BS QC 400203-1993 Specification for fixed resistors for use in electronic equipment Blank detail specification Fixed power resistors heat-sink types Assessment level H《电子设备用固定电阻器规范 空白详细规范 固定功率.pdf

《BS QC 400203-1993 Specification for fixed resistors for use in electronic equipment Blank detail specification Fixed power resistors heat-sink types Assessment level H《电子设备用固定电阻器规范 空白详细规范 固定功率.pdf》由会员分享，可在线阅读，更多相关《BS QC 400203-1993 Specification for fixed resistors for use in electronic equipment Blank detail specification Fixed power resistors heat-sink types Assessment level H《电子设备用固定电阻器规范 空白详细规范 固定功率.pdf（16页珍藏版）》请在麦多课文档分享上搜索。

1、BRITISH STANDARD BSQC 400203: 1993 IEC115-4-3: 1993 Specification for Fixed resistors for use in electronic equipment Blankdetail specification Fixed power resistors, heat-sink types Assessment level HBSQC400203:1993 BSI01-2000 ISBN 0 580 34162 3 National foreword This BritishStandard has been prepa

2、red under the direction of the Electronic Components Standards Policy Committee (ECL/-). It is identical with IECPublication115-4-3(QC400203) “Fixed resistors for use in electronic equipment. Part4 Blank detail specification: Fixed power resistors, heat-sink types. Assessment level H”, published by

3、the International Electrotechnical Commission(IEC). This blank detail specification is one of a series of blank detail specifications for fixed resistor devices to be used with BSQC400000:1990 “Harmonized system of quality assessment for electronic components. Fixed resistors for use in electronic e

4、quipment. Generic specification.” The Technical Committee has reviewed the provisions of IEC Publication410 to which reference is made to the text and has decided that they are acceptable for use in conjunction with this standard. Detail specification. Detail specifications shall comply with the req

5、uirements of this blank detail specification and BSCECC00111: Rule of Procedure11. Specifications Part4:1991 Regulations for CECC detail specifications. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their cor

6、rect application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summary of pages This document comprises a front cover, an inside front cover, pagesi andii, pages1 to10 and a back cover. This standard has been updated (see copyright date) and may have

7、had amendments incorporated. This will be indicated in the amendment table on the inside front cover. Cross-references InternationalStandard Corresponding BritishStandard IEC115-1:1982 (QC400000) BSQC400000:1990 Harmonized system of quality assessment for electronic components. Fixed resistors for u

8、se in electronic equipment: Generic specification (Identical) IEC115-4:1982 (QC400200) BS9940 Harmonized system of quality assessment for electronic components. Fixed resistors for use in electronic equipment. Part02.0:1983: Sectional specification: fixed power resistors (Identical) Amendments issue

9、d since publication Amd. No. Date CommentsBSQC400203:1993 BSI 01-2000 i Contents Page National foreword Inside front cover Introduction 1 Section 1. General data 1.1 Recommended method(s) of mounting 2 1.2 Dimensions, ratings and characteristics 2 1.3 Related documents 4 1.4 Marking 4 1.5 Ordering i

10、nformation 5 1.6 Certified records of released lots 5 1.7 Additional information (not for inspection purposes) 5 1.8 Additional or increased severities or requirements to those specified in the generic and/or sectional specification 5 Section 2. Inspection requirements 2.1 Procedures 5 Figure 1 Heat

11、-sink area derating curve 4 Table IA 2 Table IB 3 Table II 5ii blankBSQC400203:1993 BSI 01-2000 1 Introduction Blank detail specification A blank detail specification is a supplementary document to the Sectional Specification and contains requirements for style, layout and minimum content of detail

12、specifications. Detail specifications not complying with these requirements shall not be considered as being in accordance with IEC specifications nor shall they so be described. In the preparation of detail specifications the content of Subclause1.4 of the Sectional Specification shall be taken int

13、o account. The numbers between brackets on page 2 correspond to the following information which shall be inserted in the position indicated. Identification of the detail specification (1) The “InternationalElectrotechnicalCommission” or the National Standards Organisation under whose authority the d

14、etail specification is drafted. (2) The IEC or National Standards number of the detail specification, date of issue and any further information required by the national system. (3) The number and issue number of the IEC or national Generic Specification. (4) The IEC number of the blank detail specif

15、ication. Identification of the resistor (5) A short description of the type of resistor. (6) Information on typical construction (if applicable). NOTEWhen the resistor is not designed for use in printed board applications, this shall be clearly stated in the detail specification in this position. (7

16、) Outline drawing with main dimensions which are of importance for interchangeability and/or reference to the national or international documents for outlines. Alternatively, this drawing may be given in an appendix to the detail specification. (8) Application or group of applications covered and/or

17、 assessment level. NOTEThe assessment level(s) to be used in a detail specification shall be selected from the sectional specification, Subclause3.3.3. This implies that one blank detail specification may be used in combination with several assessment levels, provided the grouping of the tests does

