IEC 60191-6-12-2011 Mechanical standardization of semiconductor devices - Part 6-12 General rules for the preparation of outline drawings of surface mounted semiconductor device pa.pdf
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1、 IEC 60191-6-12 Edition 2.0 2011-06 INTERNATIONAL STANDARD NORME INTERNATIONALE Mechanical standardization of semiconductor devices Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages Design guidelines for fine-pitch land grid array (FLGA
2、) Normalisation mcanique des dispositifs semiconducteurs Partie 6-12: Rgles gnrales pour la prparation des dessins dencombrement des botiers des dispositifs semiconducteurs montage en surface Lignes directrices de conception pour les botiers matriciels plots et pas fins (FLGA) IEC 60191-6-12:2011 co
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17、Service clients ou contactez-nous: Email: csciec.ch Tl.: +41 22 919 02 11 Fax: +41 22 919 03 00 IEC 60191-6-12 Edition 2.0 2011-06 INTERNATIONAL STANDARD NORME INTERNATIONALE Mechanical standardization of semiconductor devices Part 6-12: General rules for the preparation of outline drawings of surfa
18、ce mounted semiconductor device packages Design guidelines for fine-pitch land grid array (FLGA) Normalisation mcanique des dispositifs semiconducteurs Partie 6-12: Rgles gnrales pour la prparation des dessins dencombrement des botiers des dispositifs semiconducteurs montage en surface Lignes direct
19、rices de conception pour les botiers matriciels plots et pas fins (FLGA) INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE R ICS 31.080.01 PRICE CODE CODE PRIX ISBN 978-2-88912-527-2 Registered trademark of the International Electrotechnical Commission Marque dpose
20、 de la Commission Electrotechnique Internationale colour inside 2 60191-6-12 IEC:2011 CONTENTS FOREWORD . 3 1 Scope . 5 2 Normative references . 5 3 Terms and definitions . 5 4 Terminal position numbering . 6 5 Nominal package dimension . 6 6 Outline drawings and principle dimensions . 7 7 Dimension
21、s 10 Figure 1 Flange-type FLGA 6 Figure 2 Rectangle-type FLGA . 6 Figure 3 Flange-type FLGA 7 Figure 4 Rectangle-type FLGA . 8 Figure 5 Mechanical gauge drawing e . 9 Figure 6 Pattern of terminal position area f. 9 Table 1 Group 1: Dimensions appropriate to mounting and interchangeability 10 Table 2
22、 Group 2: Dimensions and tolerances . 14 Table 3 Combination list of D, E, M D , and M E e = 0,80mm pitch . 15 Table 4 Combination list of D, E, M D , and M E e = 0,65 mm pitch . 16 Table 5 Combination list of D, E, M D , and M E e = 0,50 mm pitch . 17 Table 6 Combination list of D, E, M D , and M E
23、 e = 0,40 mm pitch . 18 Table 7 Combination list of D, E, M D , and M E e = 0,30 mm pitch . 19 60191-6-12 IEC:2011 3 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES Part 6-12: General rules for the preparation of outline drawings of surface mounted sem
24、iconductor device packages Design guidelines for fine-pitch land grid array (FLGA) FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to pr
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