BS EN 60068-2-83-2011 Environmental testing Tests Test Tf Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using sold.pdf

《BS EN 60068-2-83-2011 Environmental testing Tests Test Tf Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using sold.pdf》由会员分享，可在线阅读，更多相关《BS EN 60068-2-83-2011 Environmental testing Tests Test Tf Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using sold.pdf（42页珍藏版）》请在麦多课文档分享上搜索。

1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationBS EN 60068-2-83:2011Environmental testing Part 2-83: Tests Test Tf: Solderabilitytesting of electronic components for surfacemounting devices (SMD) by the wettingbalance method

2、using solder pasteBS EN 60068-2-83:2011 BRITISH STANDARDNational forewordThis British Standard is the UK implementation of EN60068-2-83:2011. It is idenitical to IEC 60068-2-83:2011.The UK participation in its preparation was entrusted to TechnicalCommittee EPL/501, Electronic assembly technology.A

3、list of organizations represented on this committee can beobtained on request to its secretary.This publication does not purport to include all the necessaryprovisions of a contract. Users are responsible for its correctapplication. BSI 2011ISBN 978 0 580 58835 8ICS 19.040; 31.190Compliance with a B

4、ritish Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of theStandards Policy and Strategy Committee on 30 November 2011.Amendments issued since publicationDate T e x t a f f e c t e dBS EN 60068-2-83:2011EUROPEAN STANDARD EN 60068-2-83 N

5、ORME EUROPENNE EUROPISCHE NORM October 2011 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Management Centre: Avenue Marnix 17, B - 1000 Brussels 2011 CENELEC - All rights of exploitatio

6、n in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60068-2-83:2011 E ICS 19.040; 31.190 English version Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

7、using solder paste (IEC 60068-2-83:2011) Essais denvironnement - Partie 2-83: Essais - Essais Tf: Essai de brasabilit des composants lectroniques pour les composants pour montage en surface (CMS) par la mthode de la balance de mouillage utilisant de la pte braser (CEI 60068-2-83:2011) Umweltprfungen

8、 - Teil 2-83: Prfungen - Prfung Tf: Prfung der Ltbarkeit von Bauelementen der Elektronik fr Oberflchenmontage (SMD) mit der Benetzungswaage unter Verwendung von Lotpaste (IEC 60068-2-83:2011) This European Standard was approved by CENELEC on 2011-10-12. CENELEC members are bound to comply with the C

9、EN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management C

10、entre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same st

11、atus as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands,

12、 Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. BS EN 60068-2-83:2011EN 60068-2-83:2011 - 2 - Foreword The text of document 91/975/FDIS, future edition 1 of IEC 60068-2-83, prepared by IEC/TC 91 “Electronics assembly technology“ was submitte

13、d to the IEC-CENELEC parallel vote and approved by CENELEC as EN 60068-2-83:2011. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2012-07-12 latest date by which the nati

14、onal standards conflicting with the document have to be withdrawn (dow) 2014-10-12 Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. End

15、orsement notice The text of the International Standard IEC 60068-2-83:2011 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60068-2-69 NOTE Harmonized as EN 60068-

16、2-69. IEC 61189-5 NOTE Harmonized as EN 61189-5. BS EN 60068-2-83:2011- 3 - EN 60068-2-83:2011 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following referenced documents are indispensable for the application of this docum

17、ent. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publi

18、cation Year Title EN/HD Year IEC 60068-1 - Environmental testing - Part 1: General and guidance EN 60068-1 - IEC 60068-2-20 2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads EN 60068-2-20 2008 IEC 60068-2-58

19、- Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) EN 60068-2-58 - IEC 60194 - Printed board design, manufacture and assembly - Terms and definitions EN 60194 - IEC 6

20、1190-1-3 - Attachment materials for electronic assembly -Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications EN 61190-1-3 - 2 60068-2-83 IEC:2011 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope . 8 2 Normative referen

21、ces . 8 3 Terms and definitions . 8 4 Test 9 4.1 General description . 9 4.2 Test methods 9 5 Preconditioning 9 6 Preparation 10 6.1 Solder paste 10 6.2 Test jig plate . 10 6.3 Specimen holder . 10 7 Quick heating method . 10 7.1 Equipment . 10 7.2 Test jig plate . 11 7.3 Preparation . 12 7.4 Test c

22、ondition 12 7.4.1 Test temperature . 12 7.4.2 Feed of solder paste and immersion condition . 13 7.4.3 Immersion and withdrawal conditions for test specimen . 14 7.5 Test procedure 14 7.6 Presentation of the result 15 7.7 Characterisation parameter examples . 15 8 Synchronous method 16 8.1 Equipment

23、. 16 8.2 Test jig plate . 17 8.3 Synchronous fixture . 17 8.4 Preparation . 17 8.5 Test condition 17 8.5.1 Test temperature . 17 8.5.2 Feed of solder paste and immersion condition . 17 8.5.3 Immersion and withdrawal conditions for the test specimen . 17 8.6 Test procedure 17 8.7 Presentation of the

