IEC TS 62647-1-2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1 Preparation for a lead-free .pdf

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1、 IEC/TS 62647-1 Edition 1.0 2012-08 TECHNICAL SPECIFICATION Process management for avionics Aerospace and defence electronic systems containing lead-free solder Part 1: Preparation for a lead-free control plan IEC/TS 62647-1:2012(E) colour inside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 201

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9、0 2012-08 TECHNICAL SPECIFICATION Process management for avionics Aerospace and defence electronic systems containing lead-free solder Part 1: Preparation for a lead-free control plan INTERNATIONAL ELECTROTECHNICAL COMMISSION V ICS 03.100.50; 31.020; 49.060 PRICE CODE ISBN 978-2-83220-298-2 Register

10、ed trademark of the International Electrotechnical Commission Warning! Make sure that you obtained this publication from an authorized distributor. colour inside 2 TS 62647-1 IEC:2012(E) CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope . 7 2 Normative references . 7 3 Terms and definitions . 8 4 Symbo

11、ls and abbreviated terms 11 5 Objectives 11 5.1 General . 11 5.2 Reliability 12 5.3 Configuration control and product identification . 12 5.4 COTS assemblies and sub-assemblies 12 5.5 Deleterious effects of tin whiskers . 12 5.6 Repair, rework, maintenance, and support. 12 6 Technical requirements 1

12、2 6.1 General . 12 6.2 Reliability 12 6.2.1 General . 12 6.2.2 Test and analysis methods 13 6.2.3 Environmental and operating conditions 13 6.2.4 Data 13 6.2.5 Conversion of results from available data to applicable conditions . 14 6.3 Configuration control and product identification . 14 6.3.1 Gene

13、ral . 14 6.3.2 Termination materials and finishes 14 6.3.3 Solder alloys used in the assembly process . 15 6.3.4 Wiring and connector assemblies 15 6.3.5 Changes in solder alloys 15 6.3.6 Identification 16 6.3.7 Part number changes 16 6.4 COTS assemblies and sub-assemblies 16 6.4.1 General . 16 6.4.

14、2 COTS assembly and sub-assembly configuration control and product identification 16 6.5 Deleterious effects of tin whiskers . 16 6.6 Repair, rework, maintenance, and support. 16 7 Plan administrative requirements 17 7.1 Plan organization 17 7.2 Terms and definitions 17 7.3 Plan point of contact 17

15、7.4 References 17 7.5 Requirements for suppliers and sub-contractors 17 7.6 Plan acceptance 17 7.7 Plan modifications . 17 Annex A (informative) Template for tailoring requirements of IEC/TS 62647-1 . 18 TS 62647-1 IEC:2012(E) 3 Annex B (informative) Requirements matrix for IEC/TS 62647-1 19 Annex C

16、 (informative) Guidance on configuration control and product identification 23 Bibliography 31 Figure C.1 Decision flow chart . 25 Figure C.2 Manufacturing, maintenance and reliability considerations 28 Figure C.3 Tin whisker considerations . 29 Table A.1 Template for tailoring requirements 18 Table

17、 B.1 Requirement matrix 19 4 TS 62647-1 IEC:2012(E) INTERNATIONAL ELECTROTECHNICAL COMMISSION _ PROCESS MANAGEMENT FOR AVIONICS AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER Part 1: Preparation for a lead-free control plan FOREWORD 1) The International Electrotechnical Commiss

18、ion (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in

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26、mbers of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication

27、 or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication

28、 may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. The main task of IEC technical committees is to prepare International Standards. In exceptional circumstances, a technical committee may propose the publication of a technical speci

29、fication when the required support cannot be obtained for the publication of an International Standard, despite repeated efforts, or the subject is still under technical development or where, for any other reason, there is the future but no immediate possibility of an agreement on an International S

30、tandard. Technical specifications are subject to review within three years of publication to decide whether they can be transformed into International Standards. IEC/TS 62647-1, which is a technical specification, has been prepared by IEC technical committee 107: Process management for avionics. TS

31、62647-1 IEC:2012(E) 5 This technical specification cancels and replaces IEC/PAS 62647-1 published in 2011. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect to: a) the addition of requirements for the use of Pb-free solder a

