BS EN 60603-12-1998 Connectors for frequencies below 3 MHz for use with printed boards - Detail specification for dimensions general requirements and tests for a range of sockets d.pdf

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1、BRITISH STANDARD BS EN 60603-12:1998 IEC 60603-12: 1992 Connectors for frequencies below3MHz for use with printed boards Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits The European Standard EN 60603-12:199

2、8 has the status of a British Standard ICS 31.220.10BSEN60603-12:1998 This British Standard, having been prepared under the directionof the Electrotechnical Sector Board, was published underthe authority of the Standards Board and comes intoeffect on 15 May1998 BSI 04-1999 ISBN 0 580 29294 0 Nationa

3、l foreword This British Standard is the English language version of EN60603-12:1998. It is identical with IEC60603-12:1992. The UK participation in its preparation was entrusted by Technical Committee EPL/48, Electromechanical components for electronic equipment, to Subcommittee EPL/48/2, Connectors

4、 for electronic equipment, which has the responsibility to: aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European d

5、evelopments and promulgate them in the UK. A list of organizations represented on this subcommittee can be obtained on request to its secretary. From 1 January 1997, all IEC publications have the number60000 added to the old number. For instance, IEC27-1 has been renumbered as IEC60027-1. For a peri

6、od of time during the change over from one numbering system to the other, publications may contain identifiers from both systems. Cross-references Attention is drawn to the fact that CEN and CENELEC Standards normally include an annex which lists normative references to international publications wi

7、th their corresponding European publications. The British Standards which implement these international or European publications may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Find” facility of the BSI Standards

8、 Electronic Catalogue. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages T

9、his document comprises a front cover, an inside front cover, pages i and ii, theEN title page, pages2 to20, an inside back cover and a back cover. This standard has been updated (see copyright date) and may have had amendments incorporated. This will be indicated in the amendment table on the inside

10、 front cover. Amendments issued since publication Amd. No. Date CommentsBSEN60603-12:1998 BSI 04-1999 i Contents Page National foreword Inside front cover Foreword 2 Text of EN 60603-12 3ii blankEUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 60603-12 February 1998 ICS 31.220.10 Descriptors: El

11、ectronic components, electric connectors, printed-circuit cards, detail specifications, dimensions, general conditions, tests, integrated circuits English version Connectors for frequencies below3 MHz for use with printed boards Part12: Detail specification for dimensions, general requirements and t

12、ests for a range of sockets designed for use with integrated circuits (IEC60603-12:1992) Connecteurs pour frquences infrieures 3MHz pour utilisation avec cartes imprimes Partie12: Spcification particulire pour les dimensions, les prescriptions gnrales et les essais pour une gamme de socles conus pou

13、r emploi avec circuits intgrs (CEI60603-12:1992) Steckverbinder fr gedruckte Schaltungen fr Frequenzen unter3 MHz Teil12: Bauartspezifikation fr Mae, allgemeine Anforderungen und Prfungen fr eine Reihe von Fassungen zur Aufnahme von integrierten Schaltungen (IEC60603-12:1992) This European Standard

14、was approved by CENELEC on1998-01-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning su

15、ch national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own

16、language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portug

17、al, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B-1050 Brussels 1998 CENELEC All rights of expl

18、oitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60603-12:1998 EEN60603-12:1998 BSI 04-1999 2 Foreword The text of the International Standard IEC60603-12:1992, prepared by SC48B, Connectors, of IEC TC48, Electromechanical components and mechanical structures

19、for electronic equipment, was submitted to the formal vote and was approved by CENELEC as EN60603-12 on1998-01-01 without any modification. The following dates were fixed: Annexes designated “normative” are part of the body of the standard. In this standard,Annex ZA is normative. Annex ZA has been a

20、dded by CENELEC. Endorsement notice The text of the International Standard IEC60603-12:1992 was approved by CENELEC as a European Standard without any modification. Contents Page Foreword 2 1 Scope 3 2 Normative references 3 3 IEC type designation 4 4 Common features 5 5 Dimensions 5 6 Characteristi

21、cs 6 7 Test schedule 8 8 Dual-in-line sockets with solder termination for through-board insertion (standard type) 14 Page 9 Dual-in-line sockets with solderless wire wrapping terminations for through-board insertion (standard type) 15 10 Dual-in-line sockets with solder terminations for through-boar

