IEC 61192-5-2007 Workmanship requirements for soldered electronic assemblies - Part 5 Rework modification and repair of soldered electronic assemblies《焊接电子组件的工艺要求.第5部分 焊接电子组件的再加工、改进和检修》.pdf

《IEC 61192-5-2007 Workmanship requirements for soldered electronic assemblies - Part 5 Rework modification and repair of soldered electronic assemblies《焊接电子组件的工艺要求.第5部分 焊接电子组件的再加工、改进和检修》.pdf》由会员分享，可在线阅读，更多相关《IEC 61192-5-2007 Workmanship requirements for soldered electronic assemblies - Part 5 Rework modification and repair of soldered electronic assemblies《焊接电子组件的工艺要求.第5部分 焊接电子组件的再加工、改进和检修》.pdf（84页珍藏版）》请在麦多课文档分享上搜索。

1、 IEC 61192-5 Edition 1.0 2007-05 INTERNATIONAL STANDARD NORME INTERNATIONALE Workmanship requirements for soldered electronic assemblies Part 5: Rework, modification and repair of soldered electronic assemblies Exigences relatives la qualit dexcution des assemblages lectroniques brass Partie 5: Reto

2、uche, modification et rparation des assemblages lectroniques brass IEC 61192-5:2007 THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2007 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means,

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16、 sur cette publication ou si vous avez des questions, visitez le FAQ du Service clients ou contactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 61192-5 Edition 1.0 2007-05 INTERNATIONAL STANDARD NORME INTERNATIONALE Workmanship requirements for soldered electronic assembl

17、ies Part 5: Rework, modification and repair of soldered electronic assemblies Exigences relatives la qualit dexcution des assemblages lectroniques brass Partie 5: Retouche, modification et rparation des assemblages lectroniques brass INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNI

18、QUE INTERNATIONALE W ICS 31.190 PRICE CODE CODE PRIX ISBN 2-8318-9781-5 2 61192-5 IEC:2007 CONTENTS FOREWORD.5 1 Scope.7 2 Normative references .8 3 Terminology .9 3.1 Terms and definitions 9 3.2 Abbreviations 10 4 Classification of rework activities10 4.1 Pre-soldering rework .10 4.2 Post-soldering

19、 rework11 4.3 Essential prerequisites for successful and reliable rework .11 5 Pre-soldering rework 12 5.1 General .12 5.2 Reworking solder paste and non-conducting adhesive deposits.12 5.2.1 General .12 5.2.2 General misalignment or smudging of deposits12 5.2.3 Local misalignment or smudging of dep

20、osit12 5.2.4 General paste or adhesive quantity incorrect.12 5.2.5 Local paste or adhesive quantity incorrect.12 5.3 Reworking placed components 12 5.3.1 General overall component misalignment 12 5.3.2 Local component misalignment13 5.4 Realigning components after curing thermoplastic adhesive13 5.5

21、 Realigning components after curing thermosetting adhesive13 6 Factors affecting post-soldering rework 13 6.1 Component marking and unmarked components .13 6.2 Reuse of removed components .14 6.3 Sensitive components .14 6.4 Printed board layout design and space constraints14 6.5 Heat-sink effects .

22、15 6.6 Printed board material type .15 6.7 Solder resist material and aperture size 15 6.8 Reworking individual fine pitch device leads17 6.9 Reworking grid arrays .17 7 Preparation for post-soldering rework and repair 18 7.1 Electrostatic precautions .18 7.2 Avoiding exposure of components to conta

23、minants18 7.3 Removal of conformal coating .18 7.4 Unsuitable components .18 7.5 Cleaning prior to rework 19 7.6 Protecting adjacent sensitive components .19 7.7 Baking of assemblies prior to component replacement 19 7.8 Preheating large multilayer boards 19 7.9 Preheating replacement sensitive comp

24、onents 19 8 Post-soldering rework.19 8.1 General .19 8.2 Component realignment (tweaking) .20 61192-5 IEC:2007 3 8.3 Component removal 20 8.4 Removal of adjacent components20 8.5 Reuse of components20 8.6 Addition of flux and solder.20 8.7 Topping-up21 8.8 Removal of excess solder from joints 22 8.9

