IEC 60191-6-3-2000 Mechanical standardization of semiconductor devices - Part 6-3 General rules for the preparation of outline drawings of surface mounted semiconductor device pack.pdf

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1、 IEC 60191-6-3 Edition 1.0 2000-09 INTERNATIONAL STANDARD NORME INTERNATIONALE Mechanical standardization of semiconductor devices Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of quad flat pa

2、cks (QFP) Normalisation mcanique des dispositifs semiconducteurs Partie 6-3: Rgles gnrales pour la prparation des dessins dencombrement des dispositifs semiconducteurs montage en surface Mthodes de mesure pour les botiers plats quadrangulaires (QFP) IEC 60191-6-3:2000 THIS PUBLICATION IS COPYRIGHT P

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16、aire Electrotechnique International (VEI) en ligne. Service Clients - webstore.iec.ch/csc Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 60191-6-3 Edition 1.0 2000-09 INTERNATIONAL STANDARD NORME INTERNATIONALE Mechanica

17、l standardization of semiconductor devices Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of quad flat packs (QFP) Normalisation mcanique des dispositifs semiconducteurs Partie 6-3: Rgles gnral

18、es pour la prparation des dessins dencombrement des dispositifs semiconducteurs montage en surface Mthodes de mesure pour les botiers plats quadrangulaires (QFP) INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE Q ICS 31.080.01 PRICE CODE CODE PRIX ISBN 978-2-83220

19、-591-4 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publication via

20、 un distributeur agr. 2 60191-6-3 IEC:2000 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of quad

21、 flat packs (QFP) FOREWORD 1) The IEC (International Electrotechnical Commission) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of the IEC is to promote international co-operation on all questions concerning

22、standardization in the electrical and electronic fields. To this end and in addition to other activities, the IEC publishes International Standards. Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this prepara

23、tory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. The IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organ

24、izations. 2) The formal decisions or agreements of the IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested National Committees. 3) The documents produced have the

25、 form of recommendations for international use and are published in the form of standards, technical specifications, technical reports or guides and they are accepted by the National Committees in that sense. 4) In order to promote international unification, IEC National Committees undertake to appl

26、y IEC International Standards transparently to the maximum extent possible in their national and regional standards. Any divergence between the IEC Standard and the corresponding national or regional standard shall be clearly indicated in the latter. 5) The IEC provides no marking procedure to indic

27、ate its approval and cannot be rendered responsible for any equipment declared to be in conformity with one of its standards. 6) Attention is drawn to the possibility that some of the elements of this International Standard may be the subject of patent rights. The IEC shall not be held responsible f

28、or identifying any or all such patent rights. International Standard IEC 60191-6-3 has been prepared by subcommittee 47D: Mechanical standardization of semiconductor devices, of IEC technical committee 47: Semiconductor devices. This bilingual version (2013-01) corresponds to the monolingual English

29、 version, published in 2000-09. The text of this standard is based on the following documents: FDIS Report on voting 47D/370/FDIS 47D/388/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. The French version of this

30、 standard has not been voted upon. This publication has been drafted in accordance with the ISO/IEC Directives, Part 3. 60191-6-3 IEC:2000 3 The committee has decided that the contents of this publication will remain unchanged until 2003. At this date, the publication will be reconfirmed; withdrawn;

31、 replaced by a revised edition, or amended. 4 60191-6-3 IEC:2000 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Measuring methods for package dimensions of quad flat packs (QFP) 1 Sc

32、ope This part of IEC 60191 stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E. 2 Normative references The following normative documents contain provisions which, through reference in this text, constitute provisions of this part of IEC 60191. For date

33、d references, subsequent amendments to, or revisions of, any of these publications do not apply. However, parties to agreements based on this part of IEC 60191 are encouraged to investigate the possibility of applying the most recent editions of the normative documents indicated below. For undated r

34、eferences, the latest edition of the normative document referred to applies. Members of IEC and ISO maintain registers of currently valid International Standards. IEC 60191-6:1990, Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of su

35、rface mounted semiconductor device packages 3 Definitions For the purpose of this part of IEC 60191, the definitions of IEC 60191-6 apply. 4 Measuring methods 4.1 The measuring methods described in this standard are for dimension values guaranteed to users on the basis of the following items. a) In