22、d insertion (low-profile type) 16 11 Dual-in-line sockets with solderless wire wrapping terminations for through-board insertion (low-profile type) 17 12 Individual contact retention force gauge 18 13 Socket gauges 19 Annex ZA (normative) Normative references to international publicationswith their

23、corresponding European publications Inside back cover Figure 1 5 Figure 2 8 Figure 3 9 Figure 4 9 Figure 5 9 Figure 6 Recommended printed board hole dimensions 14 Figure 7 Recommended printed board hole dimensions 15 Figure 8 Recommended printed board hole dimensions 16 Figure 9 Recommended printed

24、board hole dimensions 17 Figure 10 End of gauge 18 Figure 11 Socket gauges 18 Table 1 5 Table 2 6 Table 3 6 Table 4 7 Table 5 7 Table 6 8 Table 7 8 latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 1998-12-01

25、latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 1998-12-01EN60603-12:1998 BSI 04-1999 3 1 Scope This part of IEC 603 covers dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits in dual-in-line forma

26、t (seeIEC191-2 specified outlines, e.g.A-50). Sockets include standard type (seeFigure 6 andFigure 7) and low-profile type (seeFigure 8 andFigure 9). Sockets with terminations for through-board insertion are intended for use with printed boards using a basic grid of2,54 mm (0,1in) as laid down in IE

27、C97. Low-profile type sockets can be mounted side-by-side and end-to-end on a grid of2,54 mm (0,1in). This detail specification does not cover test/burn-in sockets. 2 Normative references The following normative documents contain provisions which, through reference in this text, constitute provision

28、s of this part of IEC603. At the time of publication, the editions indicated were valid. All normative documents are subject to revision, and parties to agreements based on this part of IEC603 are encouraged to investigate the possibility of applying the most recent editions of the normative documen

29、ts indicated below. Members of IEC and ISO maintain registers of currently valid International Standards. IEC 97:1991, Grid systems for printed circuits. IEC 191-2:1966, Mechanical standardization of semiconductor devicesPart2: Dimensions. IEC 512-2:1985, Electromechanical components for electronic

30、equipment; basic testing procedures and measuring methodsPart2: General examination, electrical continuity and contact resistance tests, insulation tests and voltage stress tests. IEC 512-3:1976, Electromechanical components for electronic equipment; basic testing procedures and measuring methodsPar

31、t3: Current-carrying capacity tests. IEC 512-4:1976, Electromechanical components for electronic equipment; basic testing procedures and measuring methodsPart4: Dynamic stress tests. IEC 512-5:1977, Electromechanical components for electronic equipment; basic testing procedures and measuring methods

32、Part5: Impact tests (free components), static load tests (fixed components), endurance tests and overload tests. IEC 512-6:1984, Electromechanical components for electronic equipment; basic testing procedures and measuring methodsPart6: Climatic tests and soldering tests. IEC 512-7:1988, Electromech

33、anical components for electronic equipment; basic testing procedures and measuring methodsPart7: Mechanical operating tests and sealing tests. ISO 468:1982, Surface roughnessParameters, their values and general rules for specifying requirements. EN60603-12:1998 4 BSI 04-1999 3 IEC type designation S

34、ockets according to this part shall be designated by the following system: NOTE“L” stands for letter; “N” stands for number.EN60603-12:1998 BSI 04-1999 5 4 Common features 4.1 Isometric view 4.2 Survey of types Table 1 5 Dimensions 5.1 General Dimensions are given in millimeters with inch equivalent

35、s. Dimensions in inches are original. Drawings are third angle projection. The shape of the connectors may deviate from that shown in the drawings so long as the specified dimensions are not influenced. In cases where the tolerance is unspecified, 0,3mm (0,012in) is the tolerance required for millim

36、eter dimensions stated to one decimal place and 0,13mm (0,005in) is the tolerance required for millimeter dimensions stated to two decimal places. 5.2 Dual-in-line sockets 5.2.1 Solder termination Construction and dimensions should be in accordance withFigure 6 andFigure 8. 5.2.2 Wrap post Construct

37、ion and dimensions should be in accordance withFigure 7 andFigure 9. 5.2.3 Contact retention force gauge Construction and dimensions should be in accordance withFigure 10. NOTEEither notch or corner may be omitted. Figure 1 Number of contacts 06/08/10/14/16/18/20/22/24/28/32/36/40/42/48/64 Current-c

