KS C IEC 60748-1-2002 Semiconductor devices－Integrated circuits－Part 1：General《半导体器件 集成电路 第1部分 总则》.pdf

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1、 KS C IEC 60748-1KSKSKSKSSKSKSKS KSKSKS SKSKS KSKS SKS KS 1：KS C IEC 60748-1 : 2002(2012 ) 2002 11 30 http:/www.kats.go.krC IEC 60748 1： 2002 : ( ) ( ) ( ) : (http:/www.standard.go.kr) ： ：2002 11 30 ：2012 12 31 2012-0854 ： ： ( 02-509-7294) (http:/www.kats.go.kr). 10 5 , . ICS 31.080.01 KS C IEC 1： 6

2、0748 1： 2002(2012 ) Semiconductor devices Integrated circuits Part 1： General 1984 IEC 60748 1 Semiconductor devices Integrated circuits Part 1： General . 1： IEC 60748 1. IEC 60748 IEC 60747 1 . 2. IEC 60748 IEC 60748 1, IEC 60748 2 . IEC 60748 2A . 2： IEC 60748 1 1. IEC 60748 1 IEC 60748 , . IEC 60

3、747 1 . ( (1) ). 2. IEC 60748 (1 ) , IEC 60748 2, IEC 60748 3 . 3. 3 8 . 3 8 ： 3 ： IEC 60748 2, IEC 60748 3 , ： , IEC 60747 1, , . 5 ： , IEC 60747 1, 5 , C IEC 60748 1： 2002 2 . 6 ： , , ( IEC 60747 1, 6 .). 7 ： , (Numbering System) . . 8 ： . 3： IEC 60748 2, IEC 60748 3 , , IEC 60747 1 3 . 4：, , IEC

4、60747 1, 4 . IEC 60747 1 1. 2. . , IEC 60747 1 4 . 1. 1.1 ( ) terminal(of a semiconductor device)( IEC 60747 1, 4, 3.1 ) . 1.2 ( ) electrode(of a semiconductor device)( IEC 60747 1, 4, 3.2 ) . 1.3 (blank terminal) ( ) , 1. NC( .) 2. , . 1.4 (nonusable terminal) NU . 1.5 (microelectronics) C IEC 6074

5、8 1： 2002 3 1.6 (integrated electronics) , 1.7 (latch up) . . 1.7.1 (latch up state) . 4 (parasitic four layer bipolar structure) . 1.7.2 (latch up) 1.7.3 () ICC(L), IDD(L) 1.7.4 ICC(L)min, IDD(L)min ( ) 1.7.5 () VCC(L), VDD(L) 1.7.6 (IXlatch, Ilatch) 1.7.7 (VXlatch, Vlatch) 1.7.8 (ICClatch, IDDlatc

6、h) 1.7.9 (VCClatch, VDDlatch) 2. 2.1 ( IEC 60747 1, 4, 4.1 ) 2.2 (microcircuit) / 2.3 (integrated circuit) . . 1. TC 47 . 2. , . , C IEC 60748 1： 2002 4 2.4 (semiconductor integrated circuit) 2.5 (single chip integrated circuit) ( ) “ ” . 2.6 (multi chip integrated circuit) ( ) “ ” . 2.7 (film integ

7、rated circuit) . 2.8 (hybrid integrated circuit) , ( , ) . 3. 3.1 IIK 3.2 IOK 3.3 VIK 3.4 VOK 4. 4.1 ( ) film(of a film integrated circuit) 4.2 ( ) thin film(of a film integrated circuit) 4.3 ( ) thick film(of a film integrated circuit) , ( ) 4.4 (plated film) / 4.5 (foil) 4.6 () (multilayer film ci

8、rcuit) 4.7 (protective coating) 4.8 (embedding) , (casting) (potting) (dip coating) (transfer moulding) 4.9 (vapour phase deposition technique) (source) , C IEC 60748 1： 2002 5 4.10 (sputtering) 4.11 (screen printing technique) ( ) , 4.12 ( ) substrate(of a film integrated circuit) (piece) 5. 5.1 (h

