IEC 61191-2-2017 Printed board assemblies - Part 2 Sectional specification - Requirements for surface mount soldered assemblies《印刷电路板组件 第2部分 分规范 表面安装焊接组件的要求》.pdf

《IEC 61191-2-2017 Printed board assemblies - Part 2 Sectional specification - Requirements for surface mount soldered assemblies《印刷电路板组件 第2部分 分规范 表面安装焊接组件的要求》.pdf》由会员分享，可在线阅读，更多相关《IEC 61191-2-2017 Printed board assemblies - Part 2 Sectional specification - Requirements for surface mount soldered assemblies《印刷电路板组件 第2部分 分规范 表面安装焊接组件的要求》.pdf（38页珍藏版）》请在麦多课文档分享上搜索。

1、 IEC 61191-2 Edition 3.0 2017-05 INTERNATIONAL STANDARD Printed board assemblies Part 2: Sectional specification Requirements for surface mount soldered assemblies IEC 61191-2:2017-05(en) colour inside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2017 IEC, Geneva, Switzerland All rights reserve

2、d. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying and microfilm, without permission in writing from either IEC or IECs member National Committee in the country of the requester. If yo

3、u have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or your local IEC member National Committee for further information. IEC Central Office Tel.: +41 22 919 02 11 3, rue de Varemb Fax: +41 22 919 03 00 CH

4、-1211 Geneva 20 infoiec.ch Switzerland www.iec.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International Standards for all electrical, electronic and related technologies. About IEC publications The technical con

5、tent of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might have been published. IEC Catalogue - webstore.iec.ch/catalogue The stand-alone application for consulting the entire bibliographical information on

6、 IEC International Standards, Technical Specifications, Technical Reports and other documents. Available for PC, Mac OS, Android Tablets and iPad. IEC publications search - www.iec.ch/searchpub The advanced search enables to find IEC publications by a variety of criteria (reference number, text, tec

7、hnical committee,). It also gives information on projects, replaced and withdrawn publications. IEC Just Published - webstore.iec.ch/justpublished Stay up to date on all new IEC publications. Just Published details all new publications released. Available online and also once a month by email. Elect

8、ropedia - www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing 20 000 terms and definitions in English and French, with equivalent terms in 16 additional languages. Also known as the International Electrotechnical Vocabulary (IEV) online. IEC Glossa

9、ry - std.iec.ch/glossary 65 000 electrotechnical terminology entries in English and French extracted from the Terms and Definitions clause of IEC publications issued since 2002. Some entries have been collected from earlier publications of IEC TC 37, 77, 86 and CISPR. IEC Customer Service Centre - w

10、ebstore.iec.ch/csc If you wish to give us your feedback on this publication or need further assistance, please contact the Customer Service Centre: csciec.ch. IEC 61191-2 Edition 3.0 2017-05 INTERNATIONAL STANDARD Printed board assemblies Part 2: Sectional specification Requirements for surface moun

11、t soldered assemblies INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 31.190; 31.240 ISBN 978-2-8322-4322-0 Registered trademark of the International Electrotechnical Commission Warning! Make sure that you obtained this publication from an authorized distributor. colour inside 2 IEC 61191-2:2017 IEC 2

12、017 CONTENTS FOREWORD . 5 1 Scope 7 2 Normative references 7 3 Terms and definitions 7 4 General requirements 7 5 Surface mounting of components . 7 5.1 General . 7 5.2 Alignment requirements 8 5.3 Process control . 8 5.4 Surface mounted component requirements . 8 5.5 Flatpack lead forming 8 5.5.1 G

13、eneral . 8 5.5.2 Surface mounted device lead bends 8 5.5.3 Surface mounted device lead deformation . 9 5.5.4 Flattened leads 9 5.5.5 Dual-in-line packages (DIPs) . 9 5.5.6 Parts not configured for surface mounting 9 5.6 Small devices with two terminations 9 5.6.1 General . 9 5.6.2 Stack mounting 9 5

14、.6.3 Devices with external deposited elements 9 5.7 Lead component body positioning . 10 5.7.1 General . 10 5.7.2 Axial-leaded components . 10 5.7.3 Other components . 10 5.8 Parts configured for butt lead mounting . 10 5.9 Non-conductive adhesive coverage limits 10 6 Acceptance requirements 10 6.1

15、General . 10 6.2 Control and corrective actions . 10 6.3 Surface soldering of leads and terminations 11 6.3.1 General . 11 6.3.2 Solder fillet height and heel fillets 11 6.3.3 Flat ribbon L and gull-wing leads . 12 6.3.4 Round or flattened (coined) leads 13 6.3.5 J leads . 14 6.3.6 Rectangular or sq

16、uare end component 15 6.3.7 Cylindrical end-cap terminations 16 6.3.8 Bottom only terminations . 17 6.3.9 Castellated terminations 18 6.3.10 Butt joints 19 6.3.11 Inward L-shaped ribbon leads 20 6.3.12 Flat lug leads . 21 6.3.13 Ball grid array 22 6.3.14 Column grid array 23 6.3.15 Bottom terminatio

17、n components . 24 IEC 61191-2:2017 IEC 2017 3 6.3.16 Components with bottom thermal plane terminations (D-Pak) 24 6.3.17 P-style terminations . 26 6.4 General post-soldering requirements applicable to all surface-mounted assemblies 26 6.4.1 Dewetting 26 6.4.2 Leaching 26 6.4.3 Pits, voids, blowholes

18、, and cavities 26 6.4.4 Solder wicking . 27 6.4.5 Solder webs and skins . 27 6.4.6 Bridging . 27 6.4.7 Degradation of marking . 27 6.4.8 Solder spikes . 27 6.4.9 Disturbed joint . 27 6.4.10 Component damage. 27 6.4.11 Open circuit, non-wetting . 27 6.4.12 Component tilting. 27 6.4.13 Non-conducting

19、adhesive encroachment 28 6.4.14 Open circuit, no solder available 28 6.4.15 Component on edge 28 7 Rework and repair . 28 Annex A (normative) Placement requirements for surface mounted devices . 30 A.1 General . 30 A.2 Component positioning . 30 A.3 Small devices incorporating two terminations 30 A.

