BS DD IEC PAS 62588-2008 Marking and labeling of components PCBs and PCBAs to identify lead(Pb) Pb-free and other attributes《鉴别有铅(PB)、无铅和其它属性的元件、印制电路板(PCBs)和印制电路板组件(PCBAs)的标记和标注》.pdf

《BS DD IEC PAS 62588-2008 Marking and labeling of components PCBs and PCBAs to identify lead(Pb) Pb-free and other attributes《鉴别有铅(PB)、无铅和其它属性的元件、印制电路板(PCBs)和印制电路板组件(PCBAs)的标记和标注》.pdf》由会员分享，可在线阅读，更多相关《BS DD IEC PAS 62588-2008 Marking and labeling of components PCBs and PCBAs to identify lead(Pb) Pb-free and other attributes《鉴别有铅(PB)、无铅和其它属性的元件、印制电路板(PCBs)和印制电路板组件(PCBAs)的标记和标注》.pdf（22页珍藏版）》请在麦多课文档分享上搜索。

1、DRAFT FOR DEVELOPMENTDD IEC/PAS 62588:2008Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributesICS 31.190g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56g55g3g37g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g

2、40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58DD IEC/PAS 62588:2008This Draft for Development was published under the authority of the Standards Policy and Strategy Committee on 31 October 2008 BSI 2008ISBN 978 0 580 64571 6National forewordThis Draft for Development is the UK implementation

3、of IEC/PAS 62588:2008.This publication is not to be regarded as a British Standard.It is being issued in the Draft for Development series of publications and is of a provisional nature. It should be applied on this provisional basis, so that information and experience of its practical application ca

4、n be obtained.A PAS is a Technical Specification not fulfilling the requirements for a standard, but made available to the public and established in an organization operating under a given procedure.A review of this Draft for Development will be carried out not later than three years after its publi

5、cation.Notification of the start of the review period, with a request for the submission of comments from users of this Draft for Development, will be made in an announcement in the appropriate issue of Update Standards. According to the replies received, the responsible BSI Committee will judge whe

6、ther the validity of the PAS should be extended for a further three years or what other action should be taken and pass their comments on to the relevant international committee.Observations which it is felt should receive attention before the official call for comments will be welcomed. These shoul

7、d be sent to the Secretary of the responsible BSI Technical Committee at British Standards House, 389 Chiswick High Road, London W4 4AL.The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly technology.A list of organizations represented on this com

8、mittee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application.Amendments/corrigenda issued since publicationDate CommentsIEC/PAS 62588Edition 1.0 2008-09PUBLICLY AVAILABLE

9、SPECIFICATIONMarking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes DD IEC/PAS 62588:2008blankIPC/JEDEC J-STD-609PCBs and PCBAs to Identify Lead(Pb), A joint standard developed by the Marking, Symbols and Labelsfor Identification of Assemblies, Componen

10、ts and Devices TaskGroup (4-34b) and JEDEC Committee JC14.4 Quality Processesand MethodsUsers of this publication are encouraged to participate in thedevelopment of future revisions.Contact:JEDECSolid State Technology Association2500 Wilson BoulevardArlington, VA 22201-3834Tel 703 907.7500Fax 703 90

11、7.7501IPC3000 Lakeside Drive, Suite 309SBannockburn, Illinois60015-1249Tel 847 615.7100Fax 847 615.7105Supersedes:JESD97 - May 2004IPC-1066 - January 2005ASSOCIATION CONNECTINGELECTRONICS INDUSTRIES Pb-Free and Other AttributesMarking and Labeling of Components, DD IEC/PAS 62588:2008iiCopyright 2007

12、, IPC/JEDEC; 2008, IECTable of Contents IPC/JEDEC Foreword. v IEC Foreword.vii 1 SCOPE 1 1.1 Purpose 1 2 REFERENCE DOCUMENTS . 1 2.1 IPC 1 2.2 JEDEC 1 2.3 IEC 1 2.4 European Parliament 1 2.5 ANSI . 1 3 TERMS AND DEFINITIONS . 1 3.1 2D Code Label (Matrix) . 1 3.2 2 Li (or 2LI) . 1 3.3 2ndLevel Interc

13、onnect . 2 3.4 2ndLevel Interconnect Component Label 2 3.5 2ndLevel Interconnect Terminal Finish or Material . 2 3.6 Component . 2 3.7 Base Materials. 2 3.8 Halogen-Free Board . 2 3.9 Homogeneous Material . 2 3.10 intct (or INTCT) . 2 3.11 Linear Bar Code Label 2 3.12 Material Category 2 3.13 Maximu

