ASTM D3013-1999(2004)e1 Standard Specification for Epoxy Molding Compounds《环氧基树脂模塑化合物的标准规范》.pdf

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1、Designation: D 3013 99 (Reapproved 2004)e1Standard Specification forEpoxy Molding Compounds1This standard is issued under the fixed designation D 3013; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revision, the year of last revision. A nu

2、mber in parentheses indicates the year of last reapproval. Asuperscript epsilon (e) indicates an editorial change since the last revision or reapproval.This standard has been approved for use by agencies of the Department of Defense.e1NOTEEditorially removed reference to MIL-STD-105 in Section 2 in

3、October 2004.1. Scope*1.1 This specification covers requirements for epoxy ther-mosetting molding compounds. It provides for their identifica-tion, quality control, and purchase in such a manner that thepurchaser and the seller can agree on the substantial similarityof different commercial lots or s

4、hipments.1.2 The compounds covered under this specification consistof mixtures or blends of epoxy resins and curing agentsintimately combined, in an unreacted or partially reactedcondition, with fillers, reinforcements, colorants, and otherchemical agents.1.3 The values stated in SI units are to be

5、regarded as thestandard.NOTE 1The properties included in this specification are those re-quired to identify the kinds of molding compounds covered. There may beother requirements necessary to define particular characteristics. Thesewill be added to the specification as their inclusion becomes genera

6、llydesirable and the necessary test data and methods become available.NOTE 2There is no similar or equivalent ISO standard.2. Referenced Documents2.1 ASTM Standards:2D 149 Test Method for Dielectric Breakdown Voltage andDielectric Strength of Solid Electrical Insulating Materialsat Commercial Power

7、FrequenciesD 150 Test Methods for A-C Loss Characteristics andPermittivity (Dielectric Constant) of Solid Electrical Insu-lating MaterialsD 256 Test Method for Determining the Izod PendulumImpact Resistance of PlasticsD 495 Test Method for High-Voltage, Low-Current, DryArc Resistance of Solid Electr

8、ical InsulationD 570 Test Method for Water Absorption of PlasticsD 618 Practice for Conditioning Plastics for TestingD 638 Test Method for Tensile Properties of PlasticsD 648 Test Method for Deflection Temperature of PlasticsUnder Flexural LoadD 790 Test Methods for Flexural Properties of Unreinforc

9、edand Reinforced Plastics and Electrical Insulating MaterialsD 883 Terminology Relating to PlasticsD 1896 Practice for Transfer Molding Specimens of Ther-mosetting CompoundsD 2863 Test Method for Measuring the Minimum OxygenConcentration to Support Candle-Like Combustion ofPlastics (Oxygen Index)D 3

10、892 Practice for Packaging/Packing of Plastics3. Terminology3.1 DefinitionsDefinitions of terms used in this specifica-tion are in accordance with Terminology D 883.4. Classification4.1 GradesThis specification is subdivided into variousgrades of epoxy molding compounds based on physical prop-erties

11、. This specification provides for a system of characteriza-tion and identification which enables coverage for all commer-cially available grades having properties within the range of thepossible combinations as may be selected from Table 1.Agrade is designated by the cell numbers for each property i

12、n theorder in which they are listed in Table 1. When a property is notspecified, a “0” is entered as the cell number.4.2 ClassesEach of the grades of epoxy molding com-pound may be further subdivided into classes according tospecial requirements. A class is designated by a capital letterfollowed by

13、cell designation corresponding to the requirements1This specification is under the jurisdiction of ASTM Committee D20 onPlastics and is the direct responsibility of Subcommittee D20.16 on ThermosettingMaterials.Current edition approved Oct. 1, 2004. Published January 2005. Originallyapproved in 1972

14、. Last previous edition approved in 1999 as D 3013 - 99.2For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at serviceastm.org. For Annual Book of ASTMStandards volume information, refer to the standards Document Summary page onthe ASTM website.1*A S

15、ummary of Changes section appears at the end of this standard.Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.detailed in Table 2. Where no special requirements, in additionto grade properties, are needed, no class designation is show

16、n.NOTE 3An example of this classification system would be grade12324-D-00200-F-3 an epoxy molding compound having the followingrequirements (see Table 1 and Table 2):NOTE 4Although the values listed in Table 1 and Table 2 arenecessary to include the range of properties available in existing material

17、s,they should not be interpreted as implying that every possible combinationof the properties exists or can be obtained commercially.5. General Requirements5.1 The molding compounds shall be of uniform composi-tion and so formulated as to conform to the requirements of thisspecification.5.2 The appa

18、rent density, bulk factor, flow, particle size, andcolor of the compounds shall be as agreed upon between thepurchaser and the seller in the order or contract. Propertiesother than those specified in this specification may also beagreed upon.6. Detail Requirements6.1 Test specimens molded by transfe

19、r in accordance withPractice D 1896, or compression methods in accordance withthe suppliers recommendations shall conform to the require-ments prescribed in Section 4 and Table 1 and Table 2 for thegrade and classes specified.7. Sampling7.1 A batch or lot shall be considered as a unit of manufac-tur

20、e and may consist of a blend of two or more production runsof a resin.7.2 Adequate statistical sampling procedures shall be used.TABLE 1 Detail Grade Requirements for Epoxy Molding CompoundsDesig-nationOrderNo.Property and UnitGrades (Cell Limits)01 23451 Water absorption, % in 24 h unspecified 3.02

