NAVY MIL-D-81893 A-1978 DISPENSING SET COUNTERMEASURES CHAFF AN ALE-41《AN AQS-13B1对策和金属箔片配发设备》.pdf
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1、MIL-D-81893A (AS) i8 DECEMBER 1978 SUPERSEDING 17 MARCH 1975 MIL-D-81893 (AS) Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-D-81893A (AS) MIL-T-5422 Testing, Environmental, Aircraft Electronic Equip- ment MIL-C-6781 Control Panel; Aircraft Equi
2、pment, Rack or Console MIL-P-7788 Panels, Information, Integrally Illuminated MIL-M-7793 Meter, Time Totalizing MIL-A-8591 Airborne Stores and Associated Suspension Equipment; MIL-14-16878 Wire, Electrical, Insulated, High Temperature Mounted General Design Criteria for MIL-T-28303 Test Procedures;
3、Preproduction and Acceptance for MIL-N-18307 MIL-L-19538 Lacauer. Acrylic-nitrocellulose Gloss (For Aircraft Aircraft Electronic Equipment, Format for Nomenclature and Nameplates for Aeronautical Electronic and Associated Equipment c Us e) Naval Air Systems Command AR- 5 AR- 1 O STANDARDS Microelect
4、ronic Devices Used in Avionic Equipment, Procedures for Selection and Approval of Maintainability of Avionic Equipment and Systems, General Requirements for Military MIL-STD-105 MIL-STD-461 Interference Control Requirements, Aircraft MIL-STD-470 Maintainability Program Requirements MIL-STD-704 Elect
5、ric Power, Aircraft, Characteristics and Sampling Procedures and Tables for Inspection by Attributes Equipment Utilization of Reliability Tests, Exponential Distribution -:. MIL-STD-781 -, 1 a -I . - 1 I. - 1 % - - . - -_ _ %- - * -5r %? Provided by IHSNot for ResaleNo reproduction or networking per
6、mitted without license from IHS-,-,-MIL-STD-785 Reliability Program for Systems and Equipment MIL-STD-794 Parts and Equipment, Procedures for Packaging MIL-STD-810 Environmental Test Methods MIL-STD-2074 Failure Classification for Reliability Testing MS25212 Control Panel, Console Type Aircraft Equi
7、pment, Development and Production and Packing of (Supercedes AR-34) Basic Dimensions 2.1.1 Availability of Documents - When requesting specifications, standards, drawings, and publications, refer to both title and number. Copies of this specification and applicable specifications required by contrac
8、tors in connection with specific procurement functions may be obtained upon application to the Commanding Officer, Publications and Forms Center, Code 105, 5801 Tabor Avenue, Philadelphia, PA 19120. . 3. REQUIREMENTS 3.1 Preproduction - This specification makes provisions for preproduction testing.
9、3.2 Parts and Materials - In the selection of parts and materials, fulfillment of major design objectives shall be the prime consideration. In so doing, the following shall govern: (1) Microelectronic technology shall be considered and microelectronic items shall conform to requirements specified he
10、rein. Other parts and materials requirements shall conform to Specification MIL-E-5400 except when the use of such parts would conflict with interchangeability requirements for previously produced models of this equipment. Component parts shall be selected in the following order of precedence: (a) T
11、X, ER or other higher reliability parts. (b) Military standard parts, (c) Military Specification parts (not listed in book form standards). (d) Nonstandard parts previously approved for use in other designs. (e) Nonstandard parts. .3 Provided by IHSNot for ResaleNo reproduction or networking permitt
12、ed without license from IHS-,-,-MIL-D-8 18 9 3A (AS) (3) Nonrepairable subassemblies shall be used in accordance with Specification AR-10 and as outlined in Specification MIL-E-5400, (4) When previously produced models of this equipment did not use nonrepairable subassemblies, the design shall not b
13、e changed to employ nonrepairable assemblies without the approval of the procuring activity. 3-2.1 Nonstandard Parts and Material Approval - Approval for the use of nonstandard parts and materials (including electron tubes, tran- sistors and diodes) other than microelectronic devices shall be obtain
14、ed as outlined in Specification MIL-E-5400. approved as. outlined in AR-5. Microelectronic devices shall be 3.2.2 Microelectronic Modular Assemblies - When used, Micro- electronic Modular Assemblies shall meet the requirements of Specification AR-5. Conformal coatings, encapsulants, embedments or po
15、tting materiais used with modular assemblies containing.integrated circuits and discrete parts shall be easily removable without damage to the assembly. 3.2.3 Modules - The electronic portions of the equipment shall be functionally modularized in accordance with Specification AR-10. ical subassembli
16、es shall be modularized to the extent practical to facilitate production assembly and rework and to facilitate changes. The use of cements and welds or other forms of permanent bonds which will consume appreciable rework time shall be avoided in the design of repairable assemblies. blies that requir
17、e machining, lapping, or custom fitting shall be avoided. Where two units must be matched and used with each other, an assembly drawing shall be created that identifies this requirement. When adjustment or alignments must be made, components shall be pinned, slotted, or scribed to permit rapid reass
18、embly with minimum gauging and trial and error. Replace- ment of modules shall not require use of solder, cement or welding. design shall be such that reverse or improper assembly, mating or installation is impossible, Hard wired/chassis mounted components are undesirable and will not be used withou
19、t specific written approval of the procuring activity. Where possible, circuitry loops shall be contained on one shop replaceable assembly (SRA). In cases that the number of discrete components in a loop exceed the practical or physical space available on one SRA, mounting and packaging shall be in
20、a manner most adaptable to maintainability. able or disposable-on-failure subassemblies may be used and are preferred, providing such subassemblies are sufficiently reliable and inexpensive to justifythat concept, or where significant weight savings may be achieved, or where mechanical integration w
21、ith or modification of existing design required encapsulated subassemblies, or in the case of microwave energy devices. candidates shall be identified. Mechan- Assem- The Nonrepair- Items recommended as nonrepairable or disposable-on-failure Provided by IHSNot for ResaleNo reproduction or networking
22、 permitted without license from IHS-,-,-3.3 Design and Construction - The equipment shall conform with all the applicable requirements of Specification MIL-E-5400 for design, construction and workmanship, except as otherwise specified herein. “3.3.1 Total Weight - The total weight of the equipment e
23、xcluding cables shall be a minimum consistent with good design and shall not exceed 220 pounds empty. When fully loaded, the total gross weight may vary from 500 to 550 pounds maximum depending on chaff payload configuration or mix, Empty and full weight shall be clearly marked on Center Body Shell.
24、 *3.3.2 Reliability - The contractor shall conduct a reliability program in accordance with an approved AN/ALE-41 Reliability/Maintainability Program Plan of.paragraph 3.3.2.1. previously produced the equipment, the program plan previously used may be continued unless otherwise indicated in the cont
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