14、m Component Temperature . 2 3.14 Pb-Free . 2 3.15 Pb-Free Symbol 2 4 SYMBOLS, LABELS AND MARKS 2 4.1 Material Category Symbol 2 4.1.1 Size and Location . 2 4.1.2 Color 2 4.1.3 Font 2 4.2 Pb-Free Symbol. 2 4.3 2ndLevel Interconnect Component Label 3 4.3.1 Size 3 4.3.2 Color . 3 5 MARKING/LABELING CAT

15、EGORIES .4 5.1 PCB Base Material Categories 4 5.1.1 Halogen-Free Base Material .4 5.2 PCB Surface Finish Categories .4 5.2.1 Pb-Containing . 4 5.2.2 Pb-Free .4 5.3 2ndLevel Interconnect Categories .4 5.3.1 Pb-Containing . 4 5.3.2 Pb-Free .4 5.4 Conformal Coating Categories 4 6 COMPONENT MARKING AND

16、LABELING .4 6.1 Component Marking 4 6.2 Lowest Level Shipping Container Labeling . 4 7 PCB/ASSEMBLY MARKING AND LABELING.5 7.1 PCB Marking5 7.1.1 PCB Shipping Container Labeling .5 7.2 Assembly Marking .5 7.2.1 Assembly Shipping Container Labeling5 7.3 Solder Category Marking Sequence . 5 7.4 Locati

17、on .5 7.5 Size .5 7.6 Color .5 7.7 Font .5 7.8 Method 5 7.9 Marking Sequence 5 7.10 Re-Marking Changes in PCBA Materials . .6 8 MARKING AND/OR LABELING OF LEAD (Pb)-CONTAINING COMPONENTS, PCBs, AND PCB ASSEMBLIES 6 8.1 Marking and Labeling of Components6 8.2 Marking and Labeling of PCBs.6 8.3 Markin

18、g and Labeling of PCB Assemblies . 6 9 SUMMARY OF MARKING AND LABELING REQUIREMENTS . . 7 Annex A Acknowledgment8IPC/JEDEC J-STD-609 May 2007DD IEC/PAS 62588:2008FiguresFigure 3-1 Examples of Materials that Comprise the 2ndLevel Interconnect . 2Figure 4-1 Example of Mark Indicating Material Category

19、e2 and the Optional Circle, Ellipse, Underlineor Parentheses 2Figure 4-2 Pb-Free Symbol 3Figure 4-3 Example of 2ndLevel Interconnect ComponentLabel Indicating a Pb-Containing Material 3Figure 4-4 Example of 2ndLevel Interconnect ComponentLabel Indicating a Pb-Free e2 Material with aMaximum Component

20、 Temperature of 260C 3Figure 4-5 Example of 2ndLevel Interconnect ComponentLabel Utilizing the Lead Free Symbol IndicatingBoth Pb-Free Material with Category and Maxi-mum Component Temperature Indicated on anAdjacent Label 3Figure 6-1 Example of Component Marking 5Figure 7-1 Example of Board/Assembl

21、y Markings . 6TablesTable 9-1 Marking and Labeling Summary . 7IPC/JEDEC J-STD-609 May 2007iiiCopyright 2007, IPC/JEDEC; 2008, IECDD IEC/PAS 62588:2008IPC and JEDEC Standards and Publications are designed to serve the public interest througheliminating misunderstandings between manufacturers and purc

22、hasers, facilitating interchange-ability and improvement of products, and assisting the purchaser in selecting and obtainingwith minimum delay the proper product for his particular need. Existence of such Standardsand Publications shall not in any respect preclude any member or nonmember of IPC orJE

23、DEC from manufacturing or selling products not conforming to such Standards andPublications, nor shall the existence of such Standards and Publications preclude theirvoluntary use by those other than IPC or JEDEC members, whether the standard is tobe used either domestically or internationally.Recom

24、mended Standards and Publications are adopted by IPC or JEDEC without regardto whether their adoption may involve patents on articles, materials, or processes. By suchaction, IPC or JEDEC do not assume any liability to any patent owner, nor do they assumeany obligation whatever to parties adopting t

25、he Recommended Standard or Publication.Users are also wholly responsible for protecting themselves against all claims of liabilitiesfor patent infringement. The material in this joint standard was developed by the Marking,Symbols and Labels for Identification of Assemblies, Components and Devices Ta