24、results . 18 8.8 Characterisation parameter examples . 19 9 Temperature profile method 19 9.1 Equipment . 19 9.2 Test jig plate . 19 9.3 Preparation . 20 9.4 Test condition 20 9.4.1 Test temperature . 20 9.4.2 Feed of solder paste and immersion condition . 21 9.4.3 Immersion and withdrawal condition

25、s for test specimen . 21 9.5 Test procedure 21 60068-2-83 IEC:2011 3 9.6 Presentation of the result 22 9.7 Characterisation parameter examples . 23 Annex A (normative) Equipment for the quick heating and synchronous method 24 Annex B (informative) Reading of the output data and correction of the res

26、ult in the quick heating test 25 Annex C (normative) Test equipment for the temperature profile method . 28 Annex D (informative) Reading of the output data and correction of the result in the temperature profile test . 29 Annex E (informative) Caveats / Notes. 32 Bibliography 36 Figure 1 Examples o

27、f the quick heating method test equipment . 11 Figure 2 Example of test jig plate for quick heating and synchronous method 12 Figure 3 Example of the temperature profile. 13 Figure 4 Example of applying solder paste to a test jig plate 14 Figure 5 Typical output shape of signal in the quick heating

28、method 15 Figure 6 Example of synchronous method test equipment 16 Figure 7 Example of synchronous fixture . 17 Figure 8 Typical output shape of signal in the synchronous method . 18 Figure 9 Example of the system for temperature profile method test equipment . 19 Figure 10 Example of the temperatur

29、e profile . 20 Figure 11 Example of applying solder paste to a test jig plate 22 Figure 12 Typical output shape of signal in the temperature profile method . 23 Figure B.1 Typical wetting force changes in quick heating method . 26 Figure B.2 Example of correction of the initial time of wetting (Fais

30、 larger than 0,5F1,max) . 27 Figure B.3 Example of correction of the initial time of wetting (Fais 0,5F1,maxor less) . 27 Figure D.1 Typical output forms for profile temperature test . 30 Figure D.2 The case when an extruding force (1,1Fmaxor larger) is generated immediately after the beginning of w

31、etting 31 Figure E.1 Explanation diagram of test procedure for the quick heating method . 33 Figure E.2 Explanation diagram of test procedure for synchronous method 34 Figure E.3 Showing the wetting force (pull) of some solder pastes . 34 Figure E.4 Explanation diagram of the test procedure for the

32、temperature profile method . 35 Table 1 Specification of the test jig plate for quick heating and synchronous method . 11 Table 2 Recommended test conditions of the quick heating and synchronous method for rectangular SMD 14 Table 3 Specification of the test jig plate of the temperature profile meth

33、od . 20 Table 4 Recommended test conditions of the temperature profile method for rectangular SMD . 21 4 60068-2-83 IEC:2011 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ ENVIRONMENTAL TESTING Part 2-83: Tests Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) b

34、y the wetting balance method using solder paste FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on

35、 all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Pu

36、blication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation.

37、 IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of

38、 opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made

39、 to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transpar

40、ently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent cert

41、ification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability sh

42、all attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including le

43、gal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this pu

44、blication. International Standard IEC 60068-2-83 has been prepared by IEC technical committee 91: Electronics assembly technology. The text of this standard is based on the following documents: FDIS Report on voting 91/975/FDIS 91/992/RVD Full information on the voting for the approval of this stand

45、ard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. 60068-2-83 IEC:2011 5 The committee has decided that the contents of this publication will remain unchanged until the stability date indicated o

46、n the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. 6 60068-2-83 IEC:2011 INTRODUCTION The International Electrotechnical Commission (IEC) draws atte

47、ntion to the fact that it is claimed that compliance with this document may involve the use of patents as indicated below. IEC takes no position concerning the evidence, validity and scope of patent rights. The holders of the patent rights have assured the IEC that they are willing to negotiate lice

48、nces either free of charge or under reasonable and non-discriminatory terms and conditions with applicants throughout the world. In this respect, the statement of the holders of these patent rights are registered with IEC. Information may be obtained as indicated below. a) EU patent 0920488.4 “Synch

49、ronous test method for assessing soldering pastes”1Gen3 Systems LTD Unit B2 Armstrong Mall Farnborough GU14 0NR United Kingdom b) JP Patent 2630712 “Testing method of characteristics of solder paste and the equipment for the test” Malcom Co., Ltd 4-15-10 Honmachi, Shibuya-ku Tokyo, 151-0071 Japan c) Patent JP 3789041 “Solderability measuring apparatus” Patent JP 3552061 “Solderability tester and solderability test method” Patent JP 3498100 “Method and devic