SAE J 473A-1962 Solders《焊合》.pdf

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1、SAE Technical Standards Board Rules provide that: “This report is published by SAE to advance the state of technical and engineering sciences. The use of this report is entirelyvoluntary, and its applicability and suitability for any particular use, including any patent infringement arising therefro

2、m, is the sole responsibility of the user.”SAE reviews each technical report at least every five years at which time it may be reaffirmed, revised, or cancelled. SAE invites your written comments and suggestions.QUESTIONS REGARDING THIS DOCUMENT: (412) 772-8512 FAX: (412) 776-0243TO PLACE A DOCUMENT

3、 ORDER; (412) 776-4970 FAX: (412) 776-0790SAE WEB ADDRESS http:/www.sae.orgCopyright 1962 Society of Automotive Engineers, Inc.All rights reserved. Printed in U.S.A.SURFACEVEHICLE400 Commonwealth Drive, Warrendale, PA 15096-0001STANDARDSubmitted for recognition as an American National StandardJ473aR

4、EV.JUN62Issued 1911-06Revised 1962-06Superseding J473 JUN11SOLDERSForewordThis Document has not changed other than to put it into the new SAE Technical Standards BoardFormat.1. ScopeThe choice of the type and grade of solder for any specific purpose will depend on the materials to bejoined and the m

5、ethod of applying. Those with higher amounts of tin usually wet and bond more readily andhave a narrower semi-molten range than lower amounts of tin.For strictly economic reasons, it is recommended that the grade of solder metal be selected that contains leastamount of tin required to give suitable

6、flowing and adhesive qualities for application.All the lead-tin solders, with or without antimony, are usually suitable for joining steel and copper base alloys.For galvanized steel or zinc, only Class A solders should be used. Class B solders, containing antimonyusually as a substitute for some of

7、the tin or to increase strength and hardness of the filler metal, formintermetallic antimony-zinc compounds, causing the joint to become embrittled. Lead-tin solders are notrecommended for joining aluminum, magnesium, or stainless steel.Permissible impurity levels are shown:In dipping solders, 0.5%

8、max copper is permissible because of pickup in bath.Compositions, temperatures, and similar specifications of these SAE solders are shown in Table 1.MAX IMPURITIES, %Bismuth.0.25 Zinc0.005Copper0.08 Aluminum.0.005Iron0.02 Other elements, total0.08SAE J473a Revised JUN62-2-2. ReferencesThere are no r

9、eferenced publications specified herein.PREPARED BY THE SAE NONFERROUS METALS COMMITTEETABLE 1COMPOSITIONS, TEMPERATURES, AND SIMILAR SPECIFICATIONSSAENo.Sn Pb SbTemperature, F Similar ASTMGrades inSpecificationB 32-58TSolidus Liquidus1A 45.0, 1.0 Remainder 0.4 max 360 440 Alloy 45B1B 43.0, +0.5 Rem

10、ainder 1.52.00 365 4352A 40.0, 1.0 Remainder 0.4 max 360 455 Alloy 40B2B 38.0, +0.5 Remainder 1.52.00 365 4503A 30.0, 1.0 Remainder 0.5 max 360 490 Alloy 30B3B 30.0, 1.0 Remainder 0.751.25 365 4854A 25.0, 1.0 Remainder 0.4 max 360 510 Alloy 25B4B 25.0, 1.0 Remainder 1.251.75 365 5005A 20.0, 1.0 Rema

11、inder 0.4 max 360 535 Alloy 20B5B 20.0, 1.0 Remainder 1.251.75 365 5106A 15.0, 1.0 Remainder 0.4 max 435 555 Alloy 15B6B 15.0, 1.0 RemainderAs specified (1)1. Maximum, 2.75%.435445 5305557A 51.0, 2.0 Remainder 0.4 max 360 420 Alloy 50B8A 35.0, 1.0 Remainder 0.4 max 360 475 Alloy 35B9B 2.75, 0.25 Rem

12、ainder4.905.40(2)2. Also contains 0.400.60 arsenic; this solder should be used only with previously tinned base metal. Pure tin or higher tin-lead alloys may be used.465 555SAE J473a Revised JUN62RationaleNot applicable.Relationship of SAE Standard to ISO StandardNot applicable.ApplicationThe choice

13、 of the type and grade of solder for any specific purpose will depend on the materialsto be joined and the method of applying. Those with higher amounts of tin usually wet and bond morereadily and have a narrower semi-molten range than lower amounts of tin.For strictly economic reasons, it is recommended that the grade of solder metal be selected that containsleast amount of tin required to give suitable flowing and adhesive qualities for application.Reference SectionThere are no referenced publications specified herein.Developed by the SAE Nonferrous Metals Committee