18、not change. (9) Reference data on the most important properties, to allow comparison between the various resistor types.BSQC400203:1993 2 BSI 01-2000 Section 1. General data 1.1 Recommended method(s) of mounting (to be inserted) (SeeSubclause1.4.2 of IEC Publication115-4). 1.2 Dimensions, ratings an

19、d characteristics Table IA (1) IEC115-4-3-XXX QC400203-XXX (2) ELECTRONIC COMPONENTS OF ASSESSED QUALITY IN ACCORDANCE WITH: IEC115-4-3 QC400203 (4) FIXED POWER RESISTORS (5) (3) Outline drawing: (seeTable I) (.angleprojection) (7) HEAT-SINK RESISTORS (not suitable for mounting on printed boards) (6

20、) (Other shapes are permitted within the dimensions given) Assessment level: H Stability class:. . .% (8) Information on the availability of components qualified to this detail specification is given in the Qualified Products List. (9) Style Maximum element temperature ( C) Rated dissipation with a

21、reference heat-sink (W at25 C) Maximum dissipation at70 C without heat-sink (W) Limiting element voltage (V d.c. or a.c.r.m.s) (V) Isolation voltage (V d.c. or a.c.peak) (V)BSQC400203:1993 BSI 01-2000 3 Table IB Limits for change of resistance: Style Dimensions All dimensions are in millimetres. NOT

22、EThe definitions of maximum element temperature and rated dissipation with a reference heat-sink are given in IEC Publication115-1. Resistance range a . . . to. . . Tolerances on rated resistance . . .% Climatic category / Low air pressure 8,5kPa(85mbar) Stability class . . .% a The preferred values

23、 are those of the E-series of IEC Publication63: Preferred Number Series for Resistors and Capacitors. for long-term tests ( . . .%R+. . .7) for short-term tests ( . . .%R+. . .7) Variation of resistance with k . . .% or temperature !:. . .10 6 / C Temperature rise k. . . C Bump severity . . .m/s 2

24、, . . . bumps or Shock severity 490m/s 2 , 11ms Vibration severity . . . Hz to . . . Hz and0,75mm or98m/s 2 %R R -BSQC400203:1993 4 BSI 01-2000 1.2.1 Derating Resistors covered by this specification are derated according to the following curve: Heat-sink resistors shall be derated linearly from the

25、rated dissipation to zero dissipation at an ambient temperature equal to maximum element temperature (SeeIEC Publication115-1, Subclauses2.2.23, 2.2.24 and4.25.2). When mounted on heat-sinks other than the reference heat-sink, the allowable dissipation may alternatively be calculated from the therma

26、l resistance of the heat-sink used, the maximum element temperature, the thermal resistance of the reference heat-sink, the rated dissipation and the dissipation at70 C without a heat-sink. NOTEVarious parameters have been precisely specified for this component. It should not be assumed that any par

27、ameter not specified will remain unchanged from one component to another. Should for any reason it be necessary for further parameter(s) to be specified, then a new fuller specification should be used. The additional test method(s) shall be fully described, and appropriate limits, AQLs and Inspectio

28、n Levels specified. 1.3 Related documents 1.4 Marking The marking of the components and package shall be in accordance with the requirements of IECPublication115-1, Subclause2.4. NOTEThe details of the marking of the component and package shall be given in full in the detail specification. T a=ambie

29、nt temperature in C P n=rated dissipation Figure 1 Heat-sink area derating curve Generic Specification: IEC Publication115-1(1982): Fixed resistors for Use in Electronic Equipment. Part1: Generic Specification. Amendment No.2 (1987), No.3 (1989) and No.4(1993). Sectional Specification: IEC Publicati

30、on115-4(1982): Part4: Sectional Specification: Fixed Power Resistors.BSQC400203:1993 BSI 01-2000 5 1.5 Ordering information Orders for resistors covered by this specification shall contain, in clear or in coded form, the following minimum information: a) Rated resistance. b) Tolerance on rated resis

31、tance. c) Number and issue number reference of the detail specification and style reference. d) Packaging instructions. 1.6 Certified records of released lots Required/not required. 1.7 Additional information (not for inspection purposes) 1.8 Additional or increased severities or requirements to tho

32、se specified in the generic and/or sectional specification NOTEAdditions or increased requirements should be specified only when essential. Section 2. Inspection requirements 2.1 Procedures 2.1.1 For Qualification Approval the procedure shall be in accordance with the Sectional Specification, IEC Pu

33、blication115-4, Subclause3.2. 2.1.2 For Quality Conformance Inspection the test schedule (Table II) includes sampling, periodicity, severities and requirements. The formation of inspection lots is covered by Subclause3.3.1 of the Sectional Specification. Table II NOTE 1Subclause numbers of tests and

34、 performance requirements refer to the Generic Specification, IEC Publication115-1, except for resistance change requirements, which shall be selected from the Table I and Table II of the sectional specification, as appropriate. NOTE 2Inspection levels and AQLs are selected from IEC Publication410:

35、Sampling Plans and Procedures for Inspection by Attributes. NOTE 3In this table: p =periodicity (in months) n =sample size c =acceptance criterion (permitted number of defectives) D =destructive ND =non-destructive IL =inspection level IEC Publication410 AQL =acceptable quality level NOTE 4The resis

