IEC 61760-2-2007 Surface mounting technology - Part 2 Transportation and storage conditions of surface mounting devices (SMD) - Application guide《表面安装技术.第2部分 表面安装器件(SMD)的运输和存储条件.使用指南》.pdf

《IEC 61760-2-2007 Surface mounting technology - Part 2 Transportation and storage conditions of surface mounting devices (SMD) - Application guide《表面安装技术.第2部分 表面安装器件(SMD)的运输和存储条件.使用指南》.pdf》由会员分享，可在线阅读，更多相关《IEC 61760-2-2007 Surface mounting technology - Part 2 Transportation and storage conditions of surface mounting devices (SMD) - Application guide《表面安装技术.第2部分 表面安装器件(SMD)的运输和存储条件.使用指南》.pdf（12页珍藏版）》请在麦多课文档分享上搜索。

1、 INTERNATIONAL STANDARD IEC 61760-2Second edition 2007-04Surface mounting technology Part 2: Transportation and storage conditions of surface mounting devices (SMD) Application guide Reference number IEC 61760-2:2007(E) THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2007 IEC, Geneva, Switzerland

2、All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or IECs member National Committee in the country of th

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8、1760-2Second edition 2007-04Surface mounting technology Part 2: Transportation and storage conditions of surface mounting devices (SMD) Application guide J For price, see current catalogue PRICE CODE Commission Electrotechnique Internationale International Electrotechnical Commission 2 61760-2 IEC:2

9、007(E) INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SURFACE MOUNTING TECHNOLOGY Part 2: Transportation and storage conditions of surface mounting devices (SMD) Application guide FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising

10、all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards,

11、Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory

12、 work. International, governmental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organization

13、s. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of reco

14、mmendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by a

15、ny end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional pu

16、blication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publicatio

17、n. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or fo

18、r costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct a

19、pplication of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61760-2 has been prepared by IEC

20、 technical committee 91: Electronics assembly technology. This second edition cancels and replaces the first edition, published in 1998, and constitutes a technical revision. The main changes with regard to the previous edition concern: The standard was updated and editorially revised. Specific refe

21、rence is made to: IEC/TS 61340-5-1: Electrostatics Part 5-1: Protection of electronic devices from electrostatic phenomena General requirements IEC/TS 61340-5-2: Electrostatics Part 5-2: Protection of electronic devices from electrostatic phenomena User guide 61760-2 IEC:2007(E) 3 For convenience of

22、 the reader, an informative Annex A was added, which contains information about the climatic and mechanical conditions during transportation and storage (extracted from IEC 60721-3-1 and IEC 60721-3-2). The text of this standard is based on the following documents: CDV Report on voting 91/569/CDV 91

23、/634/RVC Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all the parts in the IEC 61760 series, under the general title S

24、urface mounting technology, can be found on the IEC website. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this da

25、te, the publication will be reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual version of this publication may be issued at a later date. 4 61760-2 IEC:2007(E) SURFACE MOUNTING TECHNOLOGY Part 2: Transportation and storage conditions of surface mounting devices (SMD) Appl

26、ication guide 1 Scope and object This International Standard describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are

27、not taken into consideration.) The object of this standard is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result

28、 in assembly problems such as poor solderability, delamination and ”popcorning”. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the r

29、eferenced document (including any amendments) applies. IEC 60286-3: Packaging of components for automatic handling Part 3: Packaging of leadless components on continuous tapes IEC 60286-4: Packaging of components for automatic handling Part 4: Stick magazines for electronic components encapsulated i

30、n packages of form E and G IEC 60286-5: Packaging of components for automatic handling Part 5: Matrix trays IEC 60286-6: Packaging of components for automatic handling Part 6: Bulk case packaging for surface mounting components IEC 60721-3-1: Classification of environmental conditions Part 3: Classi

31、fication of groups of environmental parameters and their severities Section 1: Storage IEC 60721-3-2: Classification of environmental conditions Part 3: Classification of groups of environmental parameters and their severities Section 2: Transportation IEC 60749 (all parts), Semiconductor devices Me

32、chanical and climatic test methods IEC/TS 61340-5-1: Electrostatics Part 5-1: Protection of electronic devices from electrostatic phenomena General requirements IEC/TS 61340-5-2: Electrostatics Part 5-2: Protection of electronic devices from electrostatic phenomena User guide 61760-2 IEC:2007(E) 5 3