21、 Flexural strength, MPa unspecified 2073 Impact resistance, unspecifiedJ/m of notch 5344 Tensile strength, unspecifiedMPa 1385 Deflection temperature unspecifiedunder load,C 70 to 100 101 to 150 151 to 200 201 to 250 250TABLE 2 Detail Class Requirements for Epoxy Molding CompoundsClassClassDesignati

22、onDesigna-tion OrderNo.Property and UnitClasses (Cell Limits)012345Dielectric D 1 permittivity unspecified 6.002 dissipation factor unspecified 0.20dielectric strength, V/mil(short-time):3 dry unspecified 4004 wet unspecified min 80 % of dry value using same test5 arc resistance, s unspecified 180Fl

23、ame-retardant F 1 flammability unspecified 40 . .D 3013 99 (2004)e128. Specimen Preparation8.1 Unless otherwise agreed between the purchaser and theseller, test specimens shall be molded by transfer or compres-sion methods in accordance with the suppliers recommenda-tions. The method of sample prepa

24、ration shall be reported.9. Conditioning9.1 Unless otherwise specified in the test methods or in thisspecification for those tests where conditioning is required, themolded test specimen shall be conditioned in accordance withProcedure B of Practice D 618.9.2 Test ConditionsConduct tests in the stan

25、dard labora-tory atmosphere of 23 6 2C and 50 6 5 % relative humidity,unless otherwise specified in the test methods or in thisspecification. In cases of disagreement, the tolerances shall be61C and 62 % relative humidity.10. Test Methods10.1 The properties enumerated in this specification shall bed

26、etermined in accordance with the following test methods:10.2 Water AbsorptionTest Method D 570. Test speci-mens shall be 51 by 3.2-mm disks. The 24-h immersion testshall be used.10.3 Flexural StrengthTest Method D 790. Procedure Ashall be used with test specimens, 6.4 by 12.7 by 127-mm bars.10.4 Imp

27、act Resistance (Izod)Test Method D 256,Method A. Specimens shall be 12.7 by 12.7 by 63.5 mm.10.5 Tensile StrengthTest Method D 638. The Type Ispecimen, 3.2 6 0.4-mm thick, shall be used.10.6 Deflection Temperature Under LoadTest MethodD 648. Test specimens shall be 12.7 by 12.7 by 127-mm barstested

28、at a fiber stress of 1.8 MPa.10.7 Permittivity and Dissipation FactorTest MethodsD 150. Measure the permittivity and dissipation factor at 1 kHzusing 102 by 3.2-mm disks.10.8 Dielectric Strength (Dry)Test Methods D 149.Specimens shall be 102 by 3.2-mm disks tested under oilbetween cylindrical brass

29、electrodes 25.4 mm in diameter, withedge rounded to a radius of 3.2 mm.10.9 Dielectric Strength (Wet)Same test as for dielectricstrength (dry) only using test specimens conditioned in accor-dance with Procedure E of Practice D 618.10.10 Arc ResistanceTest Method D 495, using tungstenrod electrodes.1

30、0.11 FlammabilityTest Method D 2863.11. Number of Tests11.1 Routine testing of each batch or lot shall be limited tothe specified properties chosen from Table 1 and Table 2 of thisspecification unless otherwise designated.11.2 One set of specimens for those tests in Section 11 thatare designated sha

31、ll be considered sufficient for testing thebatch or lot. If the number of that specimen should not bestipulated in the test methods, the number required may beagreed upon between the purchaser and the seller. The averageresults for those specimens shall comply with the requirementsprescribed in this

32、 specification.12. Packaging and Package Marking12.1 PackagingThe material shall be packaged in airtightstandard commercial containers, so constructed as to ensureacceptance by common or other carriers for safe transportationat the lowest rate to the point of delivery, unless otherwisespecified in t

33、he contract or order.12.2 Package MarkingUnless otherwise agreed upon be-tween the purchaser and the seller, shipping containers shallidentify the material and its supplier, the batch or lot number,its type, and the quantity contained.12.3 All packing, packaging, and marking provisions ofPractice D

34、3892 shall apply to this specification.13. Keywords13.1 epoxy; molding compounds (thermosetting)SUMMARY OF CHANGESCommittee D20 has identified the location of selected changes to this standard since the last issue,D 3013 - 99, that may impact the use of this standard. (October 1, 2004)(1) Five year

35、review and reapproval with editorial removal ofthe reference to MIL-STD-105 in Section 2.ASTM International takes no position respecting the validity of any patent rights asserted in connection with any item mentionedin this standard. Users of this standard are expressly advised that determination o

36、f the validity of any such patent rights, and the riskof infringement of such rights, are entirely their own responsibility.This standard is subject to revision at any time by the responsible technical committee and must be reviewed every five years andif not revised, either reapproved or withdrawn.

37、 Your comments are invited either for revision of this standard or for additional standardsand should be addressed to ASTM International Headquarters. Your comments will receive careful consideration at a meeting of theresponsible technical committee, which you may attend. If you feel that your comm

38、ents have not received a fair hearing you shouldmake your views known to the ASTM Committee on Standards, at the address shown below.This standard is copyrighted by ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959,United States. Individual reprints (single or multiple copies) of this standard may be obtained by contacting ASTM at the aboveaddress or at 610-832-9585 (phone), 610-832-9555 (fax), or serviceastm.org (e-mail); or through the ASTM website(www.astm.org).D 3013 99 (2004)e13