9、ybrid film integrated circuit) 5.2 (hybrid semiconductor integrated circuit) 5.3 (passive hybrid film integrated circuit) 5.4 (active hybrid film integrated circuit) 5.5 (thin film integrated circuit) , , . 5.6 (thick film integrated circuit) 5： , 1. IEC 60747 1, 5 2., 3. 4. . , . 2. . 2. 2.1 2.1.1

10、1 . . I O Q 1. . 2. , S P , . 2.1.2 2 . H . L . . 2.1.3 3( ) . C IEC 60748 1： 2002 6 A ( ) B ( ) 1. 1 . 2. , “max” “min” . , ( , , ) . 2.1.4 , . VOLB IILA 1 “A” “B” 2.2 2.2.1 1 , 1 . P D T 2.2.2 2 3 1 . , HL , LH . H L . , 1 . su (set up) C IEC 60748 1： 2002 7 h res (resolution) 2.2.4 (master slave

11、arrangements) , . , . 3. IEC 60748 3 6： , 1. IEC 60747 1, 6 1. . 2. , 2.1 IEC IEC 60747 1, 6 2. . 2.2 2.2.1 (MFIC) (UFB) . 1. IEC 60748 UFB . 2. UFB . 2.2.2 (UFB) . a) (UFB) , 1. / . 2. , . . UFB . , UFB . . C IEC 60748 1： 2002 8 b) (MFIC) , , “ ” . c) . d) . 2.2.3 MFIC 10. . MFIC MFIC UFB . 3. “” I

12、EC 60747 1, 6 3. . 4. , IEC 60747 1, 6 4. . 5. . , 65 , 55 , 40 , 25 , 10 , 0 , 25 , 55 , 70 , 85 , 100 , 125 , 150 , 175 , 200 65 , 150 , 175 200 . ADC/DAC ROM CPU I/O RAM&/ROM I/O I/O 2 C IEC 60748 1： 2002 9 6. 6.1 a) . ： 1.5 V, 5.0 V, 5.2 V(ECL ), 12 V, 15 V (I2L) . MOS ： 1.3 V, 1.5 V, 3.0 V, 3.3

13、 V, 5.0 V, 12 V, 15 V, 18 V, 24 V , . 4.0 V, 6.0 V, 9.0 V, 30 V, 48 V, 100 V , . b) . 1.3 V, 1.5 V, 3.0 V, 3.3 V, 4.0 V, 5.0 V, 6.0 V, 9.0 V, 12 V, 15 V, 18 V, 24 V, 30 V, 36 V, 48 V, 100 V c) (Interface circuit) 1.3 V, 1.5 V, 3.0 V, 3.3 V, 4.0 V, 5.0 V, 5.2 V(ECL ), 6.0 V, 12 V, 24 V, 30 V, 36 V, 4

14、8 V, 100 V 6.2 . 0.3 V, 5 %, 10 %, 20 % , . , . 7. , , IEC 60747 1, 6 7. . 8. (compliance) IEC 60747 1, 6 11. . 9. IEC 60747 1, 6 12. . 10. 10.1 10.1.1 . 10.1.2 10.1.2.1 , . 10.1.2.2 . 10.1.2.3 , , , , , . . , . , C IEC 60748 1： 2002 10 , , 10.1.2.4 , , IEC / . 10.1.2.5 , , , A/D . , . 10.2 . . 10.2

15、.1 / , / . , , ( ： , / , ). 10.2.2 (overall block diagram) . 10.2.3 . 10.2.4 . 10.2.5 . . , 3 , . . 10.2.6 , . ( , ) ( , ) 10.3 10.3.1 . . a) b) c) d) e) f) , , / . , . , . , , . . IEC IEC 60617 12 IEC 60617 13 . 10.3.2 ( , , / ). C IEC 60748 1： 2002 11 a) d) . a) b) c) / d) a) . , , (NC ), (NU ) . b) . , , , , , / / , , c) / , , / , / . d) 3 , , . 10.3.3 , . a) . .