NAVY MIL-A-21001 A-1962 ARMING DEVICE MARK 6 MOD 0 (TORPEDO PRACTICE)《MARK 6 MOD 0 (练习鱼雷)解脱保险装置》.pdf
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1、53743 MILA-21OOlA(Wep) 10 October i962 Superseding 2 August 1957 M1JrA-21001( NOM) MIUTAIE SPECIFICATION AnMIN0 DEVICE MARK 6 BOD O (TORPEDO PRACTICE) This specification has been approved by the Bureau of Naval Weapons, Department of the Navy. 1. SCOPE 1.1 This specification governs the manufacture,
2、 assembly and preparation for delivery of Arming Device Mark 6 Mod O (Torpedo Practice) and the methods of inspection and tests upon which product acceptance will be based. Arming Device Mark 6 Mod O (Torpedo Practice) is an assembly adapted for receiving two eectroresponsive actuators which are shu
3、nted when the arming device is in a disarmed position and electrically connected in a firing circuit when the arming device is in an armed position. 2. APPLIcABmwcuMENTs 2.1 The following documents, of the issue in effect on date of invitation for bids, form a part of this specification. FEDERAL Fed
4、eral Test Method Standard No. 406 MILiTARY MIL-STD-I29 MIL-STD-105 Plastics: Method of Testing Marking for Shipment and Storage Sanpling Procedures and Tables for Inspection by Attribut es Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-A-2100lA(
5、 Wep) DRAWINGS BUREAU OF NAVAL WEAPONS LD 291742 291935 291936 Dwg 1387994 Arming Device Mark 6 Mod O Torpedo Practice Assembly (Empty) Preserved (Packaging) Condition Arming Device Mark 6 Mod O (Loaded) Shipping (Packing) Condition for 24 Arming Devices Mark 6 Mod O (Loaded) Contact Mount Assembly
6、fletaining Ring Spring Washer Safety Spring Arming Device Mark 6 Mod O Torpedo Practice Assembly (Empty) Safety Spring Releasing Tool (Copies of specifications, standards, drawings, and publications required #by contractors in, connection with specific procurement functions should be obtained from t
7、he procuring activity or as directed by the contracting officer. ) 3.1 General. 3.1il Wng Device Mark 6 Mod O (Torpedo Practice) shall be manufactured in accordance with LD 291742 and all documents listed thereon. 2 - iv Provided by IHSNot for ResaleNo reproduction or networking permitted without li
8、cense from IHS-,-,-flIL-A-23003A 33 M 9777706 0303373 2 a MIL-A-21091A(Wep) 3.1.2 production sample shall be required from the contractor as provided in 4.1.2. (Torpea-11 be comprised of the parts listed on IID 291742. 3.2.1 Cleanliness. Immediately prior to the assembly of the arming device, each c
9、omponent shall be free of dirt, dust, flux, oil, oxides, sulfides, or any other foreign matter that may impair assembly or sub- sequent functioning of the apparatus. Unless otherwise specified by the procuring agency a pre- 3.2 Inert assembl An assembly of Arming Device Mark 6 Mod O 3.2.2 Degree of
10、cure of plastic components. The plastic upper and lower contact mounts and plastic shutter shall be thoroughly cured and shall have an acetone extraction value of 5 percent maximum when tested in accordance with 4.5 I 3.1. 3.2.3 Soldering assembly. When soldering the contact fingers sub- assembly, t
11、he solder shall be confined to an area over and above the riveted portion of the pin and in no instance shall it be allowed to flow between the contact fingers in a manner that will prevent their acting as independent cantilever springs. contact fingers, the resistor leads shall be made mechanically
12、 secure prior to soldering. The contact fingers shall be tinned and soldered together at their interfaces as the resistor leads are soldered. shall not flow between the contact fingers. It is recommended that a suitable fixture be provided for properly orienting the resistors and the contact fingers
13、 of the contact fingers assembly during the performance of the soldering operation. Immediately after soldering, all flux shall be cleaned from the soldered and surrounding surfaces. An examination of the assembly shall indicate the absence of loose solder or such condition that could conceivably re
14、sult in a short or circuit failure . During assembly of the Solder 3.2.4 Fracture strength. The plastic shutter, when assembled within the contact mount ble the shutter to the contact mount assembly and rotate it between the shnt fingers, actuator. other recess of the shutter. Apply the test probes
15、of an ohmmeter to the leads from the Repeat this test with the same duimqy actuator inserted in the 4.5.3.7 .Contact mount assembly. This test is performed on the contact Apply the test probes of an ohmmeter (4.4.4) On the contact mount assembly apply the test mount assembly, Dwg 683562. to the two
16、terminal pins. 4-5.3.8 Dielectric test. probes of a megohmmeter (4.4.5) between either terminal pinand the rivets of the shunt fingers. Then assemble the shutter and contact mount assembly in the housing, without actuators and without the safety spring. Measure the insulation resistance between each
17、 terminal pin and the shutter shaft, and between each terminal pin andithe housing. 4.6 Preproduction an periodic production tests 4.6.1 Vibration. The mechanism shall be tested in two conditions, as *described below. (a) The first condition shall be with the arming device mounted rigidly to the vib
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