IEC 60749-20-2008 Semiconductor devices - Mechanical and climatic test methods - Part 20 Resistance of plastic-encapsulated SMDs to the combined effect of moist.pdf

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1、 IEC 60749-20Edition 2.0 2008-12INTERNATIONAL STANDARD NORME INTERNATIONALESemiconductor devices Mechanical and climatic test methods Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat Dispositifs semiconducteurs Mthodes dessais mcaniques et climat

2、iques Partie 20: Rsistance des CMS botier plastique leffet combin de lhumidit et de la chaleur de brasage IEC60749-20:2008 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2008 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or

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17、echanical and climatic test methods Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat Dispositifs semiconducteurs Mthodes dessais mcaniques et climatiques Partie 20: Rsistance des CMS botier plastique leffet combin de lhumidit et de la chaleur de

18、brasage INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE UICS 31.080.01 PRICE CODECODE PRIXISBN 2-8318-1019-8 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale 2 60749-20 IEC:2008 CO

19、NTENTS FOREWORD.4 1 Scope.6 2 Normative references6 3 General description.6 4 Test apparatus and materials6 4.1 Humidity chamber6 4.2 Reflow soldering apparatus6 4.3 Holder .7 4.4 Wave-soldering apparatus .7 4.5 Solvent for vapour-phase reflow soldering7 4.6 Flux.7 4.7 Solder .7 5 Procedure.7 5.1 In

20、itial measurements .7 5.1.1 Visual inspection7 5.1.2 Electrical measurement8 5.1.3 Internal inspection by acoustic tomography 8 5.2 Drying8 5.3 Moisture soak8 5.3.1 General .8 5.3.2 Conditions for non-dry-packed SMDs .8 5.3.3 Moisture soak for dry-packed SMDs.8 5.4 Soldering heat .10 5.4.1 General .

21、10 5.4.2 Method of heating by infrared convection or convection reflow soldering11 5.4.3 Method of heating by vapour-phase reflow soldering.12 5.4.4 Method of heating by wave-soldering12 5.5 Recovery.13 5.6 Final measurements 14 5.6.1 Visual inspection14 5.6.2 Electrical measurement14 5.6.3 Internal

22、 inspection by acoustic tomography 14 6 Information to be given in the relevant specification.14 Annex A (informative) Details and descriptions of test method on resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat16 Figure 1 Method of measuring the temperatu

23、re profile of a specimen7 Figure 2 Heating by wave-soldering 13 Figure A.1 Process of moisture diffusion at 85 C, 85 % RH17 Figure A.2 Definition of resin thickness and the first interface .17 Figure A.3 Moisture soak time to saturation at 85 C as a function of resin thickness 18 Figure A.4 Temperat

24、ure dependence of saturated moisture content of resin18 Figure A.5 Dependence of moisture content of resin at the first interface on resin thickness under various soak conditions19 60749-20 IEC:2008 3 Figure A.6 Dependence of moisture content of resin at the first interface on resin thickness relate

25、d to method A of moisture soak.20 Figure A.7 Dependence of the moisture content of resin at the first interface on resin thickness related to method B of moisture soak.21 Figure A.8 Dependence of moisture content of resin at the first interface on resin thickness related to condition B2 of method B

26、of moisture soak .21 Figure A.9 Temperature profile of infrared convection and convection reflow soldering for Sn-Pb eutectic assembly23 Figure A.10 Temperature profile of infrared convection and convection reflow soldering for lead-free assembly23 Figure A.11 Classification profile 25 Figure A.12 T

27、emperature profile of vapour-phase soldering (condition II-A).25 Figure A.13 Immersion method into solder bath 26 Figure A.14 Relation between the infrared convection reflow soldering and wave-soldering.26 Figure A.15 Temperature in the body of the SMD during wave-soldering .27 Table 1 Moisture soak

28、 conditions for non-dry-packed SMDs .8 Table 2 Moisture soak conditions for dry-packed SMDs (method A) 9 Table 3 Moisture soak conditions for dry-packed SMDs (method B) 10 Table 4 SnPb eutectic process Classification reflow temperatures .11 Table 5 Pb-free process Classification reflow temperatures

29、.12 Table 6 Heating condition for vapour-phase soldering.12 Table 7 Immersion conditions for wave-soldering13 Table A.1 Comparison of actual storage conditions and equivalent moisture soak conditions before soldering heat18 Table A.2 Classification profiles24 4 60749-20 IEC:2008 INTERNATIONAL ELECTR

30、OTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization co

31、mprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International St

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38、blication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirec

39、t, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the c

40、orrect application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 60749-20 has been prepar

41、ed by IEC technical committee 47: Semiconductor devices. This second edition cancels and replaces the first edition published in 2002 and constitutes a technical revision. The main changes are as follows: to reconcile certain classifications of IEC 60749-20 and those of IPC/JEDEC J-STD-020C; referen

42、ce IEC 60749-35 instead of Annex A of IEC 60749-20, Edition 1; update for lead-free solder; correct certain errors in the original Edition 1. 60749-20 IEC:2008 5 The text of this standard is based on the following documents: FDIS Report on voting 47/1989/FDIS 47/2003/RVD Full information on the voti

43、ng for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all the parts in the IEC 60749 series, under the general title Semiconductor devices Mechanical and c

44、limatic test methods, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, th

45、e publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. 6 60749-20 IEC:2008 SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat 1 Scope This part of IEC 6074

46、9 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated refe

47、rences, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60068-2-20:2008, Environmental testing Part 2-20: Tests Test T: Test methods for solderability and resistance to soldering heat of devices with leads

48、IEC 60749-3, Semiconductor devices Mechanical and climatic test methods Part 3: External visual inspection IEC 60749-35, Semiconductor devices Mechanical and climatic test methods Part 35: Acoustic microscopy for plastic encapsulated electronic components 3 General description Package cracking and e

49、lectrical failure in plastic encapsulated SMDs can result when soldering heat raises the vapour pressure of moisture which has been absorbed into SMDs during storage. These problems are assessed. In this test method, SMDs are evaluated for heat resistance after being soaked in an environment which simulates moisture bein