SAE AIR 5709-2012 SAE AE-7 High Temperature Components Survey 2005《SAE AE-7高温型元件勘测 2005》.pdf

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1、_SAE Technical Standards Board Rules provide that: “This report is published by SAE to advance the state of technical and engineering sciences. The use of this report is entirely voluntary, and its applicability and suitability for any particular use, including any patent infringement arising theref

2、rom, is the sole responsibility of the user.” SAE reviews each technical report at least every five years at which time it may be reaffirmed, revised, or cancelled. SAE invites your written comments and suggestions. Copyright 2012 SAE International All rights reserved. No part of this publication ma

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4、Fax: 724-776-0790 Email: CustomerServicesae.org SAE WEB ADDRESS: http:/www.sae.orgSAE values your input. To provide feedback on this Technical Report, please visit http:/www.sae.org/technical/standards/AIR5709AEROSPACEINFORMATIONREPORTAIR5709 Issued 2012-10 SAE AE-7 High Temperature Components Surve

5、y, 2005 RATIONALEThe spirit of this document is to provide initial industry testing parameters to: (1) Aid component manufacturers in identifying their components as high-temperature and reliable. (2) Aid system designers with a strong starting source of electronic components and sensors to reduce i

6、n-house qualifying and reduce development risks. (3) Aid end-users identifying systems built from manufacturer qualified components and sensors, assuring increased operating life and reliability. (4) To keep testing and documentation simple and easy to understand in order for the end consumer to see

7、 the benefits of components and systems meeting the listed requirements within this document. This document is not intended to be an application specification but a means to facilitate the evolution of a high-temperature electronics industry benefiting a large number of industrial applications inclu

8、ding automotive, aerospace, deep drilling and electrical power grid. This document was written for consideration of new high-temperature components and not for manufacturer ongoing production testing. 1. SCOPE To present the results of a survey taken concerning future applications for high-temperatu

9、re electronics and sensors. 1.1 Purpose A survey was conducted to start collecting information needed to better identify how a common set of high-temperature components and component standards might meet the most market needs crossing industry boundaries. 2. APPLICABLE DOCUMENTS The following public

10、ations form a part of this document to the extent specified herein. The latest issue of SAE publications shall apply. The applicable issue of other publications shall be the issue in effect on the date of the purchase order. In the event of conflict between the text of this document and references c

11、ited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 2.1 Sandia National Laboratories Publications SAND2006-0091 has a complete list of survey responses. SAND2006-0091, Pr

12、inted April 2006Available to the public from U.S. Department of Commerce National Technical Information Service 5285 Port Royal Road Springfield, VA 22161 Copyright SAE International Provided by IHS under license with SAENot for ResaleNo reproduction or networking permitted without license from IHS-

13、,-,-SAE AIR5709 Page 2 of 18 3. STATEMENT OF PROBLEM 3.1 Existing Programs Programs within the U.S. DOE, U.S. DOD, and NASA are developing new high-temperature electronic components and sensors. These new components have commercial applications for: a. Deep drilling for fossil energy b. Geothermal p

14、ower production c. Combustion engine controls for both automotive and aircraftd. High-efficiency motor controls for hybrid/electric vehiclese. Improved controls for the U.S. electric power grid3.2 Survey Targets The survey targeted application designers in the aerospace, drilling and automotive indu

15、stries via email and direct polling at the October 2005 meeting of the SAE AE-7 (SAE International - Aerospace Electronics Chapter 7). Application engineers are concerned with design level issues. The majority of responses came from engineers within the aerospace industry.4. SURVEY PROCESS 4.1 Getti

16、ng the Information On April 4-5, 2005, the first joint meeting between the aerospace and drilling industry was held in Dayton, OH, hosted by the Air Force Research Laboratory at Wright-Patterson. NASA-Glenn, JPL, and the Army Research Laboratory also participated in the meeting. All of these organiz

17、ations share a common interest in the development of commercially available high-temperature electronic components and sensors. One of the outcomes of the meeting was an agreement to conduct an industry survey of high-temperature applications. This report covers the basic results of this survey.The

18、survey targeted application designers in the aerospace, drilling and automotive industries via email and direct polling at the October 2005 meeting of the SAE AE-7 (SAE International - Aerospace Electronics Chapter 7). Responses were given anonymously.This was the first survey of its type. Many of t

19、he questions offered individuals the opportunity to write-in a response. A copy of the survey is attached as an appendix to this report. A follow on survey with more targeted questions is recommended.4.2 Who Responded The first question of the survey asked: Please indicate what industry you work in.

