IEC 60917-1-1998 Modular order for the development of mechanical structures for electronic equipment practices - Part 1 Generic standard《电子设备用机械结构设计模型化规则 第1部分 通.pdf

《IEC 60917-1-1998 Modular order for the development of mechanical structures for electronic equipment practices - Part 1 Generic standard《电子设备用机械结构设计模型化规则 第1部分 通.pdf》由会员分享，可在线阅读，更多相关《IEC 60917-1-1998 Modular order for the development of mechanical structures for electronic equipment practices - Part 1 Generic standard《电子设备用机械结构设计模型化规则 第1部分 通.pdf（54页珍藏版）》请在麦多课文档分享上搜索。

1、STD.IEC bOSL7-1-ENGL 1998 M 4B4489L 0732124 9519 NORME INTERNATIONALE INTERNATIONAL STAN DA R D CE1 IEC 6091 7-1 1998 AMENDEMENT 1 AMENDMENT 1 2000-05 Amendement 1 Ordre modulaire pour le dveloppement des structures mcaniques pour les infrastructures lectroniques - Partie 1 : Norme gnrique Amendment

2、 1 Modular order for the development of mechanical structures for electronic equipment practices - Part 1 : Generic standard O IEC 2000 Droits de reproduction rservs - Copyright - all rights reserved International Electrotechnical Commission Telefax: +41 22 919 0300 3, rue de Varemb Geneva, Switzerl

3、and IEC web site http:/www.iec.ch e-mail: inmailOiec.ch D CODE PRIX PRICE CODE Pour pflx, voir catalogue en vgueur Commission Electrotechnique Internationale International Electrotechnical Commission MemnvHapontiau BTPOTXHHCHR HOMMCCMR e Forprice. see current catalogue Copyright International Electr

4、otechnical Commission Provided by IHS under license with IECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-2- 60917-1 amend. 1 O CEI:2000 AVANT-PROPOS Le prsent amendement a t tabli par le sous-comit 48D: Structures mcaniques pour quipement lectronique, du comit d

5、tudes 48 de la CEI: Composants lectromcaniques et structures mcaniques pour quipements lectroniques. Le texte de cet amendement est issu des documents suivants: I FDIS I Rapport devote I I 48D1232/RV D 1 48D/222/FDIS I Le rapport de vote indiqu dans le tableau ci-dessus donne toute information sur l

6、e vote ayant abouti lapprobation de cet amendement. Page 10 3 Termes, terminologie et dfinitions Ajouter les nouvelles dfinitions suivantes: Cadre de cadre de montage gnralement un cadre constitu de profils et destin au montage dappareils lectroniques/ lectriques. II peut tre fixe ou mobile lintrieu

7、r dune baie Figure 17 panneau de montage panneau destin au montage dappareils lectroniques/lectriques et plac lintrieur de, par exemple, une baie montage Appareils lectroniques/ lectriques IEC 533/2000 Panneau de montage Appareils lectron i q uesl lectriques IEC 534/2000 Figure 18 Copyright Internat

8、ional Electrotechnical Commission Provided by IHS under license with IECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STDDIEC bOS17-L-ENGL 1798 m 4844871 073212b 720 m FDIS 48012221FDIS 60917-1 Amend. 1 O IEC:2000. -3- Report on voting 48D1232lRVD FOREWORD This a

9、mendment has been prepared by subcommittee 48D: Mechanical structures for electronic equipment, of IEC technical committee 48: Electromechanical components and mechanical structures for electronic equipment. The text of this amendment is based on the following documents: Full information on the voti

10、ng for the approval of this amendment can be found in the report on voting indicated in the above table. Page 11 3 Terms, terminology and definitions Add the following new definitions: Mounting mounting frame in general a frame design of profiles for the mount i ng of elect ron ic/e lect rical devic

11、es. Fixed or movable location within cabinets Figure 17 - frame Electronic/ electrical devices IEC 533/2000 r mounting plate plate for the mounting of electronic/electricaI devices, located within e.g. cabinets IEC 534/2000 Figure 18 Copyright International Electrotechnical Commission Provided by IH

12、S under license with IECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STD-IEC b0917-1-ENGL 1778 4844893 0732127 bL7 -4- . 60917-1 amend. 1 O CEI:2000 panneau frontal panneau destin tre fix la zone de montage vertical des btis et des baies frontal DPanneau IEC 535

13、/2000 Figure 19 fond de panier plaque destine la fixation de connecteurs et de circuits imprims pour leur interconnexion lectrique IEC 536/2000 Figure 20 panneau dhabillage de baie pice externe dune baie, destine en protger lintrieur contre les contacts accidentels et les effets de lenvironnement Fi

14、gure 21 porte panneau dhabillage de baie, mont sur charnires et comprenant typiquement un dispositif de fermeture et/ou de condamnation. Baie Panneau dhabillage de baie IEC 537/2000 Baie Porte IEC 538/2000 Figure 22 Copyright International Electrotechnical Commission Provided by IHS under license wi