33、 General conditions Surface mounting devices shall be packed in such a way that products are protected during transportation and storage without loss of their properties arising from mechanical, environmental and electrical influences. Packing requirements as defined in various IEC publications, suc

34、h as IEC 60286-3, IEC 60286-4, IEC 60286-5, IEC 60286-6, may contribute to the protection of components during transportation and storage. Usually, transportation conditions are less controlled than storage conditions. Nevertheless, conditions shall be controlled and deviations from the advised cond

35、itions in this standard should be reduced to as little time as possible. 4 Transportation conditions 4.1 General transportation conditions During transportation, the SMDs, including their chosen style of tapes or stick magazines, etc., shall be protected against extreme temperature, humidity and mec

36、hanical forces. Unless otherwise specified by the component supplier, the following environmental conditions shall be met: Climatic condition according to IEC 60721-3-2, class 2K2, except low air temperature: 40 C, change of temperature air/air: 40 C / +30 C, low air pressure: 30 kPa, change of air

37、pressure: 6 kPa/min. Mechanical condition according to IEC 60721-3-2, class 2M1. Transportation shall be managed in such a way that boxes are not deformed and forces are not directly passed on to the inner packaging. Total transportation time shall be as short as possible, but preferably not exceed

38、10 days. (Total transportation time is time when products are not within controlled storage conditions.) 4.2 Specific transportation conditions Depending on the sensitivity of the products to be transported, a choice shall be made between air transport where conditions during flight are well control

39、led, or less controlled conditions, e.g. during rail or road transportation. 4.2.1 Category 1 (advised for all products) Air transport (conditions during flights with conditioned cargo room). Climatic conditions according to IEC 60721-3-2, class 2K1. It should be realised that waiting time and loadi

40、ng operations at the airport are under less controlled conditions. These shall at least fulfil the general transportation conditions stated in 4.1. 6 61760-2 IEC:2007(E) 4.2.2 Category 2 Rail, road, and unconditioned air transportation. Only allowed for products and packaging systems that are not se

41、nsitive to the general transportation conditions stated in 4.1. Minimum air pressure: corresponding to an altitude of 12 km (about 19,3 kPa). 5 Storage conditions Well controlled storage conditions are a major factor in problem prevention. Do not store where the soldering properties can be deteriora

42、ted by harmful gases. Conditions that may expose products to detrimental electrical field strengths should be avoided. Exposure of the products to direct solar radiation should be avoided. The following conditions are advised: Climatic conditions according to IEC 60721-3-1, class 1K2, except: low re

43、lative humidity 10 %; high relative humidity 75 %. The storage time as given by the manufacturer specification shall not be exceeded. It is however recommended that the total storage time should not exceed two years (manufacturer and customer) but should be limited to one year after receipt of the p

44、roducts by the customer. In specific cases, the exact storage time- and the re-qualification rules, if the time is exceeded, are given in the component specification. As a minimum at least the solderability of the components has to be re-qualified. If longer storage times are needed, the manufacture

45、r should be consulted to conclude arrangements for suitable storage and packaging conditions. During storage the original smallest packaging unit (SPU) shall not be opened, the SPU should preferably remain in the original packaging. Even though products are stored for a shorter period of time, it is

46、 advised to apply the above- mentioned temperature and humidity conditions. For “last call” components, the storage conditions to conserve the components properties shall be agreed between the manufacturer and the user. 6 Related issues If the products in standard packaging do not fulfil the require

47、d quality and reliability goals under the shipment and storage conditions as described above, special actions shall be considered as described in IEC 60749, IEC/TS 61340-5-1 and IEC/TS 61340-5-2. 61760-2 IEC:2007(E) 7 Annex A (informative) Transportation climatic conditions For easy and rapid refere

48、nce, this annex shows the content of the quoted conditions of IEC 60721-3-1 and IEC 60721-3-2. NOTE The footnote references can be found on the last page. Table A.1 Transportation climatic conditions according to IEC 60721-3-2 Class Environmental parameter Unit 2K1 2K2 Conditions used in this standa

49、rd instead of 2K2 a) Low air temperature C +5 -25 -40 b) High air temperature, air in unventilated enclosures 1)C No +60 c) High air temperature, air in ventilated enclosures or outdoor air 2)C +40 +40 d) Change of temperature, air/air 3)C No -25/+25 -40/+30 e) Change of temperature, air/water 3)C No No f) Relative humidity, not combined with rapid temperature changes % C 75 +30 75 +30 g) Relative