IEC 60191-6-18 CORR 1-2010 Mechanical standardization of semiconductor devices - Part 6-18 General rules for the preparation of outline drawings of surface mounted semiconductor de.pdf

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1、May 2010 Mai 2010 IEC 60191-6-18 (First edition 2010) MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guide for ball grid array (BGA) CEI 60191-6-18 (Premire dition 2010) NORM

2、ALISATION MCANIQUE DES DISPOSITIFS SEMICONDUCTEURS Partie 6-18: Rgles gnrales pour la prparation des dessins dencombrement des dispositifs semiconducteurs pour montage en surface Guide de conception pour les botiers matriciels billes (BGA) CORRIGENDUM 1 3.1 ball grid array BGA Instead of: “a package

3、 that has .“ read: “package that has .“ 3.1 botier matriciel billes BGA la place de: “un botier dont les billes mtalliques.“ lire: “botier dont les billes mtalliques.“ 3.1 NOTE Instead of: “.(See Annex A).“ read: “.(See Bibliography).“ 3.1 NOTE la place de: “.(Voir Annexe A).“ lire: “.(Voir Bibliographie).“ 3.2 plastic ball grid array P-BGA Instead of: “BGA with an organic substrate“ read: “BGA with a rigid organic substrate” 3.2 botier matriciel billes en plastique P-BGA la place de: “botier BGA comportant un substrat organique“ lire: “botier BGA comportant un substrat organique rigide”