REG NASA-LLIS-0773--2000 Lessons Learned Design Practice to Control Interference from Electrostatic Discharge (ESD).pdf
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1、Best Practices Entry: Best Practice Info:a71 Committee Approval Date: 2000-04-11a71 Center Point of Contact: JPLa71 Submitted by: Wilson HarkinsSubject: Design Practice to Control Interference from Electrostatic Discharge (ESD) Practice: Minimize the adverse effects of electrostatic discharge (ESD)
2、on spacecraft by implementing the following three design practices:1. Make all external surfaces of the spacecraft electrically conductive and grounded to the main structure.2. Provide all internal metallic elements and other conductive elements with an “ESD conductive“ path to the main structure.3.
3、 Enclose all sensitive circuitry in an electrically conductive enclosure- a “Faraday cage“.Abstract: Preferred Practice for Design from NASA Technical Memorandum 4322A, NASA Reliability Preferred Practices for Design and Test.Minimize the adverse effects of electrostatic discharge (ESD) on spacecraf
4、t by implementing the following three design practices:1. Make all external surfaces of the spacecraft electrically conductive and grounded to the main structure.2. Provide all internal metallic elements and other conductive elements with an “ESD conductive“ path to the main structure.3. Enclose all
5、 sensitive circuitry in an electrically conductive enclosure- a “Faraday cage“.The first two practices should dissipate most electric charges before a difference in potential can become high enough to cause an ESD. If a discharge occurs, the third practice lowers the coupling to sensitive circuits,
6、reducing the probability or severity of the interference.All external dielectric surfaces such as windows, radomes and solar panels are coated to make them slightly conductive without destroying their transparency to optical/IR/RF radiation. Cost and performance trade-offs must be made in order to s
7、elect suitable materials for each application. The conductive layer should be less than 109ohms per square and connected to structural ground.All internal metallic elements, greater than 3 cm2in area or 25 cm in length, including unused wires in cables, connectors, circuit board traces, spot shields
8、, and other conductive elements, have a conductive path to ground with a resistance less than 100 MW. Small metallic objects ( 3 cm2) may be ungrounded if grounding is not practical.Each metallic layer of thermal blankets is grounded to the main structure.All external metallic components are electri
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