1、 IEC 61191-2 Edition 3.0 2017-05 INTERNATIONAL STANDARD Printed board assemblies Part 2: Sectional specification Requirements for surface mount soldered assemblies IEC 61191-2:2017-05(en) colour inside THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2017 IEC, Geneva, Switzerland All rights reserve
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11、t soldered assemblies INTERNATIONAL ELECTROTECHNICAL COMMISSION ICS 31.190; 31.240 ISBN 978-2-8322-4322-0 Registered trademark of the International Electrotechnical Commission Warning! Make sure that you obtained this publication from an authorized distributor. colour inside 2 IEC 61191-2:2017 IEC 2
12、017 CONTENTS FOREWORD . 5 1 Scope 7 2 Normative references 7 3 Terms and definitions 7 4 General requirements 7 5 Surface mounting of components . 7 5.1 General . 7 5.2 Alignment requirements 8 5.3 Process control . 8 5.4 Surface mounted component requirements . 8 5.5 Flatpack lead forming 8 5.5.1 G
13、eneral . 8 5.5.2 Surface mounted device lead bends 8 5.5.3 Surface mounted device lead deformation . 9 5.5.4 Flattened leads 9 5.5.5 Dual-in-line packages (DIPs) . 9 5.5.6 Parts not configured for surface mounting 9 5.6 Small devices with two terminations 9 5.6.1 General . 9 5.6.2 Stack mounting 9 5
14、.6.3 Devices with external deposited elements 9 5.7 Lead component body positioning . 10 5.7.1 General . 10 5.7.2 Axial-leaded components . 10 5.7.3 Other components . 10 5.8 Parts configured for butt lead mounting . 10 5.9 Non-conductive adhesive coverage limits 10 6 Acceptance requirements 10 6.1
15、General . 10 6.2 Control and corrective actions . 10 6.3 Surface soldering of leads and terminations 11 6.3.1 General . 11 6.3.2 Solder fillet height and heel fillets 11 6.3.3 Flat ribbon L and gull-wing leads . 12 6.3.4 Round or flattened (coined) leads 13 6.3.5 J leads . 14 6.3.6 Rectangular or sq
16、uare end component 15 6.3.7 Cylindrical end-cap terminations 16 6.3.8 Bottom only terminations . 17 6.3.9 Castellated terminations 18 6.3.10 Butt joints 19 6.3.11 Inward L-shaped ribbon leads 20 6.3.12 Flat lug leads . 21 6.3.13 Ball grid array 22 6.3.14 Column grid array 23 6.3.15 Bottom terminatio
17、n components . 24 IEC 61191-2:2017 IEC 2017 3 6.3.16 Components with bottom thermal plane terminations (D-Pak) 24 6.3.17 P-style terminations . 26 6.4 General post-soldering requirements applicable to all surface-mounted assemblies 26 6.4.1 Dewetting 26 6.4.2 Leaching 26 6.4.3 Pits, voids, blowholes
18、, and cavities 26 6.4.4 Solder wicking . 27 6.4.5 Solder webs and skins . 27 6.4.6 Bridging . 27 6.4.7 Degradation of marking . 27 6.4.8 Solder spikes . 27 6.4.9 Disturbed joint . 27 6.4.10 Component damage. 27 6.4.11 Open circuit, non-wetting . 27 6.4.12 Component tilting. 27 6.4.13 Non-conducting
19、adhesive encroachment 28 6.4.14 Open circuit, no solder available 28 6.4.15 Component on edge 28 7 Rework and repair . 28 Annex A (normative) Placement requirements for surface mounted devices . 30 A.1 General . 30 A.2 Component positioning . 30 A.3 Small devices incorporating two terminations 30 A.
20、3.1 Metallization coverage over the land (side-to-side) 30 A.3.2 Metallization coverage over the land (end) . 30 A.4 Mounting of cylindrical end-cap devices (MELFs) 30 A.5 Registration of castellated chip carriers 30 A.6 Surface mounted device lead and land contact . 30 A.7 Surface mounted device le
21、ad side overhang . 30 A.8 Surface mounted device lead toe overhang . 31 A.9 Surface mounted device lead height off land (prior to soldering) . 31 A.10 Positioning of J lead devices . 31 A.11 Positioning gull-wing lead devices . 31 A.12 External connections to packaging and interconnect structures .