20、 Please circle one or more. Below is a list of options and the numbers of circled responses. Aircraft Power - 15 Aircraft Engines - 9 Automotive - 2 Electric Power Grid - 2 Copyright SAE International Provided by IHS under license with SAENot for ResaleNo reproduction or networking permitted without

21、 license from IHS-,-,-SAE AIR5709 Page 3 of 18 Interstate Trucking - 0 Radiation Hard Systems - 5 Well Drilling and Exploration - 3 Well Logging - 3 Well Monitoring - 2 The survey attempted to reach application designers and not component producers. These responses came from 20% of those polled. The

22、 majority of those polled are engineers having attended HiTEC (High-Temperature Electronics Conference) and the October 2005 meeting of the SAE AE-7 (SAE International - Aerospace Electronics Chapter 7).Individuals were also asked about temperature of interest: Please circle the temperature range ne

23、eded by the application you listed as the most HT application benefiting your industry.There were four temperature ranges: a. 150 to 250 C - 10 responses b. 251 to 300 C - 8 responses c. 301 to 350 C - 2 responses d. 351 C and higher - 3 responses 5. COMMENTS TO SURVEY QUESTION RESPONSE There were a

24、 number of questions where the individual was given a chance to write-in a response. These comments are not easily tabulated in the form of a table. Each of the questions is listed below, along with the reasons for the question. General results of the question are suggested along with examples of ac

25、tual given answers. For a complete list of responses, see Section 7 of this document. 5.1 Survey Question 1: Component Wish List Respondents were given a chance fill in a table of most desired high-temperature components. The table had three columns: Most Desired HT Components, Estimated. Developmen

26、t Time near-term (1 to 2 years), mid-term (3 to 5 years), far-term (5 years), Estimated Volume for Your Application. Some noteworthy results. a. Number One Near-term Component needing development Drilling industry - 200 C high-density non-volatile Memory - 1000/year Aerospace - 65 to 300 C SiC Diode

27、 - 3000/year Copyright SAE International Provided by IHS under license with SAENot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SAE AIR5709 Page 4 of 18 b. Mid-to Far-Term Development - 16 or 32 bit microprocessor Automotive - 100 to 300K/year Aerospace - 50 per air

28、craft (50 to 100K/year) Drilling - 1000s c. Most Requested Components for Aerospace Industry Power Semiconductor Devices 200 to 300 C, Diodes, FETs, MOSFETS, IGBTs - in the 1000s/year Capacitors - 100 to 800 V, 10 F, low loss d. Packaging (200 to 300 C) - Drilling and Aerospace Printed wiring boards

29、, interconnects, insulation, potting materials, connectors, electrical feed-through, connectors Differences in the three industries also became apparent within component selections. a. Automotive industry generally high volume needed (100 000s/year) 1. Automotive industry felt development of all pro

30、ducts were far-term b. Aerospace industry indicated a greater need for Power Semiconductor Devices and Power Management Devices 1. Aerospace industry needs range from 1000s to 10 000s/year to 50 to 100/aircraft (50 to 100K/year) commercial 2. Aerospace industry perceived more mid- to far-term develo

31、pment times c. Drilling industry indicated greater need for Memory related devices and Sensors 1. Well industries perceived more near- to mid-term development times of key components 2. Well industries needs ranged from 100s to 1000s/year The drilling industry has the closest (only) near-term applic

32、ations, and is also the smallest in volume. The aerospace industry is next with near- to far-term applications with approximately 10 to 100 times the potential market. The automotive responses were far-term and relatively low volume by conventional automotive market standards. These results may be d