26、sk Group(4-34b) of the Materials Identification Subcommittee (4-34).For Technical Information Contact:JEDECSolid State Technology Association2500 Wilson BoulevardArlington, VA 22201-3834Phone (703) 907-7560Fax (703) 907-7501IPC3000 Lakeside Drive, Suite 309SBannockburn, Illinois60015-1249Tel 847 615

27、.7100Fax 847 615.7105Copyright 2007 The Electronic Industries Alliance, Arlington, Virginia, and the IPC, Bannockburn, Illinois. All rights reserved under bothinternational and Pan-American copyright conventions. Any copying, scanning or other reproduction of these materials without the priorwritten

28、 consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the United States.ivCopyright 2007, IPC/JEDEC; 2008, IECIPC/JEDEC J-STD-609 May 2007DD IEC/PAS 62588:2008IPC/JEDEC FOREWORDDirective 2002/95/EC of the European Parliament and of the Counci

29、l on the restriction of the use of certain hazardous sub-stances in electrical and electronic equipment, commonly referred to as the RoHS Directive1, and other legislation aredriving the electronics industry towards the use of lead free (Pb-free) solders and components with Pb-free 2ndlevel inter-co

30、nnect terminal finishes and materials.There are different Pb-free solders being used for the various soldering operations in electronics. Each of these solders mayrequire different processing temperatures for assembly, rework, and repair. Some means of communicating the identity ofthe Pb-free or Pb-

31、containing solder must be provided so that those performing assembly, rework and repair are aware of thetemperature capabilities and limitations of these solders, and are able to distinguish between Pb-free and Pb-containing sol-ders.Marking of components and/or labeling their shipping containers ar

32、e needed to identify and distinguish Pb-containing andPb-free 2ndlevel interconnect terminal finishes and materials. Labeling electronic assemblies using Pb-free solder materialswill facilitate end-of-life recycling of electronic equipment. This standard sets forth minimum requirements and includeso

33、ptions for the provision of additional information.This paradigm shift to Pb-free electronics has created a need for identification of traditional Pb-containing coatings, finishesand solders. This standard can be utilized to identify the presence of lead (Pb) for those markets as described in Clause

34、s 5(Marking/Labeling Categories) and 8 (Marking and/or Labeling of Pb-Containing Components, PCBs, and PCB Assem-blies). This standard supersedes JESD97 and IPC-1066.1. The RoHS Directive itself is not a law; rather, it is a direction to the European Union Member States to implement their own laws e

35、mbodying the requirementsof the Directive. These laws were required to be in effect as of July 1, 2006.vCopyright 2007, IPC/JEDEC; 2008, IECIPC/JEDEC J-STD-609 May 2007DD IEC/PAS 62588:2008This Page Intentionally Left BlankviCopyright 2007, IPC/JEDEC; 2008, IECIPC/JEDEC J-STD-609 May 2007DD IEC/PAS

36、62588:2008PAS 62588 IEC:2008(E)INTERNATIONAL ELECTROTECHNICAL COMMISSION _ Marking and Labeling of Components, PCBs and PCBAs to Identify Lead(Pb), Pb-Free and Other Attributes FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

37、all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards,

38、Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory

39、 work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations

40、. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recom

41、mendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by an

42、y end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional pub

43、lication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication

44、. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for

45、 costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct ap

46、plication of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. A PAS is a technical specification not fulfilling the requir

47、ements for a standard but made available to the public. IEC-PAS 62588 was submitted by IPC/JEDEC and has been processed by IEC technical committee 91: Electronics assembly technology. The text of this PAS is based on the following document: This PAS was approved for publication by the P-members of t

48、he committee concerned as indicated in the following document Draft PAS Report on voting 91/767/PAS 91/783/RVDFollowing publication of this PAS, the technical committee or subcommittee concerned will investigate the possibility of transforming the PAS into an International Standard. An IEC-PAS licen

49、ce of copyright and assignment of copyright has been signed by the IEC and IPC/JEDEC and is recorded at the Central Office. This PAS shall remain valid for an initial maximum period of 3 years starting from the publication date. The validity may be extended for a single 3-year period, following which it shall be revised to become another type of normative document, or shall be withdrawn. viiCopyright 2007, IPC/JEDEC; 2008, IECDD IEC/PAS 62588:2008This Page Intentionally Left BlankIPC/JEDEC J-STD-609 May 2007viiiCopyright 2007, IPC/JEDEC; 2008, IECDD IEC