38、arrying capacity See6.2.3 Minimum creepage and clearance distance Between contacts and chassis See6.2.1 Between adjacent contacts See6.2.1EN60603-12:1998 6 BSI 04-1999 5.2.4 Insertion force, withdrawal force and contact resistance gauges Construction and dimensions should be in accordance withFigure

39、 11. 6 Characteristics 6.1 Climatic category Climatic categories are shown inTable 2. Table 2 6.2 Electrical 6.2.1 Clearance and creepage distances The permissible operating voltages depend on the application and on the applicable or specified safety requirements. Therefore the clearance and creepag

40、e distances are given as operating characteristics. The minimum clearance and creepage distance should be in accordance withTable 3. Table 3 6.2.2 Voltage proof The values are the same for performance levels PL1, PL2 and PL3. 6.2.3 Current-carrying capacity Temperature rise%t not to exceed30C. 6.2.4

41、 Initial contact resistance 6.2.5 Initial insulation resistance Performance level Category Temperature range Damp heat, steady state PL1 55/100/56 55C to+100C 56 days PL2 55/100/21 55C to+100C 21 days PL3 40/085/21 40C to+85C 21 days Minimum distance Between contacts and chassis Creepage Clearance 0

42、,5 mm (0,02 in) 0,5 mm (0,02 in) Between adjacent contacts Creepage Clearance 0,5 mm (0,02 in) 0,5 mm (0,02 in) Conditions: IEC 512-2, test 4a, method B. Standard atmospheric conditions. Contact/contact: 500V r.m.s. Conditions: IEC 512-3, test 5a. Current-carrying capacity: 0,5 A Conditions: IEC 512

43、-2, test2a. Standard atmospheric conditions. Connection points: according to7.1.1. Performance levels PL1 and PL2: Performance level PL3: 20 m7 maximum. 30 m7 maximum. Conditions: IEC 512-2, test 3a, method B. Standard atmospheric conditions. Test voltage: 500 V50 V d.c. All performance levels: 1 00

44、0 M7 minimum.EN60603-12:1998 BSI 04-1999 7 6.3 Mechanical 6.3.1 Insertion and withdrawal forces The maximum insertion and withdrawal force should be in accordance withTable 4. Table 4 6.3.2 Mechanical endurance 6.3.3 Vibration Test conditions should be in accordance withTable 5. Table 5 Conditions:

45、IEC 512-7, test13b. Mating counterpart: Gauge as perFigure 11. Number of contacts Maximum force in newtons (N) Performance level PL1 and PL2 PL3 06 13,2 19,8 08 17,6 26,4 10 22,0 33,0 14 30,8 46,2 16 35,2 52,8 18 39,6 59,4 20 44,0 66,0 22 48,4 72,6 24 52,8 79,2 28 61,6 92,4 32 70,4 105,6 36 79,2 118

46、,8 40 88,0 132,0 42 92,4 138,6 48 105,6 158,4 64 140,8 211,2 Conditions: IEC 512-5, test 9d. Mating counterpart: Sizing gauge as perFigure 10. Number of operations: 5 cycles. Conditions: IEC 512-4, test 6d. Performance level Severity PL1 10 Hz to 2000 Hz 1,5 mm (0,06 in) or147 m/s 2(15g), 3 4h PL2 1

47、0 Hz to 500 Hz 0,35 mm (0,014 in) or 49 m/s 2(5g), 3 2h PL3 10 Hz to 55 Hz 1,5 mm (0.06 in) 3 2hEN60603-12:1998 8 BSI 04-1999 The measurements of contact resistance should be carried out in accordance withFigure 2. 6.3.4 Shock Test conditions should be in accordance withTable 6. Table 6 The measurem

48、ents of contact resistance should be carried out in accordance with6.2.4 andFigure 2. 7 Test schedule 7.1 General This test schedule shows all the tests in the order in which they shall be carried out as well as the requirements to be met. An “X” in the “Requirements” column of the following tables

49、indicates that a test or conditioning shall be applied. For a complete test sequence, the number of specimens specified inTable 7 is necessary. Table 7 Figure 2 Conditions: IEC512-4, test 6c. Performance level Severity PL1 and PL2 100 g PL3 50 g Test group Performance level PL1 PL2 PL3 P 12 12 12 AP 4 4 4 BP 4 4 4 CP 4 4 4EN60603-12:1998 BSI 04-1999 9 7.1.1 Connection points for contact resistance For the measurement of contact resistance the points of connection shall be as follows: The measurement o