33、ue to only two responses from this industry. The overall conclusion of this survey identified the application with the most cross cutting industry support for high-temperature components was the need for power control electronics with a potential market 100K devices per year. Data acquisition was se

34、cond with a need for non-volatile memory (Flash, EEPROM) listed as components needing development.5.2 Survey Question 2 Please identify what one HT application would benefit your industry the most. If reasonable, please provide some of the necessary attributes needed for commercial success. Reasonin

35、g: This question was asked to help identify common applications and basic requirements. Responses can be grouped into two categories, power and data acquisition. There were 14 power applications given to 5 data acquisition. Most of the responses were power applications targeting power converters for

36、 both DC/DC and AC/DC. Among the power applications were two for high-temperature motor controls. Examples of responses are listed below.Copyright SAE International Provided by IHS under license with SAENot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SAE AIR5709 Pa

37、ge 5 of 18 Power Applications Response Examples: Power Converters (220 VAC and 440 VAC to 28 VDC) and Inverters (27 VDC to 115 VAC) Power Converters 4 to 350 kW Aircraft power electronics: voltages to 600 V, -55 to 300 C and capacitors with high efficiency and a 20 year life Aircraft Power Conversio

38、n: 10 to 100 A / 1000 V rectifiers and SCRs with 0.1 to 20 F / 600 V capacitors High efficiency power converters (250 to 300 C): Medium temp (150 to 200 C) highly reliable power converters Data Acquisition Response Examples: Sensor support electronics for HT well monitoring (250 C), data acquisition

39、, data reduction, memory, telemetry systems, batteries, DC/DC converters Sensors MTBF 20 000 h with high shock HT miniaturized combustion control system In general, the drilling industry people favored data acquisition applications. The aerospace industry favored power applications with needs for en

40、gine data acquisition control systems. 5.3 Survey Question 3 Please identify what one HT application “outside” of your industry would benefit your industry the most. Reasoning: This question was asked to encourage and gain insight for cross industry applications using the same high-temperature compo

41、nents. A few individuals responded by saying that they didnt know about high-temperature applications in other industries. Several answers indicated that some individuals didnt understand the question. Examples: Aircraft engine distributed control most closely matches the component selection we need

42、 down hole. The promise of larger (future) volumes of this industry could encourage vendors to supply the smaller quantities we need for down hole right now. Similarly, the testing and qualification that we do now helps provide reliability validation for the more critical upcoming aircraft applicati

43、ons. Manufacture of HT analog and digital signal conditioning integrated circuits HT power devices (high-voltage caps and power transistors) Solid State Power Controller used to replace circuit breakers and relays Clearly, there is room to improve the general cross industry understanding of high-tem

44、perature applications. There is a need to better identify industry requirements so that engineers within the aerospace, drilling and automotive industry can maximize the production volumes of high-temperature electronic components and sensors. Copyright SAE International Provided by IHS under licens

45、e with SAENot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SAE AIR5709 Page 6 of 18 5.4 Survey Question 4 From the list below, please circle 3 attributes that are the most important to the application you listed under question #2 above.Reasoning: This question was a

46、sked to generate a feel for reliability requirements versus system performance. There were 8 possible choices, a through h as illustrated in Table 1.TABLE 1 - SENSOR PERFORMANCE Choices Description # of Votes A Absolute sensor measurement accuracy 5 B Relative sensor measurement accuracy 3 C Expecte

47、d operating life time before falling outside of specification 12 D Expected operating life time before failing to function 19 E Temperature design margins 14 F Low supply current for battery operation 5 G High signal voltages for reduced EMI 2 H Accelerated life testing 7 Total 67 The two measuremen

48、t accuracy responses a and b only received 5 out of 67 votes. This indicates that most people didnt choose sensor performance at all. Most of the votes were used on reliability issues, option d, received the most votes, followed by option e. These attributes are closely related. In general, reliability issues are extremely important to the majority of our respondents. Most of the respondents come from the aircraft industry. So, reliability is going to be a major driving force in the creation of a high-te