36、tors shall be mounted as in IEC Publication115-1, Subclause4.6.1.3. Subclause number and Test (seeNote1) D or ND Conditions of test (seeNote1) IL AQL Performance requirements (seeNote1) (seeNote2) GROUP A INSPECTION (lot-by-lot) Sub-group A1 ND S-4 1,0% 4.4.1 Visual examination As in4.4.1 Legible ma

37、rking and as specified in1.4 of this specification Sub-group A2 ND S-4 1,0% 4.4.2 4.5 Dimensions (gauging) Resistance A gauge-plate of. . .mm shall be used (if applicable) As specified in Table IB of this specification As in4.5.2 BSQC400203:1993 6 BSI 01-2000Table II Subclause number and Test (seeNo

38、te1) D or ND Conditions of test (seeNote1) IL AQL Performance requirements (seeNote1) (seeNote2) GROUP B INSPECTION (lot-by-lot) Sub-group B1 ND S-3 1,0% 4.7 Voltage proof For mounting seeNote4 No breakdown or flashover Sub-group B2 D 4.17 4.30 4.16 4.13 Solderability Solvent resistance of the marki

39、ng (ifapplicable) Robustness of terminations Overload Without ageing Solder bath method or Soldering iron method Size A Solvent:. . . Solvent temperature:. . . Method1 Rubbing material: cotton wool Recovery:. . . Tensile test Visual examination Resistance Duration:5s Voltage: The applied voltage sha

40、ll be that required to dissipate5times the rated dissipation or, it shall be the isolation voltage (whichever is the less) The resistor shall be mounted on the reference heat-sink Visual examination Resistance S-3 4,0% Good tinning as evidenced by free flowing of the solder with wetting of the termi

41、nations or solder shall flow within . . .s, asapplicable Legible marking No visible damage %Rk (. . . %R+. . .7) No visible damage Legible marking %Rk (. . . %R+. . .7) Sub-group B3 ND S-3 2,5% 4.8.4.2 Temperature coefficient of resistance This test is applicable only when a temperature coefficient

42、of resistance of less than5010 6 / C is claimed One cycle of20 C to70 C to20 C only !: . . .10 6 / CBSQC400203:1993 BSI 01-2000 7Table II Subclause number and Test (seeNote1) D or ND Conditions of test (seeNote1) Sample size&criterion of acceptability (seeNote3) Performance requirements (seeNote1) p

43、 n c GROUP C INSPECTION (periodic) Sub-groupC1A D 3 10 Half of the sample of Sub-groupC1 4.16 4.18 Robustness of terminations Resistance to soldering heat Tensile, bending and torsion tests as applicable Visual examination Resistance Method1B Visual examination Resistance No visible damage %Rk (. .

44、. %R+. . .7) No visible damage Legible marking %Rk (. . . %R+. . .7) 4.29 Component solvent resistance (ifapplicable) Solvent:. . . Solvent temperature:. . . Method2 Recovery:. . . Seedetail specification Sub-group C1B D 3 10 Other half of the sample of Sub-groupC1 4.19 4.20 4.21 Rapid change of tem

45、perature Bump (or shock, see4.21) Shock (or bump, see4.20) F A=Lower category temperature F B=Upper category temperature Visual examination Resistance Method of mounting: see1.1 of this specification Acceleration:. . .m/s 2 Number of bumps:. . . Visual examination Resistance Method of mounting: see1

46、.1 of this specification Acceleration:490m/s 2 Duration of pulse: 11ms Pulse shape: half-sine Visual examination Resistance No visible damage %Rk (. . . %R+. . .7) No visible damage %Rk (. . . %R+. . .7) No visible damage %Rk (. . . %R+. . .7)BSQC400203:1993 8 BSI 01-2000Table II Subclause number an

47、d Test (seeNote1) D or ND Conditions of test (seeNote1) Sample size&criterion of acceptability (seeNote3) Performance requirements (seeNote1) p n c 4.22 Vibration Method of mounting: see1.1 of this specification ProcedureB4 Frequency range: . . .Hz to . . .Hz (see2.3.2 of the sectional specification

48、) Amplitude:0,75mm or98m/s 2(whichever is theless severe) Total duration:6h Visual examination Resistance No visible damage %Rk (. . . %R+. . .7) Sub-group C1 D 3 20 1 Combined sample of specimens of Sub-groupsC1A andC1B 4.23 Climatic sequence Dry heat Damp heat, cyclic, TestDb, first cycle Cold Low

49、 air pressure Damp heat, cyclic, TestDb, remaining cycles D.C. load (for non-wirewound types only) 8,5kPa(85mbar) Visual examination Resistance Insulation resistance (seeNote4) Voltage proof (seeNote4) No visible damage Legible marking %Rk (. . . %R+. . .7) RU 100M7 No breakdown or flashoverBSQC400203:1993 BSI 01-2000 9Table II Subclause number and Test (seeNote1) D or ND Conditions of test (seeNote1) Sample size&criterion of acceptability (seeNote3) Performance requirements (seeNote1) p n c Su