22、31 Bibliography 32 Figure 1 Lead formation for surface mounted device 8 Figure 2 Fillet height 12 Figure 3 Flat ribbon and gull-wing leads . 13 Figure 4 Round or flattened (coined) lead joint . 14 Figure 5 J lead joint . 15 Figure 6 Rectangular or square end components . 16 Figure 7 Cylindrical end-
23、cap terminations 17 Figure 8 Bottom only terminations 18 Figure 9 Leadless chip carriers with castellated terminations . 19 Figure 10 Butt joints . 20 4 IEC 61191-2:2017 IEC 2017 Figure 11 Inward L-shaped ribbon leads 21 Figure 12 Flat lug leads . 22 Figure 13 BGA with collapsing balls . 23 Figure 1
24、4 Bottom termination components . 24 Figure 15 Bottom thermal plane terminations . 25 Figure 16 P-style terminations . 26 Table 1 BGA with non-collapsing balls . 23 Table 2 Column grid array 23 Table 3 Reworkable defects . 29 IEC 61191-2:2017 IEC 2017 5 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ PR
25、INTED BOARD ASSEMBLIES Part 2: Sectional specification Requirements for surface mount soldered assemblies FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The
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36、d IEC 61191-2 has been prepared by IEC technical committee 91: Electronics assembly technology. This third edition cancels and replaces the second edition published in 2013. This edition constitutes a technical revision. This edition includes the following significant technical changes with respect
37、to the previous edition: a) the requirements have been updated to be compliant with the acceptance criteria in IPC-A-610F; b) some of the terminology used in the document has been updated; c) references to IEC standards have been corrected; d) five termination styles have been added. 6 IEC 61191-2:2
38、017 IEC 2017 The text of this International Standard is based on the following documents: CDV Report on voting 91/1386/CDV 91/1429/RVC Full information on the voting for the approval of this International Standard can be found in the report on voting indicated in the above table. This document has b
39、een drafted in accordance with the ISO/IEC Directives, Part 2. A list of all parts of IEC 61191 under the general title Printed board assemblies can be found in the IEC website. The committee has decided that the contents of this document will remain unchanged until the stability date indicated on t
40、he IEC website under “http:/webstore.iec.ch“ in the data related to the specific document. At this date, the document will be reconfirmed, withdrawn, replaced by a revised edition, or amended. A bilingual version of this publication may be issued at a later date. IMPORTANT The colour inside logo on
41、the cover page of this publication indicates that it contains colours which are considered to be useful for the correct understanding of its contents. Users should therefore print this document using a colour printer. IEC 61191-2:2017 IEC 2017 7 PRINTED BOARD ASSEMBLIES Part 2: Sectional specificati
42、on Requirements for surface mount soldered assemblies 1 Scope This part of IEC 61191 gives the requirements for surface mount solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other re
43、lated technologies (e.g. through- hole, chip mounting, terminal mounting, etc.). 2 Normative references The following documents are referred to in the text in such a way that some or all of their content constitutes requirements of this document. For dated references, only the edition cited applies.
44、 For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60194, Printed board design, manufacture and assembly Terms and definitions IEC 61191-1, Printed board assemblies Part 1: Generic specification Requirements for soldered electrical and elec
45、tronic assemblies using surface mount and related assembly technologies IPC-A-610, Acceptability of Electronic Assemblies 3 Terms and definitions For the purposes of this document, the terms and definitions given in IEC 60194 apply. ISO and IEC maintain terminological databases for use in standardiz
46、ation at the following addresses: IEC Electropedia: available at http:/www.electropedia.org/ ISO Online browsing platform: available at http:/www.iso.org/obp 4 General requirements The requirements of IEC 61191-1 are a mandatory part of this specification. Workmanship shall meet the requirements of
47、IPC-A-610 in accordance with the classification requirements of this document. 5 Surface mounting of components 5.1 General This clause covers assembly of components that are placed on the surface to be manually or machine soldered and includes components designed for surface mounting as well as thr
48、ough-hole components that have been adapted for surface mounting technology. 8 IEC 61191-2:2017 IEC 2017 5.2 Alignment requirements Sufficient process control at all stages of design and assembly shall be in place to enable the post-soldering alignments and solder joint fillet controls specified in
49、6.3 to be achieved. Relevant factors affecting the requirements include land and conductor design, component proximities, component and land solderability, solder paste/adhesive quantity and alignment and component placement accuracy. 5.3 Process control If suitable process controls are not in place to ensure compliance with 5.2 and the intent of Annex A, the detailed requirements of Annex A shall be mandatory. 5.4 Surface mounted component requireme
