IEC 61189-2-2006 Test methods for electrical materials interconnection structures and assemblies - Part 2 Test methods for materials for interconnection structu.pdf

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1、 INTERNATIONAL STANDARD IEC 61189-2Second edition 2006-05Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2: Test methods for materials for interconnection structures Reference number IEC 61189-2:2006(E) Publication numbering As from 1 Ja

2、nuary 1997 all IEC publications are issued with a designation in the 60000 series. For example, IEC 34-1 is now referred to as IEC 60034-1. Consolidated editions The IEC is now publishing consolidated versions of its publications. For example, edition numbers 1.0, 1.1 and 1.2 refer, respectively, to

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8、 22 919 03 00 INTERNATIONAL STANDARD IEC 61189-2Second edition 2006-05Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2: Test methods for materials for interconnection structures IEC 2006 Copyright - all rights reserved No part of this p

9、ublication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from the publisher. International Electrotechnical Commission, 3, rue de Varemb, PO Box 131, CH-1211 Geneva 20, Switzerland Telephone: +

10、41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmailiec.ch Web: www.iec.ch XF For price, see current catalogue PRICE CODE Commission Electrotechnique Internationale International Electrotechnical Commission 2 61189-2 IEC:2006(E) CONTENTS FOREWORD.6 INTRODUCTION.8 1 Scope.9 2 Normative references

11、9 3 Accuracy, precision and resolution9 3.1 Accuracy .10 3.2 Precision .10 3.3 Resolution .11 3.4 Report .11 3.5 Students “t“ distribution.11 3.6 Suggested uncertainty limits 12 4 Catalogue of approved test methods .13 5 P: Preparation/conditioning test methods 13 5.1 Test 2P01: Dry heat (under cons

12、ideration) .13 5.2 Test 2P02: Solder float stress (under consideration) 13 6 V: Visual test methods 13 7 D: Dimensional test methods 13 7.1 Test 2D01: Thickness of base materials and rigid boards.13 8 C: Chemical test methods .15 8.1 Test 2C01: Resistance to sodium hydroxide of base materials15 8.2

13、Test 2C02: Gel time of epoxy based prepreg materials.16 8.3 Test 2C03: Resin content of prepreg materials by treated weight17 8.4 Test 2C04: Volatile content of prepreg materials 19 8.5 Test 2C05: Blistering during heat shock .21 8.6 Test 2C06: Flammability, vertical burning test for rigid materials

14、 23 8.7 Test 2C07: Flammability; horizontal burning test for rigid materials.26 8.8 Test 2C08: Flammability, flex material .29 8.9 Test 2C09: Melting viscosity of prepreg materials.33 8.10 Test 2C10: Resin content of prepreg materials by sublimation35 8.11 Test 2C11: UV blocking characteristics of l

15、aminates 37 8.12 Test 2C12: Total halogen content in base materials .38 9 M: Mechanical test methods42 9.1 Test 2M01: Test method for bow and twist .42 9.2 Test 2M02: Bow/twist after etching and heating43 9.3 Test 2M03: Cure factor of base materials by differential scanning calorimetry (DSC) or ther

16、momechanical analysis (TMA).45 9.4 Test 2M04: Twist after heating (under consideration) .46 9.5 Test 2M05: Pull-off strength.46 9.6 Test 2M06: Peel strength after exposure to solvent vapour.48 9.7 Test 2M07: Peel strength after immersion in solvent 50 9.8 Test 2M08: Flexural strength (under consider

17、ation)51 9.9 Test 2M09: Resin flow of prepreg material .51 9.10 Test 2M10: Glass transition temperature of base materials by differential scanning calorimetry (DSC) .53 61189-2 IEC:2006(E) 3 9.11 Test 2M11: Glass transition temperature of base materials by thermomechanical analysis (TMA) .55 9.12 Te

18、st 2M12: Surface waviness 58 9.13 Test 2M13: Peel strength as received 59 9.14 Test 2M14: Peel strength after heat shock .60 9.15 Test 2M15: Peel strength after dry heat63 9.16 Test 2M16: Peel strength after simulated plating64 9.17 Test 2M17: Peel strength at high temperature66 9.18 Test 2M18: Surf

19、ace quality (under consideration).68 9.19 Test 2M19: Punching (under consideration) .68 9.20 Test 2M20: Flexural strength .68 9.21 Test 2M21: Rolling fatigue of flexible base materials 69 9.22 Test 2M22: Weight of foil after lamination 71 9.23 Test method 2M23: Rectangularity of cut panels 73 9.24 T

20、est 2M24: Coefficient of thermal expansion (under consideration) 74 9.25 Test 2M25: Time to delamination by thermomechanical analysis (TMA)74 9.26 Test 2M26: Scaled flow test for prepreg materials 75 9.27 Test 2M27: The resin flow properties of coverlay films, bonding films and adhesive cast films u

21、sed in the fabrication of flexible printed boards 78 10 Electrical test methods83 10.1 Test 2E01: Surface tracking, moisture condition (under consideration) .83 10.2 Test 10.2 2E02: Dielectric breakdown of base materials parallel to laminations83 10.3 Test 2E03: Surface resistance after damp heat, s

22、teady state .85 10.4 Test 2E04: Volume resistivity and surface resistivity.90 10.5 Test 2E05: Permittivity and dielectric dissipation (under consideration).94 10.6 Test 2E06: Volume and surface resistivity, 3 electrodes (under consideration)94 10.7 Test 2E07: Surface and volume resistivity, elevated