15、th IECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STD.IEC bOS37-3-ENGL 1998 4844893 0732328 573 60917-1 Amend. 1 O IEC:2000 -5- front panel in general allocated to the vertical mounting area of racks and cabinets backplane mounting plane of connectors and print

16、ed board for the electrical interconnection Front panel IEC 535/2000 Figure 19 Figure 20 cabinet panel design part of a cabinet as protection against incident touch and environmental influences Figure 21 door hinged cabinet panel, typically incorporating latching and/or locking devices Backplane / I

17、EC 536/2000 IEC 537/2000 IEC 538/2000 Figure 22 Copyright International Electrotechnical Commission Provided by IHS under license with IECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STD*IEC bOS37-3-ENGL 3998 H q84VSL 0732327 43T M -6- 60917-1 amend. 1 O CEI:200

18、0 zone de montage compartiment dune enveloppe destin au montage de pices intrieures Enveloppe Zone de montage Figure 23 Pa* distance entre deux divisions dun espace modulaire une dimension Figure 24 grille disposition orthogonale dans un plan de deux ensembles de lignes paralleles rgulirement espace

19、s O O IllilllL 4 + IEC 541/2000 IEC 539/2000 IEC 540/2000 Figure 25 Copyright International Electrotechnical Commission Provided by IHS under license with IECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-60917-1 Amend. 1 O IEC:2000 mounting section compartment of

20、 an enclosure for the assembly of interior parts pitch one division step of a regular subdivided coordinate grid right angular arrangement of theoretical lines of equal dimensions -7- Figure 23 Enclosure Mounting section A O ML IEC 540/2000 Figure 24 4 IEC 539/2000 a- IEC 541/2000 Figure 25 Copyrigh

21、t International Electrotechnical Commission Provided by IHS under license with IECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STD-IEC b0917-4-ENGL 1998 q8V4891, 0732131 098 M ISBN 2-831 8-5228-5 ICs 31.240 Typeset and printed by the IEC Central Office GENEVA, S

22、WITZERLAND Copyright International Electrotechnical Commission Provided by IHS under license with IECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STD-IEC b0917-1-ENGL L778 q899891 Ob855h7 29D = NORME CE1 INTERNATIONALE I NTE RNATI ON AL STAN DARD IEC 6091 711 Pr

23、emire dition First edit ion 1998-09 Ordre modulaire pour le dveloppement des structures mcaniques pour les infrastructures lectroniques - Partie 1: Norme gnrique Modular order for the development of mechanical structures for electronic equipment practices - Part 1 : Generic standard Numro de rfrence

24、 Reference number CEI/IEC 60917-1:1998 Copyright International Electrotechnical Commission Provided by IHS under license with IECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-Numros des publications Depuis le ler janvier 1997, les publications de la CE1 sont numr

25、otes partir de 60000. Publications consolides Les versions consolides de certaines publications de la CE1 incorporant les amendements sont disponibles. Par exemple, les numros ddition 1.0, 1.1 et 1.2 indiquent respectivement la publication de base, la publication de base incorporant lamendement 1, e

26、t la publication de base incorporant les amendements 1 et 2. Validit de la prsente publication Le contenu technique des publications de la CE1 est constamment revu par la CE1 afin quil reflte ltat actuel de la technique. Des renseignements relatifs la date de re- confirmation de la publication sont

27、disponibles dans le Catalogue de la CEI. Les renseignements relatifs des questions ltude et des travaux en cours entrepris par le comit technique qui a tabli cette publication, ainsi que la liste des publications tablies, se trouvent dans les documents ci-dessous: *Site web de ia CEI Catalogue des p

28、ublications de la CE1 Publi annuellement et mis jour rgulierement (Catalogue en ligne) Disponible la fois au 4te web. de la CEI et comme priodique imprim Bulletin de ia CE1 Terminologie, symboles graphiques et littraux En ce qui concerne la terminologie gnrale, le lecteur se reportera la CE1 60050:

29、Vocabulaire Electro- technique International (VEI). Pour les symboles graphiques, les symboles littraux et les signes dusage gnral approuvs par la CEI, le lecteur consultera la CE1 60027: Symboles littraux a utiliser en lectrotechnique. la CE1 6041 7: Symboles graphiques utilisables sur le matriel.

