IEC 62047-21-2014 Semiconductor devices - Micro-electromechanical devices - Part 21 Test method for Poisson's ratio of thin film MEMS materials《半导体器件 微型机电装置 第21部分 薄膜MEMS材料泊松比试验方法》.pdf

《IEC 62047-21-2014 Semiconductor devices - Micro-electromechanical devices - Part 21 Test method for Poisson's ratio of thin film MEMS materials《半导体器件 微型机电装置 第21部分 薄膜MEMS材料泊松比试验方法》.pdf》由会员分享，可在线阅读，更多相关《IEC 62047-21-2014 Semiconductor devices - Micro-electromechanical devices - Part 21 Test method for Poisson's ratio of thin film MEMS materials《半导体器件 微型机电装置 第21部分 薄膜MEMS材料泊松比试验方法》.pdf（30页珍藏版）》请在麦多课文档分享上搜索。

1、 IEC 62047-21 Edition 1.0 2014-06 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices Micro-electromechanical devices Part 21: Test method for Poissons ratio of thin film MEMS materials Dispositifs semiconducteurs Dispositifs microlectromcaniques Partie 21: Mthode dessai relative au co

2、efficient de Poisson des matriaux MEMS en couche mince IEC 62047-21:2014-06(en-fr) colour inside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2014 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or b

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20、conductor devices Micro-electromechanical devices Part 21: Test method for Poissons ratio of thin film MEMS materials Dispositifs semiconducteurs Dispositifs microlectromcaniques Partie 21: Mthode dessai relative au coefficient de Poisson des matriaux MEMS en couche mince INTERNATIONAL ELECTROTECHNI

21、CAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE M ICS 31.080.99 PRICE CODE CODE PRIX ISBN 978-2-8322-1650-7 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publicat

22、ion from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via un distributeur agr. colour inside 2 IEC 62047-21:2014 IEC 2014 CONTENTS FOREWORD . 3 1 Scope 5 2 Normative references 5 3 Terms, definitions, symbols and designations 5 3.1 Terms and defi

23、nitions 5 3.2 Symbols and designations 5 4 Test piece . 6 4.1 General . 6 4.2 Shape of the test piece . 7 4.3 Measurement of dimensions . 7 5 Testing method and test apparatus 7 5.1 Test principle 7 5.2 Test machine 7 5.3 Test procedure 7 5.3.1 Test procedure for type 1 test piece . 7 5.3.2 Test pro

24、cedure for type 2 test piece . 8 5.4 Test environment 8 6 Test report . 8 Annex A (informative) Measurement example of Poissons ratio using type 1 test piece . 9 A.1 Fabrication of the test piece 9 A.2 Dimensions of the test piece . 9 A.3 Test procedures 9 A.4 Test results . 10 Annex B (informative)

25、 Analysis of test results obtained from a type 2 test piece . 11 B.1 General . 11 B.2 Evaluation of stress and strain in circular and rectangular membranes . 11 B.3 Evaluation of Poissons ratio . 12 Bibliography 13 Figure 1 Two types of test pieces for the measurement of Poissons ratio 6 Figure A.1

26、Optical images of markers for strain measurement by DIC 9 Figure A.2 Graphs of load and strain in the longitudinal and transverse directions . 10 Table 1 Symbols and designations of a test piece 6 IEC 62047-21:2014 IEC 2014 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES MICRO-EL

27、ECTROMECHANICAL DEVICES Part 21: Test method for Poissons ratio of thin film MEMS materials FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC

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37、nsable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 62047-21

38、 has been prepared by subcommittee 47F: Micro- electromechanical systems, of IEC technical committee 47: Semiconductor devices. The text of this standard is based on the following documents: FDIS Report on voting 47F/185/FDIS 47F/189/RVD Full information on the voting for the approval of this standa

39、rd can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. 4 IEC 62047-21:2014 IEC 2014 A list of all parts in the IEC 62047 series, published under the general title Semiconductor devices Micro-electrome

40、chanical devices, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the stability date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication

41、 will be reconfirmed, withdrawn, replaced by a revised edition, or amended. IMPORTANT The colour inside logo on the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this doc

42、ument using a colour printer. IEC 62047-21:2014 IEC 2014 5 SEMICONDUCTOR DEVICES MICRO-ELECTROMECHANICAL DEVICES Part 21: Test method for Poissons ratio of thin film MEMS materials 1 Scope This part of IEC 62047 specifies the determination of Poissons ratio from the test results obtained by the appl

43、ication of uniaxial and biaxial loads to thin-film micro-electromechanical systems (MEMS) materials with lengths and widths less than 10 mm and thicknesses less than 10 m. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispe

44、nsable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 62047-8:2011, Semiconductor devices Micro-electromechanical devices Part 8: Strip bending test method for te

45、nsile property measurement of thin films ASTM E 132-04:2010, Standard test method for Poissons ratio at room temperature 3 Terms, definitions, symbols and designations 3.1 Terms and definitions For the purposes of this document, the following terms and definitions apply. 3.1.1 Poissons ratio ratio o

46、f transverse strain multiplied by (-1) to the corresponding longitudinal strain resulting from uniformly distributed longitudinal stress below the proportional limit of the material, expressed as - t / l , where tis transverse strain, and lis longitudinal strain 3.2 Symbols and designations Symbols

47、and designations of two types of test pieces are presented in Figure 1 and Table 1, respectively. 6 IEC 62047-21:2014 IEC 2014 a) Type 1 test piece for uniaxial tensile machine b) Type 2 test piece for membrane bulging machine Figure 1 Two types of test pieces for the measurement of Poissons ratio T

48、able 1 Symbols and designations of a test piece Symbol Unit Designation l 1m Gauge length for longitudinal strain measurement l 2m Gauge length for transverse strain measurement b m Width of test piece L m Overall length R m Filet radius of test piece m 1m Length of a rectangular membrane m 2m Width

49、 of a rectangular membrane m 3m Diameter of a circular membrane h m Thickness of membrane 4 Test piece 4.1 General The test piece should be prepared using a fabrication process similar to the actual fabrication of devices. It should have dimensions on the same order as those of the mother device to minimise the effect of size-dependent properties. An example of the fab