23、 temperature (under consideration)94 10.8 Test 2E08: Surface corrosion.94 10.9 Test 2E09: Comparative tracking index (CTI) .96 10.10 Test 2E10: Permittivity and dissipation factor (under consideration)100 10.11 Test 2E11: Electric strength (under consideration) .100 10.12 Test 2E12: Resistance of fo

24、il (under consideration)100 10.13 Test 2E13: Corrosion at edge (under consideration).100 10.14 Test 2E14: Arc resistance100 10.15 Test 2E15: Dielectric break-down (under consideration) .104 10.16 Test 2E16: Contact resistance of printed circuit keypad cont (under consideration)104 10.17 Test 2E17: I

25、nsulation resistance of printed board materials104 10.18 Test 2E18: Fungus resistance of printed board materials .105 11 N: Environmental test methods .109 11.1 Test 2N01: Pressure cooker test (under consideration) 109 11.2 Test 2N02: Water absorption .109 12 X: Miscellaneous test methods110 12.1 Te

26、st 2X02: Dimensional stability of thin laminates 110 4 61189-2 IEC:2006(E) Annex A (informative) Worked examples 114 Annex B (informative) Conversion table116 Annex C (informative) Laboratory pro forma (form).121 Annex D (informative) Laboratory pro forma .122 Figure 1 Thickness measuring points14 F

27、igure 2 Position of specimens.20 Figure 3 Fluidized sand bath.22 Figure 4 Test fixture.28 Figure 5 V method (Vertical flammability method) .32 Figure 6 VTM method (vertical flammability method for recaltrant specimens).32 Figure 7 Example of prepreg melting viscosity 35 Figure 8 Position of specimen

28、s for resin content.36 Figure 9 Absorption of combustion gas using a combustion flask set-up40 Figure 10 Composition of ion exchange chromatograph 40 Figure 11 Specimen for peel strength measurement .49 Figure 12 Differential scanning calorimetry .54 Figure 13 Thermomechanical analysis (expansion mo

29、de) .57 Figure 14 Test specimen pattern 70 Figure 15 General arrangement of apparatus70 Figure 16 Scaled flow test specimen before lamination .77 Figure 17 Scaled flow test specimen measurement points 77 Figure 18 Test patterns for clearance filling test79 Figure 19 Punched test pattern for squeeze-

30、out test .80 Figure 20 Standard lay-up of materials in the press to prepare the test specimens for referee tests .81 Figure 21 Profiles of press conditions to prepare the test specimens for referee tests .82 Figure 22 Measurement of volume resistance.89 Figure 23 Measurement of surface resistance.89

31、 Figure 25 Electrode connections for measuring volume resistance93 Figure 26 Electrode connections for measuring surface resistance .93 Figure 27 Ring and disk pattern95 Figure 28 Comb pattern96 Figure 31 Example of test apparatus 98 Figure 32 Example of test circuit 98 Figure 33 Arc-resistance test

32、 circuit101 Figure 34 Tungsten steel rod electrode assembly .102 Figure 35 Test specimen for insulation resistance.104 Figure 36 Location of specimens on original sheet for dimensional stability test 111 Figure 37 Location of marks on specimen for dimensional stability112 61189-2 IEC:2006(E) 5 Table

33、 1 Students “t“ distribution.12 Table 2 Example of analysing conditions for the ion exchange chromatography 41 Table 3 Specimen dimensions68 Table 4 Number of plies per specimen as a function of glass thickness.76 Table 6 Specimen dimension (cm)86 Table 7 Test pattern dimensions.91 Table 8 Arc resis

34、tance103 6 61189-2 IEC:2006(E) INTERNATIONAL ELECTROTECHNICAL COMMISSION _ TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES Part 2: Test methods for materials for interconnection structures FOREWORD 1) The International Electrotechnical Commis

35、sion (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in

36、 addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee in

37、terested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordanc

38、e with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interes

39、ted IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsibl

40、e for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence bet

41、ween any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All us

42、ers should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or ot

43、her damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication.

44、 Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such pate

45、nt rights. International Standard IEC 61189-2 has been prepared by IEC technical committee 91: Surface mounting technology, in cooperation with technical committee 52: Printed circuits (now disbanded), and technical committee 50: Environmental testing. This second edition replaces the first edition,

46、 published in 1997, and its Amendment 1 (2000). It constitutes a technical revision. The document 91/564/FDIS, circulated to the National Committees as Amendment 2, led to the publication of this new edition. 61189-2 IEC:2006(E) 7 The text of this standard is based on the first edition, its amendmen

47、t 1 and on the following documents: FDIS Report on voting 91/564/FDIS 91/572/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. The significant technical changes with respect to the previous edition concern the addi

48、tion of several new tests in the following categories: C: Chemical test methods D: Dimensional test methods: E: Electrical test methods M: Mechanical test methods N: Environmental test methods X: Miscellaneous test methods This publication has been drafted in accordance with the ISO/IEC Directives,

49、Part 2. This standard forms part of a series and should be used in conjunction with other parts in the same series, all under the main title Test methods for electrical materials, interconnection structures and assemblies: Part 1: General test methods and methodology Part 2: Test methods for materials for interconnection structures Part 3: Test methods for interconnection structures