20、3.1 Metallization coverage over the land (side-to-side) 30 A.3.2 Metallization coverage over the land (end) . 30 A.4 Mounting of cylindrical end-cap devices (MELFs) 30 A.5 Registration of castellated chip carriers 30 A.6 Surface mounted device lead and land contact . 30 A.7 Surface mounted device le

21、ad side overhang . 30 A.8 Surface mounted device lead toe overhang . 31 A.9 Surface mounted device lead height off land (prior to soldering) . 31 A.10 Positioning of J lead devices . 31 A.11 Positioning gull-wing lead devices . 31 A.12 External connections to packaging and interconnect structures .

22、31 Bibliography 32 Figure 1 Lead formation for surface mounted device 8 Figure 2 Fillet height 12 Figure 3 Flat ribbon and gull-wing leads . 13 Figure 4 Round or flattened (coined) lead joint . 14 Figure 5 J lead joint . 15 Figure 6 Rectangular or square end components . 16 Figure 7 Cylindrical end-

23、cap terminations 17 Figure 8 Bottom only terminations 18 Figure 9 Leadless chip carriers with castellated terminations . 19 Figure 10 Butt joints . 20 4 IEC 61191-2:2017 IEC 2017 Figure 11 Inward L-shaped ribbon leads 21 Figure 12 Flat lug leads . 22 Figure 13 BGA with collapsing balls . 23 Figure 1

24、4 Bottom termination components . 24 Figure 15 Bottom thermal plane terminations . 25 Figure 16 P-style terminations . 26 Table 1 BGA with non-collapsing balls . 23 Table 2 Column grid array 23 Table 3 Reworkable defects . 29 IEC 61191-2:2017 IEC 2017 5 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ PR

25、INTED BOARD ASSEMBLIES Part 2: Sectional specification Requirements for surface mount soldered assemblies FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The

26、 object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifi

27、cations (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations

28、liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters ex

29、press, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Comm

30、ittees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC Natio

31、nal Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does

32、not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas, access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have

33、 the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoe

34、ver, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publicati

35、ons is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standar

36、d IEC 61191-2 has been prepared by IEC technical committee 91: Electronics assembly technology. This third edition cancels and replaces the second edition published in 2013. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect

37、to the previous edition: a) the requirements have been updated to be compliant with the acceptance criteria in IPC-A-610F; b) some of the terminology used in the document has been updated; c) references to IEC standards have been corrected; d) five termination styles have been added. 6 IEC 61191-2:2

38、017 IEC 2017 The text of this International Standard is based on the following documents: CDV Report on voting 91/1386/CDV 91/1429/RVC Full information on the voting for the approval of this International Standard can be found in the report on voting indicated in the above table. This document has b

39、een drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts of IEC 61191 under the general title Printed board assemblies can be found in the IEC website. The committee has decided that the contents of this document will remain unchanged until the stability date indicated on t

40、he IEC website under “http:/webstore.iec.ch“ in the data related to the specific document. At this date, the document will be reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual version of this publication may be issued at a later date. IMPORTANT The colour inside logo on

41、the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. IEC 61191-2:2017 IEC 2017 7 PRINTED BOARD ASSEMBLIES Part 2: Sectional specificati

42、on Requirements for surface mount soldered assemblies 1 Scope This part of IEC 61191 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other re

43、lated technologies (e.g. through- hole, chip mounting, terminal mounting, etc.). 2 Normative references The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited applies.

44、 For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60194, Printed board design, manufacture and assembly Terms and definitions IEC 61191-1, Printed board assemblies Part 1: Generic specification Requirements for soldered electrical and elec

45、tronic assemblies using surface mount and related assembly technologies IPC-A-610, Acceptability of Electronic Assemblies 3 Terms and definitions For the purposes of this document, the terms and definitions given in IEC 60194 apply. ISO and IEC maintain terminological databases for use in standardiz

46、ation at the following addresses: IEC Electropedia: available at http:/www.electropedia.org/ ISO Online browsing platform: available at http:/www.iso.org/obp 4 General requirements The requirements of IEC 61191-1 are a mandatory part of this specification. Workmanship shall meet the requirements of

47、IPC-A-610 in accordance with the classification requirements of this document. 5 Surface mounting of components 5.1 General This clause covers assembly of components that are placed on the surface to be manually or machine soldered and includes components designed for surface mounting as well as thr

48、ough-hole components that have been adapted for surface mounting technology. 8 IEC 61191-2:2017 IEC 2017 5.2 Alignment requirements Sufficient process control at all stages of design and assembly shall be in place to enable the post-soldering alignments and solder joint fillet controls specified in

49、6.3 to be achieved. Relevant factors affecting the requirements include land and conductor design, component proximities, component and land solderability, solder paste/adhesive quantity and alignment and component placement accuracy. 5.3 Process control If suitable process controls are not in place to ensure compliance with 5.2 and the intent of Annex A, the detailed requirements of Annex A shall be mandatory. 5.4 Surface mounted component requireme