32、lloys, b) the addition of requirements for the use of COTS, c) the update of Annex B. The text of this technical specification is originally based on the following document: GEIA-STD-0005-1 Revision A. The text of this technical specification is based on the following documents: Enquiry draft Report

33、 on voting 107/159/DTS 107/180/RVC Full information on the voting for the approval of this technical specification can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all the parts in the IE

34、C/TS 62647 series, published under the general title Process management for avionics, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the dat

35、a related to the specific publication. At this date, the publication will be transformed into an International standard, reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual version of this publication may be issued at a later date. IMPORTANT The colour inside logo on the c

36、over page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. 6 TS 62647-1 IEC:2012(E) INTRODUCTION The European Union (EU) enacted two directives; 2

37、002/95/EC Restriction of Hazardous Substances (RoHS) and 2002/96/EC Waste Electrical and Electronic Equipment (WEEE) that restrict or eliminate the use of various substances in a variety of products that are put on the market after July 2006. Other countries have also enacted similar legislation. On

38、e of the key materials restricted is lead (Pb), which is widely used in electronic solder and electronic piece part terminations. These regional regulations affect the global market place. However, due to the reduced market share of the Aerospace, Defence and High Performance (ADHP) industries, many

39、 of the lower tier suppliers to those industries will change their products to serve their primary, non-ADHP markets. Additionally, several United States (US) states have enacted similar “green” laws and many Asian electronics manufacturers have recently announced completely green product lines. Sin

40、ce ADHP is one of the few major industrial sectors that still repair circuit card assemblies (CCAs) and the Pb-free materials and processes are relatively immature and not fully understood, an aerospace-wide approach to their application is desired. The products of ADHP companies developing and/or m

41、anaging Pb-free electronics fall into one of the five categories below. 1) Products that have been designed and qualified with traditional tin-lead (SnPb) electronic piece parts, materials, and assembly processes, and that will need to be maintained in the SnPb configuration. 2) Products that have b

42、een designed and qualified with traditional SnPb electronic piece parts, materials and assembly processes, and that have incorporated Pb-free electronic piece parts. 3) Products that have been designed and qualified with SnPb materials, and are re- designed and re-qualified with Pb-free materials. 4

43、) Products that have been designed and qualified with Pb-free electronic piece parts, materials, and assembly processes, and that will need to be maintained in the Pb-free configuration. 5) Commercial-off-the-shelf (COTS) assemblies built with Pb-free materials. The risks with Pb-free technology inc

44、lude: 1) for some service conditions, use of Pb-free solder may compromise electronic interconnection performance due to potential differences in fatigue characteristics under thermal cycling and vibration relative to traditional solders; 2) the use of Pb-free surface finishes such as pure tin can l

45、ead to the formation of tin whiskers which in turn can result in various levels of product and system failure; and 3) the use of lead-free technology can result in higher processing temperatures associated with lead-free solders. TS 62647-1 IEC:2012(E) 7 PROCESS MANAGEMENT FOR AVIONICS AEROSPACE AND

46、 DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER Part 1: Preparation for a lead-free control plan 1 Scope This part of the IEC/TS 62647 series defines the objectives of, and requirements for, documenting processes that assure customers and regulatory agencies that ADHP electronic systems cont

47、aining Pb-free solder, piece parts, and PWBs will satisfy the applicable requirements for performance, reliability, airworthiness, safety, and certifiability throughout the specified life of performance. This specification aims to communicate requirements for a lead-free control plan (LFCP), hereina

48、fter referred to as the Plan, and to assist the Plan owners in the development of their own Plans. The Plan documents the Plan owners processes to assure their customers and all other stakeholders that the Plan owners products will continue to meet their requirements, given the risks stated in the I

49、ntroduction. This specification does not contain detailed descriptions of the processes to be documented but lists high-level requirements for such processes, and areas of concern to the ADHP industries that need to be addressed by the processes. Pb-free risk management should be accomplished through specific requirements added to the Plan owners existing infrastructure of product management and control. This specification applies to the ADHP electronics system supply chain. The control