ARMY MIL-HDBK-115 B-2011 US ARMY REVERSE ENGINEERING HANDBOOK (GUIDELINES AND PROCEDURES).pdf
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1、 MIL-HDBK-115B(ARMY) 27 APRIL 2011 SUPERSEDING MIL-HDBK-115A(ARMY) 1 JUNE 2006 DEPARTMENT OF DEFENSE HANDBOOK US ARMY REVERSE ENGINEERING HANDBOOK (GUIDELINES AND PROCEDURES) This handbook is for guidance only. Do not cite this document as a requirement. AMSC N/A AREA MISCNOT MEASUREMENT SENSITIVE P
2、rovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-HDBK-115B(ARMY) ii FOREWORD 1. This handbook is approved for use by the Department of the Army and is available for use by all Departments and Agencies of the Department of Defense. 2. This handbook
3、provides guidelines and procedures for reverse engineering, and can be employed by in-house personnel, engineering services contractors, and manufacturing contractors performing reverse engineering. 3. Comments, suggestions, or questions on this document should be addressed to Commander, US Army Avi
4、ation and Missile Command, ATTN: AMSRD-AMR-SE-TD-ST, Redstone Arsenal, AL 35898-5000 or emailed to malinda.allcorn1us.army.mil. Since contact information may change, you may want to verify the currency of this address information using the ASSIST Online database at https:/assist.daps.dla.mil/. Provi
5、ded by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-HDBK-115B(ARMY) iii CONTENTS PARAGARAPH PAGE 1. SCOPE 1.1 Scope 1 2. APPLICABLE DOCUMENTS 2.1 General. 1 2.2 Government documents. 1 2.2.1 Specifications, standards, and handbooks 1 2.3 Non-Government pu
6、blications. 2 2.4 Order of precedence. 5 3. DEFINITIONS 3.1 Applicable definitions. 5 4. GENERAL GUIDANCE 4.1 Background. 5 4.2 Rationale. 5 4.3 DoD replenishment parts breakout program DAR-S6. 6 4.4 Data rights. 6 4.4.1 Proper use. 6 4.4.2 Data screening. 7 4.4.3 Formal authorization. 7 4.4.4 Paten
7、t restrictions 7 5. DETAILED GUIDANCE 5.1 The reverse engineering process 8 5.1.1 Primary objective 8 5.1.2 Recommended changes. 9 5.2 Functional/economics analysis 9 5.3 Data collection. 9 5.3.1 Documentation 9 5.3.2 Data collection phase. 9 5.4 Alternate data sources 10 5.4.1 Typical documentation
8、 10 5.4.2 Verbal input. 10 5.4.3 Technical manuals. 10 5.4.4 Command sources of information. 11 5.5 Screening of requested documentation 11 5.6 Candidate file. 11 5.7 Data evaluation 12 5.8 Missing data required 12 5.8.1 Identify missing data. 12 5.8.2 Technical documentation 12 Provided by IHSNot f
9、or ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-HDBK-115B(ARMY) iv PARAGARAPH PAGE 5.8.3 Data evaluation considerations 13 5.8.4 Data call sheet 14 5.9 Hardware required. 14 5.10 Test requirements 14 5.10.1 Initial inspection 14 5.10.2 Test plan objective. 14 5.10.3
10、 Worse-case analysis. 15 5.11 Reverse engineering cost-estimate and schedule. 15 5.11.1 Review. 15 5.11.2 Development 15 5.11.3 Sample cost-estimate. 15 5.11.4 Prototype values 15 5.11.5 Dollar values 15 5.12 Disassembly procedures. 15 5.13 Initial inspection and testing. 16 5.13.1 Post-shipment ins
11、pection 16 5.13.2 Pre-disassembly photographs 16 5.14 Physical configuration audit (PCA) 16 5.14.1 Formal examination 16 5.14.2 Hardware/documentation comparison 16 5.15 Initial measurements. 16 5.16 Disassembly 17 5.16.1 Record keeping. 17 5.16.2 Parts control 17 5.16.3 Terminal/pin markings 17 5.1
12、6.4 Inseparable assemblies 17 5.17 Parts identification/screening 17 5.17.1 Identification. 17 5.17.2 Economic analysis 17 5.17.3 Document research 18 5.17.4 Master Cross-Reference List (MCRL) 18 5.17.5 Government-Industry Data Exchange Program (GIDEP). 18 5.17.5.1 Identify sources 18 5.17.5.2 GIDEP
13、 representatives/membership. 19 5.17.5.3 Additional sources of data. 19 5.18 Technical data package requirements 19 5.19 Reverse engineering management plan. 19 5.19.1 Reverse engineering management plan objective 19 5.19.2 Management plan development. 19 5.19.3 Tasking plan. 19 5.19.4 Program Evalu
14、ation and Review Technique (PERT) Chart 20 5.19.5 Identify lead times. 20 5.20 Hardware analysis. 20 5.20.1 Hardware analysis objective 20 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-HDBK-115B(ARMY) v PARAGARAPH PAGE 5.20.2 Accuracy 20 5.21 D
15、imensional analysis. 20 5.21.1 Dimensional analysis objective. 20 5.21.2 Considerations. 21 5.21.3 Process variation 22 5.21.4 Establish tolerances. 22 5.21.5 Lot determination 23 5.22 Material analysis. 23 5.22.1 Material analysis objective. 23 5.22.2 Sample size 23 5.23 Electrical/electronic analy
16、sis. 23 5.23.1 Electrical/electronic analysis objective 23 5.23.2 Validate documentation. 23 5.23.3 Complete documentation. 24 5.23.4 Incomplete documentation 24 5.23.5 Design validation. 24 5.23.6 Environmental requirements. 25 5.23.7 Performance characteristics. 25 5.24 Engineering sketches and sp
17、ecifications. 25 5.24.1 Engineering sketches and specifications objective 25 5.24.2 Technical data requirements 26 5.24.3 Test requirement specifications. 26 5.25 Level 3 drawings. 26 5.25.1 Level 3 drawings objective. 26 5.25.2 Preparation. 26 5.25.3 Content. 26 5.25.4 Considerations. 27 5.25.5 Dra
18、wing media 28 5.25.6 Completeness of drawings. 28 5.25.7 Computer-generated drawings. 28 5.25.8 Library files. 28 5.25.9 Drawing references 28 5.25.10 Quality control review. 28 5.25.11 Candidate file inclusions 28 5.26 Producibility study 29 5.26.1 Purpose 29 5.26.2 Areas of consideration. 29 5.26.
19、2.1 Dimensions/tolerances. 29 5.26.2.2 Materials 29 5.26.2.3 Heat treatment. 30 5.26.2.4 Finishes 30 5.26.2.5 Clean and joining methods 30 5.26.2.6 Coatings. 30 5.26.2.7 Selection of standard parts/components 30 Provided by IHSNot for ResaleNo reproduction or networking permitted without license fro
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