30、Index, relev et compilation des feuilles individuelles, et la CE1 60 617: Symboles graphiques pour schmas. * Voir adresse *site web. sur la page de titre. Numbering As from 1 January 1997 all IEC publications are issued with a designation in the 60000 series. Consolidated publications Consolidated v

31、ersions of some IEC publications including amendments are available. For example, edition numbers 1 .O, 1.1 and 1.2 refer, respectively, to the base publication, the base publication incor- porating amendment 1 and the base publication incorporating amendments 1 and 2. Validity of this publication T

32、he technical content of IEC publications is kept under constant review by the IEC, thus ensuring that the content reflects current technology. Information relating to the date of the reconfirmation of the publication is available in the IEC catalogue. Information on the subjects under consideration

33、and work in progress undertaken by the technical com- mittee which has prepared this publication, as well as the list of publications issued, is to be found at the following I EC sources: IEC web site* Catalogue of IEC publications Published yearly with regular updates (On-line catalogue)* Available

34、 both at the IEC web site* and as a printed periodical IEC Bulletin Terminology, graphical and letter symbols For general terminology, readers are referred to IEC 60 050: International Elecfrotechnical Vocabulary (IEV). For graphical symbols, and letter symbols and signs approved by the IEC for gene

35、ral use, readers are referred to publications IEC 60027: Letter symbols to be used in electrical technology, IEC 60417: Graphical symbols for use on equipment. Index, survey and compilation of the single sheets and IEC 60617: Graphical symbols for diagrams. * See web site address on title page. Copy

36、right International Electrotechnical Commission Provided by IHS under license with IECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-NORME I NTE RNATI ON ALE I NTE RNATI ON AL STANDARD CE1 IEC 6091 7-1 Premire dition First edition 1998-09 Ordre modulaire pour le d

37、veloppement des structures mcaniques pour les infrastructures lectroniques - Partie 1: Norme gnrique Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard O IEC 1998 Droits de reproduction rservs - Copyright - all rights reserved Auc

38、une partie de cette publication ne peut tre reproduite ni No part of this publication may be reproduced or utilized in utilise sous quelque forme que ce soit et par aucun any form or by any means, electronic or mechanical, procd, lectronique ou mcanique, y compris la photo- including photocopying an

39、d microfilm, without permission in copie et les microfilms. sans laccord crit de lditeur. writing from the publisher. International Electrotechnical Commission Telefax: 41 22 919 0300 3, rue de Varemb Geneva, Switzerland IEC web site http: /www.iec.ch e-mail: inmail iec.ch R CODE PRIX PRICE CODE Pou

40、r prix, voir catalogue en vigueur For price, see currenf cafalogue Commission Electrotechnique Internationale International Electrotechnical Commission MemnyHapomaR 3neirrpoex.iecnan KDMHCCHR e Copyright International Electrotechnical Commission Provided by IHS under license with IECNot for ResaleNo

41、 reproduction or networking permitted without license from IHS-,-,-2- SOMMAIRE 6091 7-1 O CEI:1998 AVANT-PROPOS INTRODUCTION Articles 1 Domaine dapplication et objet . 2 Rfrences normatives 3 Termes. terminologie et dfinitions . 4 Principes fondamentaux et information de base 4.1 4.2 Coordination di

42、mensionnelle avec des domaines voisins . 4.3 Elaboration de normes pour de nouvelles infrastructures . Dtails de lordre modulaire 5.1 Grille modulaire 5.2 Pas . 5.3 Dimensions de coordination 5.4 Illustration de lordre modulaire . Structures pour les infrastructures . 5 Pages 4 6 8 8 10 26 26 26 30

43、32 32 34 36 38 Copyright International Electrotechnical Commission Provided by IHS under license with IECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-60917-1 O IEC:1998 -3- CONTENTS Page FOREWORD . 5 INTRODUCTION . 7 Clause 1 Scope and object 9 2 Normative refer

44、ences . 9 3 Terms. terminology and definitions . 11 4 Fundamentals and background information . 27 4.1 Structures of electronic equipment practices 27 4.2 4.3 Modular order details 33 5.1 Modular grid 33 5.2 Pitches 35 5.3 Co-ordination dimensions 37 5.4 Illustration of the modular order . 39 Dimens

45、ional Co-ordination with adjacent technical fields 27 Preparation of standards for new equipment practices . 31 5 Copyright International Electrotechnical Commission Provided by IHS under license with IECNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STD-IEC bDSL7

46、-L-ENGL 1998 = q84489k Ob85572 b58 W -4- 60917-1 O CEI:1998 COMMISSION LECTROTECHNIQUE INTERNATIONALE ORDRE MODULAIRE POUR LE DVELOPPEMENT DES STRUCTURES MCANIQUES POUR LES INFRASTRUCTURES LECTRONIQUES - Partie 1 : Norme gnrique AVANT-PROPOS 1) La CE1 (Commission Electrotechnique Internationale) est

47、 une organisation mondiale de normalisation compose de lensemble des comits lectrotechniques nationaux (Comits nationaux de la CEI). La CE1 a pour objet de favoriser la coopration internationale pour toutes les questions de normalisation dans les domaines de llectricit et de llectronique. A cet effe

48、t, la CEI, entre autres activits, publie des Normes internationales. Leur laboration est confie des comits dtudes, aux travaux desquels tout Comit national intress par le sujet trait peut participer. Les organisations internationales, gouvernementales et non gouvernementales, en liaison avec la CEI, participent galement aux travaux. La CE1 collabore troitement avec lOrganisation Internationale de N