25、 Preparation of lands before component replacement .22 8.10 Component replacement22 8.11 Cleaning (if required).23 8.12 Visual inspection and electrical testing 23 8.13 Checking thermal integrity of solder joints .23 8.14 Replacement of local conformal coating (if required) .23 9 Selection of rework

26、 equipment, tools and methods .23 9.1 General .23 9.2 Matching rework equipment to component and printed-board prerequisites .24 9.2.1 General .24 9.2.2 Selection based on component types on the printed board 24 9.2.3 Selection based on printed-board laminate material type .25 9.2.4 Selection based

27、on assembly structure and soldering processes .25 10 Manual rework tools and methods 27 10.1 General .27 10.2 Miniature conventional (stored energy) soldering irons 27 10.3 Directly heated soldering irons 28 10.4 Hot air/gas pencils.29 10.5 Heated tweezers .29 10.6 Soldering irons with special tips

28、30 11 Mechanized and programmable rework machines.30 11.1 General .30 11.2 Hot air rework machines30 11.3 Focused infrared (IR) equipment .31 11.4 Thermode (heated electrode) equipment .32 11.5 Laser equipment for de-soldering 33 12 Ancillary tools and equipment.34 12.1 Conventional soldering irons

29、.34 12.2 Hotplates.34 12.3 Pneumatic dispensers .34 12.4 De-soldering tools, as used for through-hole assemblies .35 12.5 Tweezers and vacuum pencils.35 12.6 Solder pots35 12.7 Copper braid .35 13 Rework recording procedures.35 13.1 General .35 13.2 Anomaly charts .35 13.3 Travelling documents 36 13

30、.4 Rework status .37 14 Training of operators and inspectors 37 15 Field repair.38 Bibliography39 4 61192-5 IEC:2007 Figure 1 Typical in-process modification, rework or repair activities .8 Figure 2 Gang mounting no solder mask between lands.16 Figure 3 Conductor between lands on small pitch 16 Figu

31、re 4 Optional solder-mask design for multiple termination component attachment17 Figure 5 SOIC repair procedure example .24 Figure 6 Comparing hot air/gas and infrared rework processes 27 Figure 7 Miniature conventional soldering iron .28 Figure 8 Hot air solder system .31 Figure 9 Heated thermode r

32、eflow soldering32 Figure 10 Automated laser reflow equipment .34 Table 1 Recommended tools for different component types .26 Table 2 Electrical and electronic assembly defects 36 61192-5 IEC:2007 5 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIE

33、S Part 5: Rework, modification and repair of soldered electronic assemblies FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote i

34、nternational co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (here

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40、its approval and cannot be rendered responsible for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including indi

41、vidual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon,

42、 this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of

43、 this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61192-5 has been prepared by IEC technical committee 91: Electronics assembly technology. This bilingual version, published in 2008-0

44、5, corresponds to the English version. The text of this standard is based on the following documents: FDIS Report on voting 91/652/FDIS 91/686/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. The French version of

45、 this standard has not been voted upon. 6 61192-5 IEC:2007 This publication has been drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts in the IEC 61192 series, under the general title Workmanship requirements for soldered electronic assemblies, can be found on the IEC we

46、bsite. The committee has decided that the contents of this publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed; withdrawn; re

47、placed by a revised edition, or amended. 61192-5 IEC:2007 7 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES Part 5: Rework, modification and repair of soldered electronic assemblies 1 Scope This part of IEC 61192 provides information and requirements that are applicable to modification,

48、rework and repair procedures for soldered electronic assemblies. It is applicable to specific processes used to manufacture soldered electronic assemblies where components are attached to printed boards and to the relevant parts of resulting products. The standard is also applicable to activities th

49、at can form part of the work in assembling mixed technology products. This part of IEC 61192 also contains guidance on design matters where they have relevance to rework. NOTE Typical in-process surface-mount rework activities to which this standard applies are shown in Figure 1. 8 61192-5 IEC:2007 After component preparation After solder past deposition After component placement After ref