36、general, measuring the dimensions shall be made with the semiconductor packages mounted on printed circuit-board as the guarantee is made to user. b) In general, measurement may be made either by hand or automatically. c) If a specified dimension is difficult to measure, the best alternative measuri

37、ng method is defined as the formal measuring method. d) The dimensions that cannot be measured unless the package is destroyed may be calculated from other dimensions or replaced by representative values. 60191-6-3 IEC:2000 5 4.2 Reference characters and drawing Figure 1 S /2 /2 E H y S f S AB x S A

38、B E 2 1 A 1 A A 2 Z D X4 t S AB n A X4 e b D B D /2 H D /2 HD E H E IEC 1671/2000 6 60191-6-3 IEC:2000 c1 c b1 b A3 L1 Lp cFigure 2 IEC 1672/2000 Seating plane 60191-6-3 IEC:2000 7 4.3 Datum The datum shall be defined as follows. S x S AB A B 0.1 |90 - | 2 = Figure 3 Centres of opposite sides of a p

39、ackage, which are defined below, shall be connected together. An angle subtended by the two crossing lines shall be obtained. A difference |90 - | of the angle from 90 shall be equally distributed to the sides to obtain rectangular axes. The rectangular axes are depicted as datum lines A and B of th

40、e package. Description of the centres of sides Even number of leads on a package side Odd number of leads on a package side 0,10,1A centre of facing sides of adjacent leads at a position 0,1 mm inside the top of the leads The centre of leads at a position 0,1 mm inside the top of the leads Figure 4

41、IEC 1673/2000 IEC 1674/2000 IEC 1675/2000 8 60191-6-3 IEC:2000 4.4 Overall width HE / overall length HD / Package width D / package length E 4.4.1 Description a) As to the overall width and overall length, all lead tops should be located within the range t centring on the position which is at a theo

42、retically correct distance of HE/2 or HD/2 from the datum A or B. b) As to the package width and length, the package end-face should be located within the range f centring on the position which is at a theoretically correct distance of E/2 or D/2 from the datum A or B. f SAB tSAB X4 A X4 S HD D B D

43、/2 H D /2Figure 5 IEC 1676/2000 60191-6-3 IEC:2000 9 f t A B HD /2 /2 /2, HE /2, D EFigure 6 4.4.2 Measuring method a) HE/HD 1) Put the package on the surface plate to establish the datum reference S. 2) Make the datum A and B coincide with the measuring reference. 3) Find the logically precise dist

44、ances HD/2 and HE/2 from the datum A and B. Then check if the tip of every lead on each package side is within the tolerance t (range) specified as the centre. b) E/D 1) Put the package on the surface plate to establish the datum reference S. 2) Make the datum A and B coincide with the measuring ref

45、erence. 3) Find the theoretically precise distances D/2 and E/2 from the datum A and B. Then check if the package edge on each package side is within the tolerance f (range) specified as the centre. 4.5 Mounting height A 4.5.1 Description Let the height of a package from the seating plane to the top

46、 of the package be denoted as the mounting height. The mounting height therefore includes inclination and warping of the package. IEC 1677/2000 10 60191-6-3 IEC:2000 A AFigure 7 4.5.2 Measuring method a) Put the package on the surface plate to establish the seating plane. From the side or the top, m

47、easure the distance to a highest point. b) Let the distance be denoted as the mounting height. IEC 1678/2000 60191-6-3 IEC:2000 11 4.6 Stand-off A1 4.6.1 Description Let a distance from the seating plane to the lowest point of a package be denoted as the stand-off. A1 A1Figure 8 4.6.2 Measuring meth

48、od a) Put the package on the surface plate to establish the reference surface (seating plane). b) Measure a distance from the reference surface to the lowest point of the package. IEC 1679/2000 12 60191-6-3 IEC:2000 4.7 Body thickness A2 4.7.1 Description The body thickness is defined as a distance

49、between two parallel planes, tangent to the highest and lowest points of the body. A2 A2Figure 9 4.7.2 Measuring method a) Put the package which is accurately dimensioned between surface plates which are larger than the package vertically in parallel. Never touch the leads. b) Measure the total thickness including the surface plates with a micrometer and subtract the th