.3 Procedure Each lead of the sample shall be subjected to a force sufficient to bend the lead as specified. Any number, or all of the leads of the test device, may be bent simultaneously. Rows of leads may be bent one row at a ti

33、me. Each lead shall be bent through one cycle as follows: Bend through the specified arc in one direction and return to the original position. All arcs shall be made in the same plane, without lead restriction. 5.3.1 Direction of bends Test leads shall be bent in the least rigid direction. If there

34、is no least rigid direction, the leads may be bent in any direction. No lead shall be bent so as to interfere with another lead. If interference is unavoidable, the test lead shall be bent in the opposite direction to the angle specified and returned to its normal position. 5.3.2 Procedure for initi

35、al conditioning for environmental test When normally straight leads are supplied in a formed condition (including the staggered lead dual-in-line configuration), the lead forming operation shall be considered acceptable initial conditioning in place of that specified, providing the lead forming has

36、been performed after lead plating and the forming is at least as severe in permanent lead deformation as the specified bending. 5.3.3 Procedure for flat packs, quad packages and axial lead metal can devices (e.g. flexible and semi-flexible leads) 5.3.3.1 Flexible leads A lead shall be considered fle

37、xible if its section modulus (in the least rigid direction) is less than or equal to that of a rectangular lead with a cross section of 0,15 mm 0,5 mm. Round leads 0,5 mm in diameter shall be considered flexible. Flexible leads shall be bent through an arc of at least 45 (see Figure 1), measured at

38、a distance 3 mm 0,5 mm along the lead from the seal unless otherwise specified. 45 IEC 1932/03Figure 1 Flexible lead bend Page5 EN6074914:2003 5.3.3.2 Semi-flexible leads Semi-flexible leads are those leads with a section modulus (in the least rigid direction) greater than that of a rectangular lead

39、 with a cross section of 0,15 mm 0,5 mm which are intended to be bent during insertion or other application. Round leads greater than 0,5 mm in diameter shall be considered semi-flexible. Semi-flexible leads shall be bent through an arc of a least 30 (see Figure 2), measured at the lead extremities,

40、 unless otherwise specified. 30 IEC 1933/03Figure 2 Semi-flexible lead bend 5.3.4 Procedure for dual-in-line through hole package leads Dual-in-line package leads are leads with more than one section modulus, and with leads normally aligned in parallel at 90 angle from the bottom of the package duri

41、ng insertion. Dual-in-line package leads shall be bent inward through an angle sufficient to cause the lead to retain a permanent bend (i.e. after stress removal) of at least 15, measured at the lead extremities about the first bend. For packages that have the shoulder restrained (see configurations

42、 1, 2 and 3 of Figure 3), the angle of the bend shall be measured from the seating plane to the lead extremities. At the completion of the initial bend, the leads shall be returned to their approximate original position. Page6 EN6074914:2003 Seating plane Through hole Surface mount Configuration 1 (

43、Plastic or ceramic centre dip) angle of deflection Configuration 2 (Bottom braze dip) Configuration 3 (Side braze dip) SO QUAD SO QUAD Configuration 5 (J lead) Configuration 4 (Gullwing) IEC 1934/03Figure 3 Package configurations Page7 EN6074914:2003 5.3.5 Procedure for small outlines (SO), quad fin

44、e pitch (QFP) and gullwing formed packages Small outline packages, configuration 4 of Figure 3, shall have leads bent outward at 15, then inward 30, then returned to the original position (see Figure 4). 15 30 15 IEC 1935/03Figure 4 SO and QFP lead bend 5.3.6 Procedure for “J” leaded, SO and chip ca

45、rrier (LCC) packages 5.3.6.1 Leads The leads to be tested shall be selected at random from each package, configuration 5 of Figure 3, in the test sample. Leads from two adjacent sides shall be sampled from each part. Prepare and test only one row of leads at a time. 5.3.6.2 Straightening “J” leads 1

46、) Mount the device in a fixture equivalent to Figure 6. 2) Use suitable tweezers to straighten the lead below the lead shoulder and transition region (see Figure 5). Maximum shoulder width region Maximum lead width region Transition region IEC 1936/03Figure 5 J lead contour 3) Carefully straighten t

47、he “J” bend portion of the SO or LCC package leads to position approximately perpendicular to the widest dimension. 4) Great care shall be taken to prevent damage to the lead, such as nicks, kinks, or deep scratches. Page8 EN6074914:2003 5.3.6.3 Lead inspection Inspect each lead before and after str

48、aightening using a low power optical microscope between 10 and 20 magnification. Do not test any leads damaged by the straightening operation. 5.3.6.4 Mounting LCC package Mount the LCC package in a lead bend test fixture using necessary spacers, with the leads to be tested pointing straight down, i

49、.e., at a 90 angle or normal to the bottom of the package. Apply moderate pressure and lock in position Mount device here Lock nut Leads extended for testing 30 450 g IEC 1937/03Figure 6 Holding fixture for straightening and lead bend for “J” lead configurations 5.3.6.5 Test Test in accordance with 5.3.4 except that the direction of bend shall be outward from the package (see Figure 6)